470results about How to "Suppression of deformation" patented technology

In the present invention, a thin film transistor is formed on a plastic film substrate (1) having anisotropy of thermal shrinkage rate or coefficient of thermal expansion in in-plane directions of the substrate. A channel is formed such thatthe direction (7) in which the thermal shrinkage rate or the coefficient of thermal expansion of the substrate is largest is nonparallel tothe direction (8) of a current flowing through the channel of the thin film transistor. Then, a thin film transistor having stable and uniform electrical characteristics, which is formed on the plastic film substrate, is provided.

A container closure has a top panel wall, and an annular seal piece and an annular contact piece are integrally formed in an outer peripheral edge portion of an inner surface of the top panel wall. The annular seal piece is of such a shape as to be deflected radially outwardly upon contact with a cylindrical outer peripheral surface of a mouth-and-neck portion of a container. The annular contact piece is brought into contact with an annular boundary surface extending from an annular top surface to an annular outer peripheral surface of the mouth-and-neck portion arcuately in a sectional view. An annular thin-walled region positioned radially inwardly of the annular seal piece and the annular contact piece are further formed in the outer peripheral edge portion of the inner surface of the top panel wall.

A coated hard metal for a cutting tool is excellent in wear resistance and chipping resistance. The coated hard metal includes a hard coating layer on a surface of a base material of cemented carbide or cermet. The hard coating layer includes an inner layer (2) on the base material (1), an intermediate layer (3) on the inner layer (2) and an outer layer (4) on the intermediate layer (3). The inner layer (2) consists of a carbide, a nitride, a carbo-nitride, a carbo-oxide, a carbonitrogen oxide or a boronitride of Ti. The intermediate layer (3) consists of Al2O3 or ZrO2. The outer layer (4) consists of a carbide, a nitride, a carbo-nitride, a carbo-oxide, a carbonitrogen oxide or a boronitride of Ti. The thickness of the inner layer (2) is 0.1 to 5 mum, the thickness of the intermediate layer (3) is 5 to 50 mum in the case of it being an Al2O3 layer and 0.5 to 20 mum in the case of it being a ZrO2 layer, and the thickness of the outer layer (4) is 5 to 100 mum.

A capacitive touch sensor laminate for use in a display panel device includes: a dielectric central substrate structure made of a transparent resin material and formed to have flat surfaces, respectively, on opposite sides thereof; a at least one-layer structured coat layer made of a transparent material, formed on each of the flat surfaces, and including at least one refractive index adjusting layer for suppressing visibility of an electrode pattern formed by the transparent electrically conductive layer; and a transparent electrically conductive layer formed on and in adjacent relation to the coat layer. The at least one-layer structured coat layers formed on respective ones of the flat surfaces are configured such that thicknesses of corresponding layers therein on respective opposite sides of the dielectric central substrate structure are set to allow the corresponding layers to become mutually symmetrical across the dielectric central substrate structure.

A less-deformable resin-sealed electronic apparatus of high reliability capable of increasing the robustness (long life-time) of soldered portions of a power semiconductor device for use in internal combustion engines while increasing the physical stiffness of an overall apparatus structure for achieving enhanced resistance to flexure or bending stresses is provided. A hybrid IC substrate 2 and power semiconductor device 3 are mounted on a metallic heat sink 1. The power semiconductor device 3 is coupled and contacted with the heat sink 1 by use of an Sn-Sb alloy-based solder material 4. The power semiconductor device 3 and hybrid IC substrate 2 plus heat sink 1 as well as input/output terminals 6-1 to 6-3 are embedded in a package 7 except for part of the input/output terminals, which package is made of epoxy at 70 to 90 weight percent (%) of an inorganic loading or filler material as machined by transfer mold techniques.

A polishing method is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. A method of polishing a substrate by a polishing apparatus includes a polishing table (100) having a polishing surface, a top ring (1) for holding a substrate and pressing the substrate against the polishing surface, and a vertically movable mechanism (24) for moving the top ring (1) in a vertical direction. The top ring (1) is moved to a first height before the substrate is pressed against the polishing surface, and then the top ring (1) is moved to a second height after the substrate is pressed against the polishing surface.

An optical fiber holder 1B is an optical fiber holder for holding a plurality of optical fibers in line, and includes a base member 20 with a plurality of parallel positioning grooves 90 for positioning and aligning the plurality of optical fibers, and a lid member 32 adapted to cover the plurality of positioning grooves 90 and to fix the plurality of optical fibers, arranged in the positioning grooves 90, by pressing against the bottom portions of the positioning grooves 90. The lid member 32 has small projections 102 on its portion which comes into contact with the optical fibers.

This apparatus includes: a sun gear having external teeth; planetary gears, each having external teeth and configured to be meshed with the sun gear; planetary shafts, each being a rotation shaft of the planetary gear; a ring gear having internal teeth and configured to be meshed with the planetary gears; and a planetary carrier including an annular base plate and an annular back plate. The planetary carrier supports the planetary shafts between the annular base plate and the annular back plate and determines a relative position between planetary gears. The annular base plate is integrally formed with one end of the planetary shaft to support the one end. The annular back plate supports the other end of the planetary shaft. At least one of the planetary shaft and the planetary carrier has lower stiffness in its part adjacent to the one end of the planetary shaft than stiffness of its part adjacent to the other end thereof.

A microwave firing furnace comprises microwave heating means and a furnace chamber for holding a material to be fired containing an organic binder. A carrier gas introduction pipe introduces a carrier gas that contains oxygen at a concentration lower than that of the air to suppress the burning of the organic binder contained in the material being fired.

In a sliding contact chain guide of the kind used in the timing transmission of an internal combustion engine, the back of the guide shoe, which engages a metal guide base, is formed with two, spaced longitudinal ribs, having between them a set of ribs formed in a lattice. The longitudinal ribs are wider than the ribs of the lattice.

A bearing structure that reduces the relative sliding speed of a sealing ring and a contact surface and suppresses relative deformation due to a temperature difference of inner and outer rings is provided. A rolling member is disposed inside a space formed between an outer ring and an inner ring, the outer ring or the inner ring rotating relatively via the rolling element, wherein a sliding section of the surface of the rolling member and the inner surface of the space is lubricated with a lubricant supplied into the space, and a sealing ring attached to a supporter supporting the rolling element seals an opening of the space at an end section in the axial direction.

The invention discloses a synchronous self-locking pneumatic adaptive fixture used for the machining of annular thin-walled parts, belonging to the technical field of mechanical machining. The synchronous self-locking pneumatic adaptive fixture includes a zero point positioning system, a base body, a plurality of pressure plate mechanism assemblies, a plurality of columns, a plurality of support mechanism assemblies and a plurality of adaptive support body assemblies. Among them, the pressure plate mechanism assemblies complete the axial compression of the workpiece through the lever force increasing mechanisms and the orthogonal self-locking mechanisms. And the support mechanism assemblies complete the radial support of the workpiece through the rod slider mechanisms and the orthogonal self-locking mechanisms. The invention not only has high clamping efficiency and good stability, but also can ensure the reliable clamping and safe machining of the workpiece when the air source is disconnected.

A structure member is used wherein a circuit board is connected to a solid-state image pickup element and placed between a portion of the structure member to which the solid-state image pickup element is attached, and another portion to which a light-transmitting member is attached, and the circuit board is sealed integrally into the structure member. The solid-state image pickup element is attached to a through-opening portion 1C, and a light-transmitting member is attached so as to cover the through-opening portion 1C with being separated from the solid-state image pickup element by a predetermined distance. In a process of molding the structure member, the circuit board is integrally molded, whereby the manpower can be reduced, and the structures of the attaching portions can be simplified to miniaturize the device.

Pressure detecting apparatus includes: a housing; a pipe extending from one end of the housing and having an elongated shape; and a pressure sensitive element for detecting pressure and outputting a signal corresponding to the pressure. The pipe includes a top end capable of receiving the pressure. The pressure sensitive element is disposed on the top end of the pipe. The housing includes a connector for retrieving the signal from the pressure sensitive element. The pipe further includes a wiring member disposed inside the pipe so that the wiring member connects between the pressure sensitive element and connector electrically.

Provided is a cleaning blade formed of an elastic blade and configured to abut on the surface of a cleaning target member, which allows a leading end edge portion of the elastic blade to move on the surface thereof, to remove powder from the surface of the cleaning target member. A blade surface of the elastic blade, which has the leading end edge portion of the elastic blade on one side thereof and faces the surface of the cleaning target member, has a Martens hardness of 1.2 N/mm² or greater when it is indented by 5 μm at a location that is 20 μm away from the leading end edge portion, a Martens hardness of 1 N/mm² or less when it is indented by 20 μm at the location, and an elastic power of 70% or greater when it is indented by 5 μm at the location.

The truck tire of the invention allows the endurance of an ordianry tire not to be damaged and helps to improve the wearing resistance. A tire bead is provided with a first tire bead reinforcing cord layer, a second tire bead reinforcing cord layer and an anti-wearing rubber layer. The first tire bead reinforcing cord layer is U-shaped for connecting an internal portion and an external portion via a bottom portion, wherein the internal portion is arranged along the internal side of the cord main body of a tire body, and the external portion is arranged along the external side of the cord returning portion of the tire body. From an internal end clamped between the internal portion and the cord main body, the second tire bead reinforcing cord layer extends toward an radial external side beyond the internal portion along the cord main body. The anti-wearing rubber layer comprises a rubber sheet which is 0.5-1.5mm in thickness, has a complex modulus of 6.0-10.0MPa, and is arranged between a tire body cord and a tire bead core along the tire body cord. The difference between the height of the external end of the second tire bead reinforcing cord layer and the height of the external end of the cord returning portion is 5-25mm. The difference between the height of the external end of the internal portion and the height of the internal end of the second tire bead reinforcing cord layer is 10-40mm.