Disclosed are methods and apparatus for improving the resiliency and
airflow through a
honeycomb air vent filter while providing EMI shielding. In one embodiment, the
honeycomb can be manufactured from a
dielectric (e.g., plastic) substrate to provide improved resistance to deformation as compared to conventional
aluminum honeycomb. The
dielectric honeycomb substrate is metallized to provide EMI shielding capability. The metallized honeycomb substrate is
cut slightly oversize to fit an opening in an electronic
enclosure, which results in elastic deformation of resilient perimeter spring fingers that are used to hold the metallized
dielectric honeycomb in place and provide electrical
conductivity between the metallized
dielectric substrate and the
enclosure, thereby eliminating the use of a frame. In another embodiment, additional conductive
layers can be added to the metallized dielectric honeycomb. In yet another embodiment, the metallized dielectric honeycomb substrate can be utilized in a framed configuration to provide improved durability.