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A kind of laser cutting device and cutting method

A laser cutting and laser technology, used in laser welding equipment, metal processing equipment, welding equipment, etc., can solve the problem of large taper on the edge of sapphire cutting

Active Publication Date: 2019-11-26
东莞市盛雄激光先进装备股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In view of this, the present invention provides a laser cutting device and a cutting method to solve the problem that the cutting edge of sapphire has a large taper caused by the existing laser cutting method

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  • A kind of laser cutting device and cutting method
  • A kind of laser cutting device and cutting method
  • A kind of laser cutting device and cutting method

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Embodiment Construction

[0049] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0050] An embodiment of the present invention provides a laser cutting device, such as figure 2 As shown, the laser cutting device includes a first laser 20 , and a beam shaping system 21 and a first condenser lens 22 sequentially arranged on the light output path of the first laser 20 .

[0051] Wherein, the first laser 20 is used to emit a first laser, and the first laser is a Gaussian beam. The beam shaping system 21 is used to convert the Gaussian beam e...

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Abstract

The invention provides a laser cutting device and a cutting method. The laser cutting device comprises a first laser unit, a light beam shaping system and a first collecting lens, wherein the light beam shaping system and the first collecting lens are sequentially arranged on the light emitting path of the first laser unit, and the first laser unit is a picosecond laser unit. The first laser unit is used for emitting first lasers which are Gauss beams. The light beam shaping system is used for converting the Gauss beams into Bessel beams. The first collecting lens is used for focusing the Bessel beams to a to-be-cut area of a to-be-cut sample so that the Bessel beams can precut the to-be-cut area. Due to the fact that focused beams of the Bessel beams are the focused beams which are small in diameter, long in focal depth and high in alignment accuracy instead of V-shaped light beams, compared with the Gauss beams, the edge taper of the to-be-cut sample cut by the Bessel beams is small, and application of the to-be-cut sample after cutting is more facilitated.

Description

technical field [0001] The present invention relates to the technical field of laser cutting, and more specifically, to a laser cutting device and a cutting method. Background technique [0002] As a high-temperature, wear-resistant, and corrosion-resistant high-hardness transparent material, sapphire has been widely used in consumer electronics industries such as flat panel displays, smartphone screens, and camera protection lenses. Due to the high Mohs hardness of sapphire, which is second only to diamond, when processing sapphire with a traditional cutter wheel, the edge of the sapphire will be greatly chipped, and the wear loss of the cutter wheel will also be large. [0003] Based on this, a method for laser cutting sapphire is disclosed in the prior art, such as figure 1 As shown, the laser beam output by the picosecond laser 10 is reflected by the high-speed displacement scanning galvanometer 11, then focused on the surface of the sapphire 13 by the flat field mirror...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/38B23K26/064
CPCB23K26/064B23K26/0652B23K26/38
Inventor 陶雄兵韦超李光辉徐俊南李万朋
Owner 东莞市盛雄激光先进装备股份有限公司
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