Adhesive and connecting structure using the same

A technology for adhesives and connecting terminals, applied in connection, adhesives, conductive connections, etc., can solve problems such as poor bonding strength, achieve excellent bonding strength, excellent operability, and suppress the effect of reducing connection reliability

Active Publication Date: 2010-09-01
RESONAC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] However, the conventional radical-curable adhesives described in Patent Document 2 etc. have a problem of inferior adhesive strength compared with the case of using epoxy resin due to large curing shrinkage during curing.

Method used

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  • Adhesive and connecting structure using the same
  • Adhesive and connecting structure using the same
  • Adhesive and connecting structure using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～9、 comparative example 1～3

[0129] As the thermoplastic resin, a solution obtained by dissolving the above-mentioned urethane resin in a mixed solvent of methyl ethyl ketone and toluene with a solid content of 30% by weight, and a phenoxy resin (ZX- 1356-2, trade name manufactured by Tohto Kasei Co., Ltd.) or a polyester polyurethane resin (UR-1350, trade name manufactured by Toyobo Co., Ltd.) dissolved in a mixed solvent of methyl ethyl ketone and toluene at a solid content of 40% by weight (UR-1350, trade name manufactured by Toyobo Co., Ltd.) .

[0130] As the radical polymerizable compound, epoxy acrylates (VR-60 and VR-90, trade names manufactured by Showa High Molecular Co., Ltd.) which are solid at 30° C. were used alone, or as a liquid radical polymerizable compound. Isocyanuric acid EO-modified triacrylate (M-215, trade name manufactured by Toagosei Co., Ltd.) and urethane acrylate (UA6100, trade name manufactured by Shin-Nakamura Chemical Co., Ltd.) were used together.

[0131] As the acidic c...

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Abstract

Provided is an adhesive containing (a) a thermoplastic resin, (b) a radical polymerizable compound and (c) a radical polymerization initiator. The radical polymerizable compound is in a solid-state at a temperature of 30 DEG C or below.

Description

technical field [0001] The present invention relates to an adhesive, and a connection structure of circuit components using the adhesive. Background technique [0002] In semiconductor elements and liquid crystal display elements, various adhesives have been used conventionally in order to bond various components in the elements. Adhesives used in this application require not only adhesive strength but also various properties such as heat resistance and connection reliability in high-temperature and high-humidity environments (for example, 85° C. / 85% RH). In addition, the adherends used for bonding are mainly organic substrates such as printed circuit boards and polyimide, and metals such as copper and aluminum, and ITO, Si, etc. can also be used. 3 N 4 , SiO 2 and other substrates with various surface states. Therefore, molecular design of adhesives suitable for various adherends is necessary. [0003] Conventionally, thermosetting resins containing epoxy resins exhibi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J201/00C09J4/00C09J9/02H01B1/22H01L21/60H01R11/01H05K3/32
CPCH01L2224/2949H01L2924/01049H01L2224/29344H01L2924/09701C09J4/00H01L2224/83855H01L2224/29347H01L24/83H01L24/29H01L2224/29439H01L2224/2929H01L2224/32227H01L2924/01045H01L2224/29455H01L2224/29387H01L2224/293H01L2924/0105H01L2224/29444H05K3/323H01B1/24H01L2924/01047H01L2224/8385H01L2924/01004H01L2924/01006H01L2924/01079H01L2924/01074H01L2224/29339H01L2224/16H01L2924/10253H01L2924/01005H01L2224/29447H01L2224/29355H01L2224/2919H01L2924/01013H05K2201/0129H01L2224/29388H01L2224/83851H01L2924/014H01L2224/2939H01L2224/29101H01L2924/01023H01L2924/07811H01L2924/01029C09J9/02H01L24/32H01L2924/01019H01L2924/01033H01L2924/0665H01L2924/00C09J201/00H01B1/12
Inventor 宫泽笑加藤木茂树伊泽弘行白坂敏明富泽惠子
Owner RESONAC CORP
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