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Combined machining system utilizing ultrashort pulse lasers

An ultra-short pulse laser and composite processing technology, which is used in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problem of not being able to take into account accuracy and efficiency at the same time, achieve high processing accuracy, improve processing accuracy, and eliminate cut surface burrs Effect

Inactive Publication Date: 2017-11-07
BEIJING CHANGCHENG INST OF METROLOGY & MEASUREMENT AVIATION IND CORP OF CHINA
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Problems solved by technology

[0005] The purpose of the present invention is to solve the problem that both precision and efficiency cannot be taken into account in the current fine processing process, and propose a composite processing system using ultrashort pulse laser, which can improve processing accuracy, processing scale and processing efficiency at the same time

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  • Combined machining system utilizing ultrashort pulse lasers
  • Combined machining system utilizing ultrashort pulse lasers
  • Combined machining system utilizing ultrashort pulse lasers

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Embodiment Construction

[0021] The present invention will be further described below in conjunction with the embodiments and accompanying drawings.

[0022] A compound processing system using ultrashort pulse laser of the present invention is shown in the figure figure 1 As shown, the illumination light emitted by the illumination source 1 passes through the dichroic prism 2 and irradiates to the first dichroic mirror 3, and the illumination light sequentially passes through the first dichroic mirror 3 and the second dichroic mirror 4, and then passes through the focusing lens 5 to irradiate on the fixed two-dimensional moving Processed sample 8 on stage 7.

[0023] The illuminating light reflected back from the surface of the processed sample 6 is reflected to the CCD image detector 12 through the second dichroic mirror 4, the first dichroic mirror 3, and the dichroic prism 2, and is used to monitor the microstructure of the processed sample surface. The image displayed on the sample surface is use...

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Abstract

The invention relates to a combined machining system utilizing ultrashort pulse lasers, and belongs to the technical field of precision machining combining ultrafast laser machining and traditional laser machining. The combined machining system is mainly composed of a lighting light source, a beam splitter prism, a CCD image detector, a femtosecond laser, an annular aperture diffraction grating, a first dichroic mirror, a picosecond laser, a second dichroic mirror, a focusing lens, a two-dimensional moving table and a microcomputer control system. The combined machining system has the advantages that the advantage of high femtosecond laser machining precision and the advantages of high energy density and efficiency of picosecond laser machining are combined, the requirements for high efficiency and high precision in the laser machining process can be met simultaneously, and the combined machining system can be widely applied to the fields of laser drilling with the high depth-diameter ratio, fine machining of key parts of the aerospace field, and micro / nano sensor and microstructure manufacturing.

Description

technical field [0001] The invention relates to a composite processing system using ultrashort pulse laser, and belongs to the technical field of fine processing combining ultrafast laser and traditional laser processing. Background technique [0002] With its advantages of monochromaticity, good coherence and strong directionality, laser plays an important role in processing and measurement. At present, when the workpiece is processed by ordinary long-pulse laser processing technology in the rapid prototyping manufacturing process, the heat on the workpiece will spread outward from the laser focus, making the size of the melting area much larger than the size of the laser focus point. Due to thermal diffusion and shock waves The influence of various effects such as laser is easy to cause influence and thermal damage to the surrounding materials. In the process of laser rapid processing and forming, the surface of the workpiece to be processed will be rough, and the processi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K26/064B23K26/046
CPCB23K26/046B23K26/0648B23K26/0652B23K26/38
Inventor 武腾飞赵春播张磊梁志国邢帅夏传青
Owner BEIJING CHANGCHENG INST OF METROLOGY & MEASUREMENT AVIATION IND CORP OF CHINA
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