Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Home position alloying type lead-free solder and preparation method thereof

A lead-free solder and alloying technology, applied in mixing methods, chemical instruments and methods, welding equipment, etc., can solve the problems of reducing the width of the welding process window, poor melting point thermal cycle resistance, increasing the difficulty of welding, etc. Inventory costs, increased flexibility in production manoeuvres, effects of extended wetting time

Active Publication Date: 2008-03-12
BEIJING COMPO ADVANCED TECH
View PDF0 Cites 15 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] There are certain problems in the currently developed lead-free solder alloys, such as: SnCu and SnAg solders have high melting points, which increase the difficulty of soldering in the SMT process and reduce the width of the soldering process window; and SnBi solders are more brittle Its application in some electronic products is limited, and its low melting point leads to poor thermal cycle resistance during application (generally only used in environments below 40°C) which also limits its application; SnZn solder, despite its mechanical properties It has strong advantages in terms of melting point and melting point, but its anti-oxidation and corrosion resistance and its wetting and spreading properties have always been the bottle diameter of its application.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Home position alloying type lead-free solder and preparation method thereof
  • Home position alloying type lead-free solder and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Example 1 Preparation of 50(SnBi58)-30(SnCu0.7)-20Sn solder powder:

[0029] Using centrifugal atomization or ultrasonic atomization or gas atomization technology to prepare in-situ alloyed lead-free solder monomer powder - SnBi58 (melting point 139 ° C) alloy solder powder, SnCu0.7 (melting point 227 ° C) alloy solder powder and single substance Pure Sn (melting point 231°C) powder. Use a nitrogen-protected vibrating sieve to classify, then weigh 12.5g of 3# (25-45μm) solder powder of SnBi58, 7.5g of 3# (25-45μm) solder powder of SnCu0.7, and weigh 3# of pure Sn (25-45μm) 5g of solder powder, put it into a planetary ball mill tank under the condition of room temperature and filled with argon, mix it well for 20min, and store it for later use.

Embodiment 2

[0030] Example 2 Preparation of 10(SnBi58)-80(SnCu0.7)-10Sn solder powder:

[0031] Powder making and grading methods are the same as in Example 1, then weigh 2.5g of 2.3# (38-63μm) solder powder of SnBi58, weigh 20g of 4# (20-38μm) solder powder of SnCu0.7, and weigh 3# of pure Sn #(25~45μm) Solder powder 2.5g, put it into a planetary ball mill tank under the condition of argon filling at room temperature and mix it well for 20min, and store it for later use.

Embodiment 3

[0032] Example 3 Preparation of 17(SnBi58)-71(SnCu0.7)-12Sn solder powder:

[0033] Powder making and grading methods are the same as in Example 1, then weigh 17g of 3# (25-45μm) solder powder of SnBi58, weigh 71g of 3# (25-45μm) solder powder of SnCu0.7, and weigh 3# of pure Sn (25-45μm) solder powder 12g, put it into a planetary ball mill tank in a zero-degree cold storage and mix it well for 20 minutes, and store it for later use.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Melting pointaaaaaaaaaa
Login to View More

Abstract

The present invention, which belongs to the electronic soldering technology field, discloses an in-situ alloying lead-free solder and a preparation method thereof. The present solder consists of two or more alloy powders or single-substance metal powders, which are mixed mechanically and uniformly. In welding and application processes, the solder has the advantages of a strong anti-collapsing ability, a bright co-center circles of the solder joint, a good spreading effect, a simple preparation technique and low cost and the optimal advantages are that the welding with the use of a unified SMT welding technique and without changing the welding technique line and parameters of the previous solder is convenient. The medium / high temperature solder can be welded under a low temperature or gradient temperatures so that the medium / high temperature application of the low temperature solder is realized and the service life of the solder joint is prolonged.

Description

technical field [0001] The invention relates to an in-situ alloying type lead-free solder and its preparation and application method. The solder is a mechanical mixture of two or more powders with good compatibility and affinity during soldering, and belongs to the technical field of electronic solder manufacturing. Background technique [0002] Emphasizing environmental protection and advocating green products are the general trend of economic development in the world today, and lead-free electronic products are one of the major measures. The currently applied patents on lead-free solder can be said to be overwhelming, mainly occupied by countries such as Japan, the United States, and the European Union. However, the research on lead-free technology for electronic products in my country started relatively late, and commercial lead-free electronics with independent intellectual property rights There are very few products. In order to meet the wave of lead-free soldering in t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B23K35/26B01F3/18
Inventor 徐骏胡强贺会军张富文朱学新王志刚石力开杨福宝赵朝辉
Owner BEIJING COMPO ADVANCED TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com