8results about How to "Low soldering temperature" patented technology

The utility model discloses a one-way valve part, flow path switching subassembly, heat exchanger, air conditioning system and air conditioner, one-way valve part includes: one-way valve, first pipe section and second pipe section. One-way valve includes first casing, second casing and valve core, and first casing and second casing are directly welded and are connected and are limited to one-way flow channel, is equipped with the export on first casing, is equipped with the import on second casing, and the valve core is located in one-way flow channel, and one-way valve is by import to export one-way conduction, first pipe section one end is connected in the export place, and first pipe section is connected with first casing through first soldering material and is welded, and second pipe section one end is connected in the import place, and second pipe section is connected with second casing through second soldering material and is welded. According to the one-way valve part of the utility model, the quality and the yield of one-way valve part are high, and production efficiency is high and cost is low.

The application provides a precision preformed soldering piece and a preparation method thereof. By arranging a graphene layer between the preformed soldering piece and a flux layer, the welding quality and efficiency can be improved, the energy consumption and environmental pollution in the welding process can be reduced, the welding strength and corrosion resistance can be improved, the oxidation and thermal stress in the welding process can be reduced, the cavity rate can be reduced, the precision can be improved, fullerene is added in the alloy raw material, the fullerene has high chemical stability and strong mechanical properties, can form strong bonding with rare earth metals, has high heat conduction performance, can effectively dissipate heat, avoids overheating of the welding part to cause failure, significantly reduces the cavity rate, improves the precision of the welding, reduces the welding temperature required by the preformed soldering piece, and has excellent oxidation resistance, which can effectively prevent the oxidation of the metal surface.

The invention provides a double-face symmetrical synchronous friction stir welding device. Comprising two different types of stirring tools, the end part of one stirring needle is provided with a bulge (a convex stirring tool for short), the end part of the other stirring needle is provided with a recess (a concave stirring tool for short), and the concave and convex parts of the two stirring needles can be embedded with each other. During double-sided synchronous friction stir lap welding, the upper stirring tool and the lower stirring tool are symmetrically distributed along the butt joint face, and the double-sided synchronous friction stir lap welding is carried out at the same rotating speed and the same welding speed. The press-in amount adjusting range of the upper stirring tool and the lower stirring tool is enlarged, the operation difficulty is reduced, and in the welding process, a user does not need to worry about contact abrasion of the upper stirring needle and the lower stirring needle and introduce redundancy to a weld joint. In addition, the method can ensure that an upper stirring tool and a lower stirring tool completely penetrate through a welded workpiece, and the risk of weak combination of the center of a welding seam during double-sided synchronous friction stir welding is eliminated.

The present disclosure relates to a kind of active solder paste composition for ceramic copper clad, ceramic copper clad method and copper clad ceramic, with the total weight of active solder paste composition as basis, active solder paste composition contains 1-20wt% first metal powder, 75-94wt% second metal powder and the balance of flux;Wherein, first metal powder contains titanium hydride, and second metal powder contains copper phosphorus silver alloy.The active solder paste composition provided by the present disclosure not only can reduce the silver content, but also can reduce the welding temperature, while also increasing the connection strength of Ti and Cu, increase the welding strength, so that material is not easy to occur segregation.

The application discloses a low-temperature high-strength neutral soldering paste and a manufacturing method thereof. The soldering paste has the following raw material formula in percentage by weight: 87-92% of tin-based alloy powder, 3.5-5% of activating agent, 0.5-1.2% of reinforcing agent, 0.5-2% of thixotropic agent and 2-6% of solvent. The alloy components in the tin-based alloy powder and their percentage by weight are as follows: 90-95% of Sn, 2-5% of Ag, 0.2-1% of Cu and 2-6% of Bi. The activating agent is composed of dimethylol propionic acid, sodium phosphate and ammonium fluoroborate according to a weight ratio of 1: (0.1-0.4): (1.5-2). The reinforcing agent comprises reinforcing alumina particles subjected to metallization treatment, and the reinforcing alumina particles have a nanoscale particle size. The soldering paste has the characteristics of low welding temperature, good wettability, improved solder joint shear strength, neutral no post-welding corrosion and the like, and is suitable for precise welding scenes.

A welding area is arranged on one side of a circuit board, a shunt is connected with the circuit board through the welding area, the welding area comprises segmentation bonding pad areas, the left side and the right side of the middle of the circuit board are provided with the segmentation bonding pad areas, and the shunt is connected with the circuit board through the segmentation bonding pad areas. The welding pad is arranged to be the square single-point welding pad, the cross-shaped flow channel is formed, bubbles generated during welding in the peripheral direction can be conveniently dissipated, tin overflowing is prevented, the yield is greatly improved, meanwhile, the square single-point welding pad is slow in heat dissipation and low in welding temperature, existing gas-phase welding can be replaced with reflow welding, and the welding cost is greatly reduced; a temperature monitoring area is arranged to facilitate monitoring of the temperature of the shunt.

The utility model relates to the technical field of semiconductor manufacturing equipment, concretely is a kind of low-cost stainless steel semiconductor heating disc structure, including cover, pedestal, electric heater and shaft column, the side of pedestal and cover connection is provided with annular groove, cover is embedded in annular groove, and cover and pedestal are connected by the welding bead of outer circumferential annular and the electron beam welding connection of several welding spots inside array.It is adopted that the low-cost stainless steel semiconductor heating disc structure uses electron beam welding, avoids the damage of high temperature to electric heater insulating medium, improves heating disc reliability and service life;At the same time, electron beam welding cost is lower, can shorten production cycle, improve production efficiency;Its unique welding structure, such as annular groove cooperation outer circumferential annular welding bead and inside array welding spot, strengthens the connection strength and overall stability;Reasonable welding spot distribution ensures heating uniformity, and the cylindrical protruding design at welding spot improves welding precision.

This invention belongs to the field of power device processing technology, specifically relating to an aluminum nitride ceramic substrate with copper-plated surface and its preparation method. The copper-plated aluminum nitride ceramic substrate comprises an aluminum nitride ceramic plate, a magnetron sputtered copper layer, a tin-silver-copper metal paste, and copper foil, and its composition is carried out according to the following process flow: 1) surface cleaning treatment of the aluminum nitride ceramic substrate; 2) vacuum copper plating on the surface of the aluminum nitride ceramic substrate; 3) tin-silver-copper metal paste printing; 4) stacking copper foil; 5) pre-pressing vacuum furnace welding. This invention provides a method for copper-plating aluminum nitride ceramic substrates, which offers advantages such as simple metallization operation, low welding temperature, high production efficiency, low cost, fewer porosity defects at the substrate-metal layer junction, and strong copper foil adhesion.