In the conventional high-speed, large-current semiconductor chip, all the electric connecting terminals were placed on one surface of the chip. For this reason, to supply stable supply currents or reduce noises mixed into the signal system from the power supply, many terminals were assigned to supply current inflow terminals and supply current outflow terminals. As a result, there is a problem that the terminal number of a semiconductor device is increased and the mounting area thereof is increased.
The electrical connecting terminals for power supply system and those for signal system are separately placed on both sides of a semiconductor chip. By the configuration to enlarging the permissible current value of a path through which a large current flows, stabilization of feeding supply currents, reduction of noises mixed into signal systems, reduction of mounting areas due to pin count reduction, and increase of heat dissipation effects can be realized even with a decreased pin count. Moreover, by the semiconductor module on which the semiconductor chip is mounted, stable characteristics can be realized even in high-speed operation necessitating large currents.