56results about How to "Increase soldering temperature" patented technology

A lead-free solder material for soldering in electronic, instrument, lamp and other fields consists of: In 0.003-5 wt%, Sb 0.2-5 wt%, Cu 0.5-3 wt% Ag 0.2-5 wt% and Sn the rest. Compared with the traditional solder, the present invention has equal or even higher mechanical performance, soldering temperature and electric performance, and may be drawn into 0.5 mm diameter lead-less solder wire, and it is harmless to human body and environment.

The invention discloses an electromagnetic vibrating, stirring and friction-welding stirring-head and a corresponding welding method thereof. An electromagnetic vibrating device is adopted to assist electromagnetic vibration during the process of stirring, and friction-welding to lead the stirring-head to vibrate at high frequency simultaneously when the stirring-head rotates at a high speed to transfer energy to the metals in a stirring and friction area so as to lead the metals to achieve plastic state more quickly; the thermoplastic metals receive the composite effects of a friction force and the high-frequency vibrating energy during the rotating process of a stirring needle, thus being capable of effectively improving the velocity of the thermoplastic metal flow, improving the forming efficiency and quality of welding seams and being more effectively used for the welding and processing of high-melting point materials and thick boards.

The present invention relates to a method of welding printed circuit board containing mixed lead components and leadless components, using lead solder and controlling welding temperature curve to improve welding peak temperature and prolong solder liquid phase time properly on the base of conventional lead welding technics to implement reliable welding of leadless components. Applying the invention provided technical scheme can implement solder paste coating, patching and welding in one time of most lead components and leadless components, of which the production efficiency is far higher than separate welding technics of lead components and leadless components. The invention provided method improves production efficiency and reduces materials control difficulty of production field while shorts production period of mixed products and reduces production cost.

The invention provides an efficient water-cooling argon arc welding gun. The efficient water-cooling argon arc welding gun is composed of a handle, a gun head body, a gun head body protecting sleeve, a rear cap, a tungsten electrode rod, a tungsten electrode clamp, an inner heat insulation sleeve, an outer heat insulation sleeve, an outer connection sleeve, a spray nozzle connection ring and a ceramic spray nozzle, wherein the middle of the handle is provided with a gas inlet pipe, a water inlet pipe and a water outlet pipe; the right end of the handle is connected with a machine head body outer sleeve covering the exterior of the gun head body; the lower end of the gas inlet pipe is connected with a gas inlet hole in the side face of the upper end of the gun head body; the gas inlet hole communicates with a vertical through hole in the center of the gun head body; the tungsten electrode clamp is arranged in the middle of the vertical through hole; the tungsten electrode rod penetrates a middle hole of the tungsten electrode clamp; an annular groove is machined in the middle of the outer circle of the gun head body; the exterior of the annular groove is closely sleeved with the inner circle of the inner heat insulation sleeve, and the annular groove is closed into a water-cooling sleeve; the water inlet pipe and the water outlet pipe communicate with the water-cooling sleeve; the outer heat insulation sleeve is arranged outside the inner heat insulation sleeve; the exterior of the outer heat insulation sleeve and the inner circle at the upper end of the ceramic spray nozzle are connected together in a sleeving manner; the outer connection sleeve is arranged at the lower end of the gun head body protecting sleeve; the spray nozzle connection ring is connected to the lower end of the outer connection sleeve and connected with the outer circle at the upper end of the ceramic spray nozzle in a thread screwing manner; and the rear cap is arranged at the top end of the gun head body.

The invention designs a quick forming device for a titanium alloy multi-layered plate and a forming method thereof. The device comprises upper and lower graphite molds, a graphite electrode, a pulse direct current power supply, a pressurizing device and a test sample. The method comprises the following steps of generating a lot of resistance heat and discharging heat with a short time, as a directcurrent pulse current directly passes the test sample coated with a solder resist in a special area, wherein the test sample is heated quickly to enter an ultra-plastic state; then introducing gas, wherein the area, coated with the solder resist, of the test sample is swelled quickly; and meanwhile, achieving diffusion bonding by atom exchange in the area which is not coated with the solder resist so as o further form the multi-layered plate quickly. The device can remarkably shorten the forming time of the titanium alloy multi-layered plate and has the advantages of being high in forming speed, low in forming cost and suitable for forming various titanium alloy multi-layered plates.

The invention discloses a novel copper-based dip brazing alloy used in drilling bit production. Cutting drill teeth and a drill body form a whole by dip brazing. The dip brazing copper alloy has excellent mechanical property and high strength, toughness and abrasion resistance. A brazing process is simple and convenient and suitable for brazing drill bits of multiple types. When the brazing temperature is between 900 and 1,000 DEG C, the alloy comprises the following chemical components in percentage by weight: 5 to 10 percent of Ni, 3 to 9 percent of Mn, 3 to 5 percent of Fe, 7 to 13 percent of Sn, 0.1 percent of sigma RE and the balance of Cu. When the brazing temperature is between 950 and 1,150 DEG C, the alloy comprises the following chemical components in percentage by weight: 8 to 15 percent of Ni, 10 to 13 percent of Mn, 5 to 10 percent of Zn, 1 to 2 percent of Fe, 0.05 to 0.1 percent of Ce and the balance of Cu. When the brazing temperature is between 1,100 and 1,250 DEG C, the alloy comprises the following chemical components in percentage by weight: 15 to 20 percent of Ni, 5 to 10 percent of Mn, 3 to 5 percent of Fe, 0.05 to 0.1 percent of sigma RE and the balance of Cu.

The invention provides an electron beam pressurizing connection method for aluminum alloy and a particle-reinforced aluminum matrix composite material, and relates to an electron beam assisted heat source diffusion welding method for the aluminum alloy and the particle-reinforced aluminum matrix composite material, aiming at solving the problems of serious metal burning loss, interface reaction, air pores and the like existing in the traditional fusion welding technique of the particle-reinforced aluminum matrix composite material. The electron beam pressurizing connection method for the aluminum alloy and the particle-reinforced aluminum matrix composite material comprises the following steps of: 1) conducting pretreatment to two base metal blocks to be welded; 2) putting the two base metal blocks into a welding fixture and applying pressure to squeeze the base metal blocks; 3) conducting vacuum pumping treatment; 4) conducting welding for the first time by adopting an upward defocusing mode; 5) conducting welding for the second time; and 6) conducting vacuum cooling to complete the electron beam pressurizing connection of the aluminum alloy and the particle-reinforced aluminum matrix composite material. The electron beam pressurizing connection method for the aluminum alloy and the particle-reinforced aluminum matrix composite material belongs to the field of pressurizing assisted welding.

The invention provides a highly-efficient, energy-saving and environmentally-friendly manufacturing method of a metal ceramic X ray tube. All parts are processed and manufactured at first, and then cleaned and assembled. The manufacturing method is characterized in that during the assembling, AgGu28 soldering flux sheets or rings are arranged in 10 to-be-welded welding places of a part, and titanium molybdenum getter is arranged in the cathode of a metal ceramic X ray tube; the assembled metal ceramic X ray tubes are vertically arranged in a material rack then sent into a vacuum welding furnace, vacuumized, heated to 650-750 DEG C, kept warm for 10-12 hours, heated to 800 DEG C and kept warm for 7-10 minutes until the welding materials are fused, so soldering and sealing are finished; a cooling system of the vacuum welding furnace is started, temperature is reduced to 60 DEG C in 4-6 hours, vacummization is stopped, and the welding materials are taken out of the furnace; and degassing, vacuum exhausting and welding for the materials are finished at a time, then performing the stress test for 8 hours, and at last qualified products are examined and put in storage. According to the invention, problems of low efficiency, insecurity, severe environmental pollution and high energy consumption of the current manufacturing technique are solved.

The invention relates to solder paste applied to a signal distributor. The solder paste is composed of flux paste and tin-based alloy welding powder. The flux paste is obtained after 25%-40% of solvent, 42%-50% of modified rosin, 2%-5% of organic acid, 2%-5% of borofluoride, 7%-10% of a thixotropic agent and 5%-10% of an antioxidant are added in a reaction kettle to be stirred, heated to 150 DEG C and dissolved. The flux paste is evenly mixed with any one of several types of solder powder, including Sn96.5Ag3.0Cu0.5, Sn97.5Ag2.0Cu0.5, Sn98.5Ag1.0Cu0.5, Sn99Ag0.3Cu0.7, Sn99Cu0.7, Sn42Bi58, Sn64Bi35Ag1.0, Sn64.7Bi35Ag0.3 and Sn64.9Bi35Ag0.1, in a mixing machine according to the weight ratio being (10-15):(85-90) to obtain the solder paste suitable for the signal distributor. The solder paste is particularly suitable for the signal distributor, the production cost can be reduced, and the production efficiency can be improved; viscosity is appropriate, thixotropy is high, the solder paste is not likely to be layered when a glue dispenser conducts dispensing, and the solder paste can be uniformly sprayed on an assigned welding area; an oxidation film of an electroplated coating on the surface of the solder powder can be completely removed within 5-8 seconds, and false solder and missing solder can be prevented; and the storage life of the solder paste is long, and the solder paste can bear a high welding temperature. Post-soldering residues are few, and cleaning can be easily conducted through an environment-friendly cleaning agent.

The invention discloses a medical clamp and a processing method thereof. The medical clamp comprises a clamp head, a jaw and soldering flux, wherein the clamp head is made of a medium-low hardness stainless steel material; the jaw is made of a higher hardness stainless steel material; the soldering flux is used for splicing the clamp head and the jaw; and when the clamp head and the jaw are quenched, the soldering flux is melted to weld the clamp head and the jaw integrally. The processing method comprises the following steps: the clamp head and the jaw are clamped together to form a combination, the combination is coated with the soldering flux, the combination coated with the soldering flux is placed in a vacuum furnace or a tracked furnace with the gas protection function to be quenched, and at the same time, the soldering flux is melted to weld the clamp head and the jaw, so as to connect the clamp head with the jaw integrally, and at last, after excess materials of the clamp head and the jaw are cut with a wire or cut off by a grinding machine, a finished product is manufactured. The jaw is made of the higher hardness stainless steel, and a handle and a clamp body are made of the medium-low hardness stainless steel material, so that the problems of blackening and rusting of the jaw are solved well.

The invention relates to a tool capable of applying a pressure to carry out electron beam auxiliary heat action connection. The invention relates to a welding fixture for an electron beam auxiliary heat source action connection method. The invention aims to solve the problems of serious metal fire waste, interface reaction and the like, which are generated when a conventional fusion welding technology is adopted to process certain materials, so as to provide the tool capable of applying the pressure to carry out electron beam auxiliary heat action connection. The tool capable of applying the pressure to carry out electron beam auxiliary heat action connection is formed by a fixture housing, a fixture base, a vertical fixing device and a horizontal fixing device. The tool has the following working principle that the welding fixture disclosed by the invention is used by applying a certain pressure to a contact surface of a base metal, simultaneously utilizing a defocused electron beam to carry out circular scanning on a weld joint, repeatedly scanning in a reciprocating manner and controlling the welding speed so as to implement effects of raising the welding temperature and prolonging the heat preservation time, i.e. the defocused electron beam is used as a heat source to implement local connection of the base metal. The tool belongs to the field of a welding auxiliary tool.

The invention relates to low-Ti high-strength silver-based middle-temperature active brazing filler metal and a preparation method thereof. The brazing filler metal is prepared from 20 to 25 percent by weight of Cu, 15 to 25 percent by weight of Sn, 1 to 5 percent by weight of Pd, 1.0 to 3.0 percent by weight of Ti, and the balance Ag. The preparation method comprises the steps of adopting variousmetal for smelting according to the alloy proportion, then atomizing through high-pressure gas and carrying out deposition modeling, carrying out hot extrusion treatment on a modeled blank so as to enable an alloy to be densified, then rolling the densified blank, and finally obtaining an AgCuSnPdTi alloy sheet. The alloy brazing filler metal prepared through the method is uniform in compositionsand segregation-free, and can be processed into the sheet, and the welding temperature is lowered by about 200 DEG C compared with conventional AgCuTi active brazing filler metal, so that the residual heat stress of an Si3N4 ceramic welded joint is reduced, and the welding strength and the reliability of Si3N4 ceramics are improved.

The invention provides a braze soldering method for welding aluminum-base composite materials and titanium alloys and enabling intermetallic compound particles in weld seams to be dispersed and reinforced, and relates to the field of braze soldering of the aluminum-base composite materials and the titanium alloys. The method solves the technical problem that performance of a connector obtained through an existing aluminum-base composite material and titanium alloy method is low. The method comprises the steps that firstly, a pure aluminum ingot is fused; secondly, the surface of a titanium alloy is modified; and thirdly, ultrasonic welding is carried out. According to the method, the welding temperature of the titanium alloys and the aluminum-base composite materials can be lowered obviously, the situation that a base material is heated and softened in the welding process is effectively prevented, TiAl3 particles entering the weld seams can have the dispersing and reinforcing function,and a welding connector with high strength is obtained beneficially. The method is used for braze soldering of the aluminum-base composite materials and the titanium alloys.

The invention discloses glass-metal heat sealing material and method of a heat-pipe evacuated solar collector tube. One end of a glass tube is sintered into a glass flange; the end face of the flange and the surface of a Fe-Ni expansion alloy end cover are respectively cleaned and deoiled; an annular welding wire prepared from the glass-metal heat sealing material is clamped in the middle, wherein the sealing temperature is 0.6-0.9 times of the melting point of the welding wire, the exerted impact pressure is 70-500kg/cm<2>, and the time is 0.5 seconds to 2 minutes; the glass-metal heat sealing material is selected from any one of metal substances or metal alloy of Mg, Be, V, Co and Ni,the metal alloy contains nickel and silicon, the mass fraction of the nickel in the metal alloy is 1-30%, the mass fraction of the silicon is 1-30%, and base metal is selected from any one of Mg, Be, V and Co. The corrosion resistance, the welding temperature, the fatigue strength and the malleability of the welding line disclosed by the invention are improved; the welding wire is more tightly combined with glass and metal; the air leak rate is reduced; and the service life is prolonged.

A method for form-fitted joining of two surfaces, where a metallic or non-metallic solder is applied to at least one of the two surfaces, where the solder has a temperature-dependent optical property. The solder is radiated with electromagnetic radiation with a predetermined spectrum, such that the solder reaches a predetermined temperature above its melting temperature and moistens the surfaces, such that the temperature-dependent optical property is modified reversibly or irreversibly at the predetermined temperature of the solder. The solder is cooled to below its melting temperature, such that the solder solidifies and connects the surfaces in form-fitted manner.

The invention discloses a packaging structure and a packaging technology improving optical coupler reliability; the packaging technology specifically comprises the following steps: coupling, aligning and racking; packing an input end and an output end; setting a high voltage block layer; and mould pressing. The high voltage block layer is arranged between an input end transparent silica gel layer and an output end transparent silica gel layer; a mould pressing material is filled between the input end transparent silica gel layer and the output end transparent silica gel layer, and between an outer wall of the high voltage block layer and a housing. The packaging technology can improve a soldering temperature, so SMT paster soldering technology can be applied to an optical coupler welding process; a stress between a chip welding gold thread and the silica gel and mould pressing material and a high voltage breakdown path in the optical coupler can be removed without needing a silica gel surface treatment complex technology condition, thus reducing production difficulty and production cost, and effectively ensuring product reliability.

Metal-welded plain vacuum glass provided with edges sealed by sealing grooves and sealing strips is disclosed. The plain vacuum glass comprises upper glass and lower glass, and is characterized in that: the periphery of the upper glass is provided with sealing strips; corresponding positions of the periphery of the lower glass are provided with the sealing grooves and sealing strips; after being rapidly heated, the upper glass and the lower glass are subjected to sheet combining at a high temperature, and the peripheries of the upper glass and the lower glass are welded under elevated pressure by metal solder in a vacuum furnace; a sealed vacuum layer is formed between the upper glass and the lower glass; and supports arranged in a point array are disposed in the vacuum layer. The vacuum glass and a manufacturing method thereof are simple in process and high in production efficiency. The manufactured tempered vacuum glass eliminates edge sealing stress and maintains tempered characteristics of tempered glass. The tempered vacuum glass can be produced in a large scale, and the service lifetime of the tempered vacuum glass can be prolonged.

The invention discloses a circuit board of an LED lamp, an LED lamp board and a processing technology of the circuit board. The LED lamp board includes LED wafers, wafer lead wires and the circuit board. The circuit board includes mirror boards, a substrate and a solder mask layer. The substrate includes wafer installation holes. The mirror boards are bonded on the back of the substrate. The solder mask layer covers the front face of the substrate. The front face of the substrate includes aluminum conductive lines. The outer surfaces of the conductive lines include abrasive blasting rough layers. The wafer lead wires are ultrasonically welded with bonding pads on the aluminum conductive lines of the circuit board. The LED wafers are pasted on the mirror boards in the wafer installation holes of the substrate. The outer surfaces of the conductive lines are provided with the rough layers formed through abrasive blasting, and during ultrasonic welding with metal lead wires, especially aluminum lead wires, the fusion degree of the lead wires and the bonding pads is high. Compared with aluminum alloy bonding pads which do not undergo the abrasive blasting processing, the lead wires are capable of bearing a higher tension. The manufactured LED lamp board is high in good rate and low in fault rate in a use process.

The invention discloses a high-tin-content copper-tin brazing filler metal grid-shaped composite strip. The tin content is 10wt%-60wt%; the high-tin-content copper-tin brazing filler metal grid-shaped composite strip comprises a strip-shaped copper base body, a plurality of grooves which are arranged in parallel at intervals are formed in one surface of the strip-shaped copper base body, the grooves are filled with tin to form tin bars, and the tin bars and copper around the grooves are connected into a whole. The invention further discloses a preparation method of the high-tin-content copper-tin brazing filler metal grid-shaped composite strip. According to the method, the influence of the tin adding amount on the machining forming performance can be avoided, when the tin content reaches 10wt%-60wt%, the high-tin-content copper-tin brazing filler metal strip can still be obtained through a conventional pressure machining method, and the brazing temperature is reduced.