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Laser cutting device and cutting method

A laser cutting and laser technology, which is applied in glass cutting devices, laser welding equipment, welding/welding/cutting items, etc., can solve the problems of ineffective cutting of thicker products and short focal depth of Gaussian beams, etc., to achieve effective cutting , the effect of expanding the scope of application

Active Publication Date: 2017-08-01
东莞市盛雄激光先进装备股份有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In view of this, the present invention provides a laser cutting device and its cutting method to solve the problem that the Gaussian beam emitted by the existing medium laser has a short focal depth and cannot effectively cut thicker products.

Method used

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  • Laser cutting device and cutting method
  • Laser cutting device and cutting method

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Embodiment Construction

[0056] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0057] An embodiment of the present invention provides a laser cutting device, such as figure 1 As shown, the laser cutting device includes a laser 10 , a beam shaping system 11 and a first condenser lens 12 .

[0058] Wherein, the laser 10 is used to emit laser light, and the laser light is a Gaussian beam;

[0059] The beam shaping system 11 is used to convert the Gaussian beam emitted by the laser 10 into a Bessel beam;

[0060] The first condenser lens 1...

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Abstract

The invention provides a laser cutting device and a cutting method. The laser cutting device comprises a laser, a light beam shaping system and a first collecting lens; the laser is a picosecond laser; the laser is used for emitting laser; the laser is a Gaussian beam; the light beam shaping system is used for converting the Gaussian beam to a Bessel beam; and the first collecting lens is used for focusing the Bessel beam to an area to be cut of samples to be cut, so that the area to be cut is precut by the Bessel beam. As the focused Bessel beam is the focused beam with longer focal depth, compared with the Gaussian beam, the Bessel beam can effectively cut the samples to be cut with greater thicknesses to widen the application range of the laser cutting device.

Description

technical field [0001] The present invention relates to the technical field of laser cutting, more specifically, to a laser cutting device and a cutting method thereof. Background technique [0002] Double-layer combined glass refers to double-layer glass that is bonded together by two single-layer glass through optical glue. It has been widely used in flat panel display, liquid crystal panel, vehicle display and smart wear and other fields. Because the double-layer combined glass is relatively thick, such as the overall thickness is greater than 2mm, therefore, in the prior art, it can only be cut by cutting with a knife wheel. [0003] However, due to the way of cutting with the cutter wheel, there are problems such as wide cutting path, waste of material, large chipping on the surface of the cut product, inability to cut special-shaped products, and large loss of the cutter wheel. Therefore, it is not conducive to the cutting and application of double-layer composite glas...

Claims

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Application Information

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IPC IPC(8): B23K26/38B23K26/064B23K26/046C03B33/02
CPCB23K26/046B23K26/0643B23K26/0648B23K26/0652B23K26/38B23K2103/54C03B33/0222
Inventor 陶雄兵韦超李光辉徐俊南李万朋
Owner 东莞市盛雄激光先进装备股份有限公司
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