A kind of non-taper laser cutting equipment and its cutting method

Abstract

The invention provides zero-taper laser cutting equipment and a cutting method based on the same. The zero-taper laser cutting equipment comprises a material feeding component, an indexed material conveying component, multiple receiving tables, a first laser cutting component, a second laser cutting component, a third laser cutting component, a turn-over component and a material discharging component. After a material is fed by the material feeding component and is conveyed by the indexed material conveying component, the first laser cutting component adopts laser to erode an ink layer on the front surface of a sample to form light-transmitting bars; the second laser cutting component adopts a Bessel beam to cut the rear surface of the sample for the first time; the third laser cutting component adopts laser to cut the rear surface of the sample for the second time to cut off and separate the sample; and then the cut sample is conveyed to a material storage box by the material discharging component. The focus beam of the Bessel beam is not a V-shaped beam, but a small-diameter, long-focal-depth and high-alignment-accuracy focus beam, so that the edge taper of the sample which is cut by adopting the Bessel beam is small or even zero, and application of the cut sample is more facilitated.

Description

technical field [0001] The invention relates to the technical field of laser cutting, and more specifically, to a non-taper laser cutting device and a cutting method thereof. Background technique [0002] As a high-temperature, wear-resistant, and corrosion-resistant high-hardness transparent material, sapphire has been widely used in consumer electronics industries such as flat panel displays, smartphone screens, and camera protection lenses. Due to the high Mohs hardness of sapphire, which is second only to diamond, when processing sapphire with a traditional cutter wheel, the edge of the sapphire will be greatly chipped, and the wear loss of the cutter wheel will also be large. [0003] Although a kind of equipment of laser cutting sapphire is disclosed in the prior art, because the laser beam output by the laser in the equipment is a Gaussian beam, and the Gaussian beam has the characteristic that the energy distribution center is large and the edge is small, that is, th...

AI Technical Summary

Problems solved by technology

[0004] In view of this, the present invention provides a kind of taper-free laser cutting equipment and its cutting method, to solve the problem that the cutting edge taper of sapphire caused by the existing laser cutting equipment is relatively large

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