Welding method of aluminum alloy sputtering target material for integrated circuit package material

A packaging material and integrated circuit technology, applied in electron beam welding equipment, welding equipment, welding equipment and other directions, can solve the problem of low welding interface welding rate and welding strength, affecting the sputtering performance of the target material, and increasing the grain size of the target material. large and other problems, to achieve the effect of avoiding coarse grains, stable process and reducing welding temperature

Inactive Publication Date: 2015-05-20
GRIKIN ADVANCED MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The method in the patent US 6749103 is: process different shapes of teeth on the back plate, and then use the cold pressing method to achieve welding after the aluminum target and the back plate are electron beam sealed and welded. This pressing method may cause welding The welding rate of the interface is low
The method in the patent US 7146703 is: after processing trapezoidal grooves and steps on the target and the back plate respectively, the target and the back plate are occluded by direct cold pressing. This method may cause the welding interface to be damaged due to insufficient exhaust. Welding rate and welding strength are low
In the patent US 2007 / 0084719, friction welding is used after the target and the back plate are processed into grooves, so that the target and the back plate are diffused. This welding method may increase the internal grain size of the target due to excessive welding temperature. Large, it will affect the sputtering performance of the target

Method used

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  • Welding method of aluminum alloy sputtering target material for integrated circuit package material
  • Welding method of aluminum alloy sputtering target material for integrated circuit package material
  • Welding method of aluminum alloy sputtering target material for integrated circuit package material

Examples

Experimental program
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Effect test

Embodiment 1

[0039] Example 1 Hot isostatic welding of high-purity Al and copper-chromium alloy backplane

[0040] The high-purity Al (99.9995%) blank is the target blank with a diameter of 350 mm; the copper-chromium alloy C18200 is the back plate with a diameter of 450 mm.

[0041] Follow the steps below:

[0042] (1) Machining target blank and back plate. A plurality of concentric ring-shaped convex teeth are turned on the high-purity Al target blank. The convex teeth are 2mm wide, 3.5mm high and 4mm apart.

[0043] (2) Machined backplane. Grooves are carved out on the copper chrome back plate, the shape is as Figure 4 The I kind of groove in, the width is 2mm, deep 3mm, spacing 4mm. Two indentations 211 parallel to the bottom of the groove are respectively provided on the two side walls of the groove, so that the groove on the back plate corresponds to the protruding teeth on the back of the target blank and has the same cross-sectional area. Such as Image 6 As shown, there are...

Embodiment 2

[0048] Embodiment 2 Hot isostatic pressing welding of high-purity AlCu4 alloy (99.9995%) and copper-nickel-silicon-chromium alloy backplane

[0049] The high-purity AlCu4 alloy blank (99.9995%) is the target blank, with a diameter of 450 mm; the back plate copper-nickel-silicon-chromium alloy C18000, with a diameter of 530 mm.

[0050] Follow the steps below:

[0051] (1) Machining the target blank. A plurality of concentric annular convex teeth are machined on the high-purity AlCu4 target blank. The convex teeth are 2.5mm wide, 2mm high, and 5mm apart.

[0052] (2) Machined backplane. Grooves are carved out on the copper chrome back plate, the shape is as Figure 4 Type III trapezoidal groove, the upper width of the trapezoid is 2.5mm, the bottom width is 4.17mm, the depth is 1.5mm, and the spacing is 5mm. Make the groove on the back plate equal to the cross-sectional area corresponding to the position of the protruding teeth on the back of the target blank. Carry out fi...

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Abstract

A welding method of an aluminum alloy sputtering target material for an integrated circuit package material comprises the steps that a protruding tooth of a certain shape and size is machined on the welding face of the target material, a corresponding groove is machined in a back plate, the target material and the back plate are put into a wrapping sleeve for carrying out vacuum seal welding after being assembled and combined, then a hot isostatic pressure method is adopted for enabling the groove to be completely filled with the material, and the target material is connected with the back plate. Due to the fact that welding temperature is low, aluminum alloy grain growth can be avoided, the welding intensity between the target material and the back plate is high, the target material is small in overall deformation, and subsequent machining is facilitated.

Description

technical field [0001] The invention belongs to the technical field of target material preparation, and in particular relates to a connection method between an aluminum target material and a copper back plate. Background technique [0002] With the development of advanced packaging technology towards three-dimensional integration, high efficiency and low cost, the magnetron sputtering rate and power of the target are gradually increasing. As an important material for advanced packaging, aluminum and its alloy targets have a sputtering power of up to 40kw. Under such conditions, the targets are required to have higher overall strength and better thermal conductivity. Copper and copper alloy backplanes are more suitable for the use of aluminum alloy targets under high-power sputtering conditions due to their high strength and good thermal conductivity. [0003] There are two main ways to weld the aluminum target and the copper back plate. The first is brazing. The welding str...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K15/06B23K9/16B23K37/00
CPCB23K15/06B23K9/16B23K37/00B23K2103/18
Inventor 罗俊锋李勇军何金江王兴权侯文浩廖赞杨永刚张涛王永明
Owner GRIKIN ADVANCED MATERIALS
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