Disclosed herein is an insulating resin composition for a printed circuit board, including 40 to 70 wt % of a liquid crystal oligomer shown in formula 1, 10 to 30 wt % of an epoxy resin, 10 to 30 wt % of a cyanate-based resin, and 0.1 to 0.5 wt % of a curing catalyst, and a printed circuit board including the same.
According to an exemplary embodiment of the present invention, the printed circuit board has electric, thermal, and mechanical stabilities even though the printed circuit board is reduced in weight, thickness, and size. Further, a stable driving property is ensured, dielectricity is low, and attachment strength, chemical resistance, and warpage property are excellent during a board process in the related art.