89results about How to "Reduced connection reliability" patented technology

When semi-amorphous TFTs are used for forming a signal line driver circuit and a pixel, a large amplitude is required for driving the pixel, and a large power supply voltage is thus needed. On the other hand, when a shift register is made up of transistors having a single conductivity, a bootstrap circuit is required, and a voltage over a power supply is applied to a specific element. Therefore, not both the driving amplitude and the reliability can be achieved with a single power supply. According to the invention, a level shifter having a single conductivity is provided to solve such a problem.

Provided is a connector which can absorb the position gap with respect to a counterpart connector, and can maintain an excellent connection with an electric circuit within a case to which the connector is attached. The connector (1) connected to a counterpart connector secured to a case of a motor is comprised of an outer housing (5) attached to a case of an inverter; a first inner housing (6) which contains a first terminal (20) engaged with a terminal of the counterpart connector and which is contained in the outer housing (5) so as to move in an engaging direction (Y) of the first terminal (20) and a direction intersecting with the engaging direction (Y) in order to engage with the counterpart connector; a second inner housing (10) which contains a second terminal (11) electrically connected to an electric circuit within the case and which is fixed within the outer housing (5); a connection portion (9) which is composed of a braided electric wire (90) and which electrically connects the first terminal (20) to the second terminal (11); and a packing (7) attached to the first inner housing (6).

A multilayer printed wiring board includes a mounting portion supporting a semiconductor device and a layered capacitor portion including first and second layered electrodes and a ceramic high-dielectric layer therebetween. The first layered electrode is connected to a ground line and the second layered electrode is connected to a power supply line. The ratio of number of via holes, each constituting a conducting path part electrically connecting a ground pad to the ground line of a wiring pattern and passing through the second layered electrode in non-contact, to number of ground pads is 0.05 to 0.7. The ratio of number of second rod-shaped conductors, each constituting a conducting path part electrically connecting a power supply pad to the power supply line of the wiring pattern and passing through the first layered electrode in non-contact, to number of power supply pad is 0.05 to 0.7.

There is provided a connector 1 connected to a mating connector, fixed in a case of a motor, comprising: an outer housing 5 attached to the case; a first inner housing 6 accommodating a first terminal 20 engaging to the mating connector, being accommodated in the outer housing 5 movably in the engaging direction Y of the first terminal 20 and in the intersectional direction of the engaging direction Y; a first inner connector 6 engaging to the mating connector; a second inner housing 10 accommodating a second terminal 11 electrically connected to a electric circuit in the case and being fixed in the outer housing 5 and a braided wire 90, and further including a connection portion 9 connecting the first terminal 20 and the second terminal 11 and a packing 7 attached to the first inner housing.

A combustion type power tool having a motor suspension arrangement capable of buffering a shock applied to a motor. An integral buffer member made from an elastic material is fixed to a head cap. The buffer member includes a motor storage section in which a motor casing is stored, and a plurality of buffer segments extending radially outwardly from the motor storage section and integrally therewith. Each radially outer end portion of each buffer segment is fixed to the head cap for floatingly supporting the motor storage section.

To prevent lowering of connection reliability of soldering connection portions of electronic equipment, there is provided electronic equipment which is equipped with a connector electrically connected to an electric motor, a control board and a power module board to which the connectors and other electric parts are electrically connected by soldering, a base for supporting the boards and the connector while overlapped with the boards and cases for fixing the connector while the connector is exposed from an opening portion, and fixing the boards while the boards and the base are accommodated in the cases. The connector is supported by the base through a beam as a flexible metal piece.

The printed wiring board 1 includes the metallic substrate 2, the insulating layer 3 provided on the surface of the metallic substrate 2, and the conductive layer 4 formed on the surface of the insulating layer 3. The conductive layer 4 is electrically connected to the metallic substrate 2. A bottomed via hole or a through hole 6 is formed in the insulating layer 3 and the conducive layer 4. The via hole has a bottom in the metallic substrate 2, and has a wall surface in the insulating layer 3 and in the conductive layer 4. The through hole 6 extends through the insulating layer 3, the conductive layer 4, and the metallic substrate 2. Conductive paste 7 fills the bottomed via hole or the through hole 6 to electrically connect the metallic substrate 2 and the conductive layer 4 with each other. The printed wiring board 1 is subjected to a process in which current is applied to the interface between the metallic substrate 2 and the conductive paste 7.

A semiconductor device and a production method thereof capable of reducing warps of a semiconductor wafer when packaging at a wafer level in a SiP type semiconductor device, is configured that an insulating layer is formed by stacking a plurality of resin layers on a semiconductor chip formed with an electronic circuit, wiring layers are buried in the insulating layer and electrically connected to electrodes, and formation areas of the plurality of resin layers become gradually smaller from an area of an upper surface of the semiconductor chip as they get farther from the semiconductor chip, so that a side surface and an upper surface of each of the resin layers and the upper surface of the semiconductor chip form a stepwise shape.

The motor cable device which can prevent damage on an inverter-side connecting member of the motor cable device and lowering in a connecting reliability of the inverter-side connecting member is provided. Also, a resin component used in the above-described motor cable device is provided. The motor cable device electrically connects a motor and an inverter and includes an inverter-side protector and a motor-side protector. The inverter-side protector includes a fixed end which is directly or indirectly fixed to the inverter and which supports the inverter-side connecting member. A swinging motion absorbing portion is formed continuously to the fixed end, the swinging motion absorbing portion being arranged to support a cable body at the inverter-side connecting member and absorb the swinging motion generated at the cable body of the motor cable device, is further included.

A bump electrode, a dummy bump, and a heat-resistant polymer film, whose upper-surface heights are uniformed, are formed on each of a first silicon substrate and a second silicon substrate, and then, the first silicon substrate and the second silicon substrate are bonded to each other so that the bump electrodes formed on the respective substrates are electrically connected to each other. At this time, the dummy bump is arranged so as to be bonded to the heat-resistant polymer film on the silicon substrate opposed thereto, so that a semiconductor device having both of good electrical connection between the bump electrodes and bump protection performance obtained by a polymer film with high heat resistance and without voids can be achieved.

A soldering technology, particularly a lead-free soldering technology, that can secure the reliability of a whole electronic device is provided. In a method for manufacturing a printed circuit board for electronic devices with a substrate to which a plurality of electronic parts having connection terminals with different metal compositions are connected by soldering, a plurality of solder pastes comprising solder components with different compositions are used, and when the electronic parts are connected by soldering to the substrate, a solder paste having a solder component with a different composition is used for each of the metal compositions for the connection terminals of the electronic parts.

In a temperature sensor section of a semiconductor integrated circuit device, first vias of tungsten are formed at the topmost layer of a multi-layer wiring layer and pads of titanium are provided on regions of the multi-layer wiring layer which covers the vias. An insulating layer is provided in such a way as to cover the multi-layer wiring layer and the pads, second vias are so formed as to reach the pads. Vanadium oxide is buried in the second vias by reactive sputtering, and a temperature monitor part of vanadium oxide is provided in such a way as to connect the second vias each other. Accordingly, the temperature monitor part is connected between the two wires.