175results about How to "Manufactured using" patented technology

A method for forming a layer comprising SiOCN on a substrate is disclosed. An exemplary method includes thermally depositing the layer comprising SiOCN on a surface of the substrate. The layer comprising SiOCN can be used for various applications, including spacers, etch stop layers, and etch resistant layers.

A lightweight, high-strength proppant is disclosed, comprising the formation of finely dispersed ceramic precursors and sintering at low temperatures, causing the formation and retention of mesopores and micropores in pelletized ceramic. A method of manufacturing such a proppant is also disclosed, comprising the steps of manufacturing finely divided ceramic precursors and additives using grinding, milling, and preferably sol-gel processes, and dispersing the finely divided ceramic precursors and additives in a liquid, preferably water. The dispersion has a viscosity profile, which permits the shaping of spheres using conventional pelletizing techniques. Drying of the pellets and sintering at temperatures below 1,400.degrees. C. forms and retains mesopores and micropores in the ceramic. Preferred total pore volumes range from 0.05 to 0.7 cm.sup.3/g. The pelletized and porous ceramic is useful as lightweight and high-strength proppants.

The present invention relates to chemical compounds having a general formula I

wherein A, B, D, E, G, H^1-5 and R^1-4 are defined herein, and synthetic intermediates, which are capable of modulating various protein kinase receptor enzymes and, thereby, influencing various disease states and conditions related to the activities of these kinases. For example, the compounds are capable of modulating kinase enzymes thereby influencing the process of angiogenesis and treating angiogenesis-related diseases and other poliferative disorders, including cancer and inflammation. The invention also includes pharmaceutical compositions, including the compounds, and methods of treating disease states related to the activity of protein kinases.

An object of the present invention is to provide a carbazole derivative which is useful in manufacturing a substance having resistance to oxidation. Another object is to provide a carbazole derivative which is useful in manufacturing a novel material with high reliability. Still another object is to provide a material for a light emitting element with high reliability. The present invention is a carbazole derivative represented by the following general formula (1) (where each of Ar¹ and Ar² represents an aryl group having 6 to 14 carbon atoms which may include a substitute, Ar¹ and Ar² may be either the same or different, and R in the formula represents hydrogen or an alkyl group having 1 to 4 carbon atoms). In addition, the present invention is a material for a light emitting element which includes a carbazole derivative represented by the following general formula (1) as a substituent.

A precursor yarn or thread is made by passing a central element, e.g., a filament, a tow, or a flat member, through a bath of a binder, such as a low-temperature hot-melt adhesive, and aqueous urethane, or an acrylic material, with which is mixed a quantity of hard-shelled microspheres which expand when heated to a higher temperature. This is then covered by a sheath, e.g, of PVC, polyurethane, polyester, acrylic resin, polycarbonate, polypropylene, or polyethylene in a second bath. When this product is heated to a transition temperature which is characteristic of the microspheres chosen, the microspheres expand, swelling the sheath. Such a precursor could be woven into a fabric and then heated, so that as the yarn expands the fabric mesh becomes tighter, reducing its porosity. This would be useful as a yarn in making papermaker's felts. Heat-expansible threads made similarly would be useful in manufacture of shoes, sails, tents, clothing and other items where porosity is undesirable; that is, the product could be sewn together using the thread of the invention and then heat-treated, causing the thread to expand, sealing the holes made in sewing. Such threads would also be useful for decorative purposes, e.g., as embroidery yarns, and likely for other purposes. The yarns of the invention can also be disposed in a desired position and infused with a hardening resin while heat is applied to cause the microspheres to expand, forming a lightweight and stiff composite structure.

The present invention is directed towards a method of purification of chloroolefins having 3 carbons and to a method to provide stable compositions of chloroolefins having 3 carbons. The chloroolefins are purified via the use of a solid absorbents for the removal of decomposition product such as phosgene and/or phosgene precursory from the reaction of the chloroolefins with oxygen. The chloroolefins stabilized against an increase of the phosgene level via the addition of inhibitors to the chloroolefins.

To provide graphene oxide that has high dispersibility and is easily reduced. To provide graphene with high electron conductivity. To provide a storage battery electrode including an active material layer with high electric conductivity and a manufacturing method thereof. To provide a storage battery with increased discharge capacity. A method for manufacturing a storage battery electrode that is to be provided includes a step of dispersing graphene oxide into a solution containing alcohol or acid, a step of heating the graphene oxide dispersed into the solution, and a step or reducing the graphene oxide.

To provide a semiconductor device that can be manufactured using a simple process without ensuring a high embedding property; and a manufacturing method of the device. In the manufacturing method of the semiconductor device according to the invention, a semiconductor substrate having a configuration obtained by stacking a support substrate, a buried insulating film, and a semiconductor layer in order of mention is prepared first. Then, an element having a conductive portion is completed over the main surface of the semiconductor layer. A trench encompassing the element in a planar view and reaching the buried insulating film from the main surface of the semiconductor layer is formed. A first insulating film (interlayer insulating film) is formed over the element and in the trench to cover the element and form an air gap in the trench, respectively. Then, a contact hole reaching the conductive portion of the element is formed in the first insulating film.

A chip resistor (A1) comprises a first insulation layer (2A) covering the regions between a plurality of electrodes (3) on a rear surface (10a) of a resistor (1), and a second insulation layer covering a pair of side faces of the resistor (1). Inadvertent adhesion of solder to an improper part of the resistor (1) can thereby be eliminated. A solder layer (4) is preferably formed on a pair of end faces (10d) of the resistor (1). In so doing, a solder fillet can be formed appropriately.

A method of making a granulation comprising the steps of (a) combining sucralose, a polar solvent, a wettable material and an active agent, thereby forming a mixture; and (b) drying the mixture, thereby forming the granulation.

Provided are compositions suitable for use in forming a flexible optical waveguide. The compositions include a polymer, having units of the formula (RSiO_1.5), wherein R is a substituted or unsubstituted organic group, and a plurality of functional end groups. A first component is provided for altering the solubility of the composition in a dried state upon activation. A second component contains a plurality of functional groups chosen from hydroxy, amino, thiol, sulphonate ester, carboxylate ester, silyl ester, anhydride, aziridine, methylolmethyl, silyl ether, and combinations thereof. The second component is present in an effective amount to improve flexibility of the composition in a dried state before and after activation. Also provided are flexible optical waveguides, methods of forming flexible optical waveguides and electronic devices that include a flexible optical waveguide.

A polymer composition includes a first component being a hydroxy-functional polymer, a second component being a natural polymer and a third component being a thermoplastic polyester. The first component, second component and third component are compounded to form a polymer composition.

An aqueous adhesive composition with good release properties. A preferred embodiment comprises sodium lauryl sulfate and a modified tapioca dextrin.

Provided is a new and better solution to the problems associated with the premature softening of PLA filaments in the additive manufacturing of three dimensional articles. It is based upon the finding that poly (lactic acid) filaments with high crystallinity offer much better resistance to heat-induced softening. The crystalline poly (lactic acid) filament can accordingly be used in the additive manufacturing of three dimensional articles without encountering the problems associated with premature softening, such as poor quality and printer jamming. The crystalline poly (lactic acid) filaments can also be used in additive manufacturing of three dimensional articles without compromising the quality of the ultimate product, reducing printing speed, increasing cost, or leading to increased printer complexity. It more specifically discloses a filament for use in three-dimensional printing which is comprised of crystalized poly (lactic acid), wherein said filament has a diameter which is within the range of 1.65 mm to 1.85 mm.

Disclosed is a curable composition having a low CTE. In one embodiment, a curable composition is disclosed that comprises (i) a binder comprising at least one epoxy compound of the structure:

X—((CH₂)_m—(N)—((CH₂)_n-(Z))₂)_p

wherein X is an aromatic ring or a six membered cycloaliphatic ring, m is from about 0 to about 2, n is from about 1 to about 3, Z is an epoxy group of empirical formula: C₂H₃O, p is a number from about 2 to about 3, and (ii) a cross-linking agent comprising at least one polyamine. This curable composition is characterized by a CTE of no more than 60 ppm/° C. when cured for a time of from about 20 to about 60 minutes at temperature of from about 100 to 240° C. Also disclosed are methods of making integrated circuits and integrated circuits made there from, especially flip chips.