Methods and apparatus for EMI shielding

Abstract

Disclosed are methods and apparatus for improving the resiliency and airflow through a honeycomb air vent filter while providing EMI shielding. In one embodiment, the honeycomb can be manufactured from a dielectric (e.g., plastic) substrate to provide improved resistance to deformation as compared to conventional aluminum honeycomb. The dielectric honeycomb substrate is metallized to provide EMI shielding capability. The metallized honeycomb substrate is cut slightly oversize to fit an opening in an electronic enclosure, which results in elastic deformation of resilient perimeter spring fingers that are used to hold the metallized dielectric honeycomb in place and provide electrical conductivity between the metallized dielectric substrate and the enclosure, thereby eliminating the use of a frame. In another embodiment, additional conductive layers can be added to the metallized dielectric honeycomb. In yet another embodiment, the metallized dielectric honeycomb substrate can be utilized in a framed configuration to provide improved durability.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]More than one reissue application has been filed for the reissue of U.S. Pat. No. 6,870,092. The reissue applications are the present divisional reissue application and application Ser. No. 11 / 516,803, filed Sep. 5, 2006, now Reissue RE41,594. This application is a divisional application from U.S. reissue application Ser. No. 11 / 516,803, now Reissue RE41,594, which, in turn is a reissue of U.S. Pat. No. 6,870,092, which issued from U.S. patent application Ser. No. 10 / 310,107 filed on Dec, 4, 2002, which, in turn claims the benefits of U.S. Provisional Application Ser. No. 60 / 336,609, filed on Dec. 4, 2001, and U.S. Provisional Application Ser. No. 60 / 378,886, filed on May 8, 2002, the disclosures of which are incorporated herein by reference in their entireties.FIELD OF THE INVENTION[0002]This invention relates to methods of manufacturing electromagnetic interference (“EMI”) shields and the EMI shields produced thereby.BACKGROUND OF THE I...

AI Technical Summary

Benefits of technology

[0014]One purpose of this invention is to provide improved durability to EMI shielding honeycomb filters. Another purpose of this invention is to provide improved airflow through EMI shielding honeycomb filters.

Problems solved by technology

During normal operation, electronic equipment generates undesirable electromagnetic energy that can interfere with the operation of proximately located electronic equipment due to EMI transmission by radiation and conduction.

Since such enclosures often include vent openings and gaps or seams between adjacent access panels and around doors, effective shielding is difficult to attain, because the gaps in the enclosure permit transference of EMI therethrough.

Further, in the case of electrically conductive metal enclosures, these gaps can inhibit the beneficial Faraday Cage Effect by forming discontinuities in the conductivity of the enclosure which compromise the efficiency of the ground conduction path through the enclosure.

Moreover, by presenting an electrical conductivity level at the gaps that is significantly different from that of the enclosure generally, the gaps can act as slot antennae, resulting in the enclosure itself becoming a secondary source of EMI.

One particularly challenging shielding issue on electronic enclosures is the ventilation opening.

Without EMI shielding, the openings represent huge EMI leakage points.

Lower cost vent panels, which are usually made of aluminum honeycomb, provide lower levels of shielding effectiveness and are not structurally robust.

These products, however, are much more expensive.

This feature can make the vent panel 10 susceptible to localized EMI leakage if twisting and jarring of the vent panel 10 degrades that contact area.

However, airflow through the vent panel 10 is limited by the presence of the frame 14.

Traditional frames, with the pincher finger feature, greatly limit the ability to increase vent panel airflow due to the minimum width requirements of the frame material.

Another problem with commercially available vent panels 10 is that they are typically made of aluminum, which is not very resilient and therefore subject to damage.

The lack of resiliency results in plastic deformation of the honeycomb filter due to impacts that can be encountered during assembly and field use.

The rework process is time consuming, requiring the deformed aluminum strips to be bent to open the cells.

Even with rework, there is typically degradation of flow through the vent panel 10.

In addition, the rework often results in an aesthetically undesirable appearance.

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