Inductive coupling coil and plasma processing device adopting same

An inductively coupled coil and coil winding technology, applied in the field of microelectronics, can solve the problems of slow processing of the central part of the wafer processing/processing process, uneven processing/processing results, and difficulty in obtaining plasma, and achieve uniform processing/processing results. The effect of uniform plasma density distribution and easy conjugate matching
CN101640091AActive Publication Date: 2010-02-03BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Patent Information

Authority / Receiving Office
CN ยท China
Patent Type
Applications(China)
Current Assignee / Owner
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
Publication Date
2010-02-03

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Abstract

The invention provides an inductive coupling coil. The coil comprises an even number of coil windings, wherein the coil windings are arranged in pairs; two coil windings in each pair of the coil windings have the same shape and are connected in parallel with each other, the input end of one coil winding is positioned in the center of the inductive coupling coil, while the output end is positionedon the edge of the inductive coupling coil and is connected in series with a reactance module; the input end of the other coil winding is positioned on the edge of the inductive coupling coil, while the output end is positioned in the center of the inductive coupling coil and is connected in series with the reactance module. Furthermore, the invention also provides a plasma processing device adopting the inductive coupling coil. The inductive coupling coil and the plasma processing device can easily realize conjugate match of impedance so as to improve the absorption efficiency of power, and ensure density distribution of generated plasma to be more evenly, so that manufacturing / processing results of a processed workpiece are more evenly.
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Description

technical field

[0001] The present invention relates to the field of microelectronic technology, in particular to an inductively coupled coil and a plasma processing device using the inductively coupled coil. Background technique

[0002] With the rapid development of electronic technology, people have higher and higher requirements for the integration of integrated circuits, which requires companies that produce integrated circuits to continuously improve the processing / processing capabilities of semiconductor devices. At present, in the field of processing / handling of semiconductor devices, especially in the manufacturing process of IC (Integrated circuit, integrated circuit) or MEMS (Micro Electromechanical System, microelectromechanical system) devices, it is often necessary to use such methods as plasma etching, Plasma processing technology for deposition or other processes, and these technologies are usually realized by means of plasma processing devices such as plasma...

Claims

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