Cutting device and method for composite substrate
A composite substrate and cutting device technology, applied in welding equipment, laser welding equipment, metal processing equipment, etc., can solve the problems of large cutting edge taper, large ablation width of ink coating, etc., to achieve small edge taper, reduce The effect of ablation width and depth of focus
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[0058] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.
[0059] The embodiment of the present invention provides a cutting device for a composite substrate, such as figure 2 As shown, the composite substrate 2 includes a transparent substrate 20 and an ink coating 21 on the surface of the transparent substrate 20. The cutting device includes a first laser 30 and a first scanning galvanometer 31 sequentially arranged on the light path of the first laser 30. And the first field lens 32, the seco...
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