Zero-taper laser cutting equipment and cutting method based on same

A laser cutting, taper-free technology, which is applied in laser welding equipment, welding equipment, metal processing equipment, etc., can solve the problem of large taper on the cutting edge of sapphire, and achieve the effect of long focal depth and high collimation accuracy

Active Publication Date: 2017-09-12
东莞市盛雄激光先进装备股份有限公司
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of this, the present invention provides a kind of taper-free laser cutting equipment and its cutting method, to solve the problem that the cutting edge taper of sapphire caused by the existing laser cutting equipment is relatively large

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  • Zero-taper laser cutting equipment and cutting method based on same
  • Zero-taper laser cutting equipment and cutting method based on same
  • Zero-taper laser cutting equipment and cutting method based on same

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Embodiment Construction

[0044] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0045] An embodiment of the present invention provides a taper-free laser cutting device, such as figure 1 As shown, the equipment includes a main frame 1, a base 2 fixed on the main frame 1, a feeding assembly 3 fixed on the base 2, an index feeding assembly 4, a plurality of receiving platforms 5, a first laser Cutting assembly 6 , second laser cutting assembly 7 , third laser cutting assembly 8 , flipping assembly (not shown in the figure) and blanking asse...

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Abstract

The invention provides zero-taper laser cutting equipment and a cutting method based on the same. The zero-taper laser cutting equipment comprises a material feeding component, an indexed material conveying component, multiple receiving tables, a first laser cutting component, a second laser cutting component, a third laser cutting component, a turn-over component and a material discharging component. After a material is fed by the material feeding component and is conveyed by the indexed material conveying component, the first laser cutting component adopts laser to erode an ink layer on the front surface of a sample to form light-transmitting bars; the second laser cutting component adopts a Bessel beam to cut the rear surface of the sample for the first time; the third laser cutting component adopts laser to cut the rear surface of the sample for the second time to cut off and separate the sample; and then the cut sample is conveyed to a material storage box by the material discharging component. The focus beam of the Bessel beam is not a V-shaped beam, but a small-diameter, long-focal-depth and high-alignment-accuracy focus beam, so that the edge taper of the sample which is cut by adopting the Bessel beam is small or even zero, and application of the cut sample is more facilitated.

Description

technical field [0001] The invention relates to the technical field of laser cutting, and more specifically, to a non-taper laser cutting device and a cutting method thereof. Background technique [0002] As a high-temperature, wear-resistant, and corrosion-resistant high-hardness transparent material, sapphire has been widely used in consumer electronics industries such as flat panel displays, smartphone screens, and camera protection lenses. Due to the high Mohs hardness of sapphire, which is second only to diamond, when processing sapphire with a traditional cutter wheel, the edge of the sapphire will be greatly chipped, and the wear loss of the cutter wheel will also be large. [0003] Although a kind of equipment of laser cutting sapphire is disclosed in the prior art, because the laser beam output by the laser in the equipment is a Gaussian beam, and the Gaussian beam has the characteristic that the energy distribution center is large and the edge is small, that is, th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K26/354B23K26/70B23K26/06
Inventor 陶雄兵赖程飞
Owner 东莞市盛雄激光先进装备股份有限公司
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