255 results about "Electromagnetic interference shielding" patented technology

Methods, systems, and apparatuses for grounding of integrated external electromagnetic interference (EMI) shields are provided. A portion of a module substrate, different from a circuit board substrate, may protrude past the module as a location for one or more grounding pads to which the EMI shield is grounded. The EMI shield may cover at least a portion of the thickness of the module substrate. The EMI shield may be comprised of one or more parts, which may be coupled to one another. The module substrate may include conductive vias. The EMI shield may include a sprayed and / or printed coating. The EMI shield may include a darkened coating.

A self-adaptive electromagnetic interference shielding and signal enhancement system belongs to the field of electronics and communication and comprises a signal feature analysis module, a dynamic shielding design module, a signal enhancement module, an intelligent adjustment module and a feedback adjustment module. According to the invention, the shielding effect and the signal enhancement strategy can be dynamically adjusted according to the change of the real-time electromagnetic environment. The intensity, the frequency and the position of an interference signal are monitored in real time through spectrum analysis and a multi-mode sensing technology. An intelligent material or a tunable structure is used to dynamically adjust electromagnetic parameters of a shielding material, and an efficient shielding effect is achieved. Various types of electromagnetic interferences, including high-frequency, low-frequency and transient interferences, can be effectively suppressed. Through a multi-sensor fusion technology, types and features of interference sources are accurately identified, and targeted shielding is realized. In a complex electromagnetic environment, a plurality of interference sources can be processed at the same time, and signal distortion or loss is avoided.

An assembly is provided which includes a package and a printed circuit board. The package includes a housing bounding a region and an acoustic sensor within the region. The housing includes a base with a first hole. The sensor is configured to generate signals indicative of sound received by the sensor through the first hole. The printed circuit board is in mechanical communication with the base and includes a second hole aligned with the first hole such that sound received by the second hole propagates through the first hole to the sensor. The printed circuit board further includes an electrically conductive layer, at least a portion of which extends across the second hole and is configured to allow the sound to propagate through the second hole and to at least partially shield the region containing the sensor from electromagnetic interference.

The present disclosure is directed polymer-free, non-composite densified carbon nanotube (DCN) structures from thin carbon nanotube (CNT) films and methods of making the same. CNT thin films can be cut, folded, stacked and pre-arranged in the form of cylinders, discs, domes, frames, gaskets, jars, rings, sacks, seals and sheets on a smooth reaction vessel surface and subsequently densified with the use of chlorosulfonic acid (HClSO3) at elevated temperatures. The disclosed DCN structures can be used as EMI shielding, lightweight structural and functional components in extreme conditions commonly encountered in space exploration, polar expeditions and military operations, and also as hydrophilic filtration media that resist surface fouling and provide high flux.

The utility model provides a display panel, a display module and a display device. The display panel comprises a first area used for arranging a driving chip, and a first protection layer is arranged on one side of the first area; in the first direction, the first protective layer sequentially comprises a first insulating layer and a first electromagnetic interference shielding layer; in the second direction, the first insulating layer and the first electromagnetic interference shielding layer are the same in size, and the second direction is perpendicular to the first direction. According to the technical scheme, the electrostatic discharge protection capability of the display device can be improved, and then the probability that the display device is damaged is reduced.

A battery pack with electromagnetic compatibility (EMC) for an electric vehicle is presented that includes a battery pack housing, at least one battery module enclosed within the battery pack housing, and an electronics assembly enclosed within the battery pack housing, in which the electronics assembly comprises a DC-DC converter and an electronics assembly casing, wherein at least one of the electronics assembly and battery pack housing includes an electromagnetic interference (EMI) shield to enable EMC. The electronics assembly includes a battery management system (BMS) circuit board and a DC-DC converter control circuit board and a DC-DC converter power electronics board. The electronics assembly is of substantially a same dimension of a battery module, in which the EMI shield comprises at least one of a metallic screen, metallic wires, a metallic tape, a metallic sheet, a metallic coating, paramagnetic materials, carbon based materials and metallic and / or carbon particle-infused composites.

A paddle card includes a printed circuit board (PCB), a shielded cable, and an electromagnetic interference (EM) shield. The PCB includes a first metal layer on a top surface of the PCB, a second metal layer within the PCB, and a cavity in the top surface of the PC. The cavity exposes the second metal layer. The first metal layer includes a first ground pad. The second metal layer includes a signal pad located within the cavity. The shielded cable includes a signal conductor coupled to the first signal pad. The EMI shield is coupled to the ground pad and covers the cavity.

A laminate transformer includes a multilayer substrate having at least first, second, third, and fourth metal layers. The second metal layer and the third metal layer are separated by a voltage barrier having a thickness. A first multiloop coil has at least a first loop on the first metal layer and at least a second loop on the second metal layer. A second multiloop coil has at least a third loop on the third metal layer and at least a fourth loop on the fourth metal layer. A partial EMI shield for the first multiloop coil is on the second metal layer. A partial EMI shield for the second multiloop coil is on the third metal layer.

Provided is a housing comprising, a plastic assembly comprising a plastic “B” cover having one or more snap on plastic hooks protruding therefrom and one or more grooves cut therein, a display panel sandwiched into the plastic assembly behind the plastic “B” cover, in front of an electromagnetic interference shielding (EMI) material, and a plastic “A” cover having one or more grooves cut therein, the plastic assembly held together by one or more clips sliding along each side of the plastic assembly, and within the one or more grooves of the plastic “B” cover and one or more snap on plastic hooks and the one or more grooves of the plastic “A” cover, the EMI material has one or more press-on grommets which are pressed onto one or more plastic buttons protruding from a surface of the plastic “A” cover to secure the EMI material to the plastic “A” cover.

In one embodiment, a housing is coupled to a device connector (e.g., an M.2-compatible expansion slot) on a circuit board. The housing may be a conductive material (e.g., metal) and sized to cover a device coupled to the connector such that the device may be substantially encompassed by the housing and the circuit board. The housing may contact, directly or indirectly, the device to provide thermal transfer. In addition, the housing may be connected to ground to provide electromagnetic interference (EMI) shielding of the device.

The present disclosure provides an electromagnetic interference testing system and method for an electric automobile under dynamic working conditions. The method includes the steps of: estimating electromagnetic interference presence state information about each of all wiring harnesses connected to a motor driving device based on operation state data, and identifying an abnormal wiring harness in which a signal conduction interference event occurs; tracking and identifying an electromagnetic interference signal of the abnormal wiring harness to obtain propagation path information, and determining, based on this, an electronic device which may be affected by the electromagnetic interference signal inside the electric automobile; and determining whether an operation disorder event occurs in the electronic device, and determining an electromagnetic interference concentrated circuit interval inside the electronic device, which is convenient for subsequent electromagnetic interference shielding processing for corresponding circuit intervals.

Composite materials for simultaneous thermal management and electromagnetic interference screening of radiofrequency-based electronic systems are provided. The materials contain a phase change material and one or more electrically and thermally conductive filler particles. The materials provide a passive system for thermal management and EMI shielding that is lightweight, does not contain moving parts, and does not require an external power supply.

Provided is a consolidated plastic human-machine interface (HMI) chassis comprising: one or more input devices, adjacent to electromagnetic interference (EMI) shielding material, the one or more input devices and electromagnetic interference (EMI) shielding material heat staked with a plurality of plastic heat stakes to a printed circuit board (PCB). The consolidated plastic human-machine interface (HMI) chassis may improve a variety of electronic devices such as laptops, tablets, notebooks, desktop computers, televisions, gaming devices, advertising displays, and others.

The invention discloses a bacterial cellulose / silver nanowire / MXene composite conductive film and a preparation method thereof, and relates to the technical field of flexible conductive materials. The composite film comprises a bacterial cellulose substrate, an MXene conductive layer and a silver nanowire conductive network layer. The preparation method comprises the following steps: S1, preparing bacterial cellulose dispersion liquid; s2, preparation of an MXene dispersion liquid; s3, preparing a silver nanowire dispersion liquid; and S4, preparing the composite film. The composite film with a Janus structure is prepared through a vacuum-assisted layer-by-layer filtering process, and the composite film has high mechanical performance, low square resistance, excellent electromagnetic interference shielding effectiveness, rapid Joule heating performance and excellent environmental stability and mechanical durability. The problem that an existing flexible electromagnetic shielding material is difficult to consider ultrathin performance, high flexibility, strong mechanical performance and multifunctional integration is solved, and the flexible electromagnetic shielding material has wide application prospects in the fields of electromagnetic shielding, flexible electronic devices, wearable heaters and the like.

The present technology provides a curable silicone-based composition comprising a curable silicone polymer, a catalyst, an electrically conductive filler, and carbon nanostructures. The combination of the electrically conductive filler and the carbon nanostructures provide a cured material that exhibit good electrical conductivity and electromagnetic interference shielding.

Apparatuses relating generally to a microelectronic package having protection from electromagnetic interference are disclosed. In an apparatus thereof, a platform has an upper surface and a lower surface opposite the upper surface and has a ground plane. A microelectronic device is coupled to the upper surface of the platform. Wire bond wires are coupled to the ground plane with a pitch. The wire bond wires extend away from the upper surface of the platform with upper ends of the wire bond wires extending above an upper surface of the microelectronic device. The wire bond wires are spaced apart from one another to provide a fence-like perimeter to provide an interference shielding cage. A conductive layer is coupled to at least a subset of the upper ends of the wire bond wires for electrical conductivity to provide a conductive shielding layer to cover the interference shielding cage.

The present invention relates to ink formulations based on silver nanoparticles which can be advantageously used for electromagnetic interference ("EMI") shielding coatings of semiconductor chips, in particular epoxy molding compound ("EMC") chips; in particular, the present invention relates to such silver nanoparticle-based ink formulations which are stable, have improved electrical conductivity and are particularly suitable for application by spraying.

An electronic device includes at least a first radio frequency (RF) path structure and a second RF path structure; and an electromagnetic shield disposed between the first RF path structure and the second RF path structure. The electromagnetic shield comprises a plurality of fence posts extending through at least one dielectric layer and having first ends electrically connected to a common ground metallization layer, and at least one metallization layer overlying the at least one dielectric layer and electrically interconnecting second ends of the plurality of fence posts. The at least one metallization layer interconnects the second ends of the plurality of fence posts in a conductive mesh pattern.

In various embodiments, the present application provides electrically conductive metal-plated fibers and continuous processes of preparing metal-plated fibers. Additionally, provided are polymeric articles comprising the provided metal-plated fibers or other fibers prepared by the provided process, said articles having electromagnetic interference shielding effectiveness.

The utility model relates to the technical field of circuit boards, in particular to a circuit board electromagnetic interference shielding structure which comprises a positioning installation strip block and a circuit board body, a limiting sliding groove is formed in the side wall of the positioning installation strip block, and a clamping driving assembly is installed in the limiting sliding groove. A first clamping and positioning strip block and a second clamping and positioning strip block are installed on the clamping driving assembly, the first clamping and positioning strip block and the second clamping and positioning strip block are connected to the two sides of the circuit board body in a clamped mode and used for clamping and fixing the circuit board body, and installation sliding grooves are formed in the tops of the first clamping and positioning strip block and the second clamping and positioning strip block correspondingly; a movable adjusting assembly is installed in the installation sliding groove, a U-shaped shielding plate is installed on the movable adjusting assembly, and the circuit board body is covered with the U-shaped shielding plate. The position of the U-shaped shielding plate can be flexibly adjusted according to the size of the circuit board body, comprehensive coverage is ensured, electromagnetic interference is effectively shielded, meanwhile, circuit board bodies of different sizes can be stably installed, and practicability is higher.

Methods, systems, and apparatuses for electromagnetic interference (EMI) shielding are provided. An apparatus comprises a plurality of electrical components coupled to a substrate. The plurality of electrical components comprises a first electrical component coupled to a first region of the substrate and at least one other electrical component coupled to at least one other region of the substrate. The first electrical component is configured to emit electromagnetic waves. The apparatus also comprises an EMI shield forming a conductive envelopment around the first region. The first electrical component is inside the conductive envelopment and the one other electrical component is outside of the conductive envelopment. The EMI shield comprises an aperture positioned above the first electrical component. The apparatus further comprises a lens coupled to the EMI shield. The lens is positioned above the first electrical component and is substantially aligned with the aperture.

In one embodiment, a housing is provided that includes a plastic assembly including a plastic "B" cover having one or more snap plastic hooks projecting therefrom and one or more grooves cut therein; a display panel sandwiched in the plastic assembly behind the plastic "B" cover and in front of an electromagnetic interference shielding (EMI) material; and a plastic "A" cover having one or more grooves cut therein, the plastic assembly being held together by one or more clips sliding along each side of the plastic assembly and within the one or more grooves of the plastic "B" cover and within the one or more snap plastic hooks and the one or more grooves of the plastic "A" cover, the EMI material has one or more push grommets that are pressed onto one or more plastic buttons protruding from a surface of the plastic "A" cover to secure the EMI material to the plastic "A" cover.

The present disclosure provides an optical sensor module. An example optical sensor module includes a light-emitting device; a light-receiving sensor; and a module cap adapted to at least partially cover the light-emitting device and the light-receiving sensor, the module cap being a molded cap, the molded cap being formed of a molding material comprising electrically conductive particles dispersed therein for providing electromagnetic interference shielding.

Materials are provided that can be used for electromagnetic interference (EMI) shielding, and methods of fabricating the same and methods of using the same are also provided. Polymer-based fiber thin films can have superior electrical conductivity and excellent EMI shielding efficiency while being ultra-flexible and ultra-lightweight. The fiber thin films can be dual polymer thin films and can incorporate quantum dots (QDs) (e.g., magnetic quantum dots) and / or two-dimensional (2D) conductive nanomaterials within a dual polymer matrix comprising a conductive polymer and a nonconductive polymer. The resultant composite thin film can have low density, high porosity, and high electrical conductivity.

This utility model discloses a multi-band module for a remote control board, including a bottom housing, a through-hole connecting rod, a heat sink, an electromagnetic interference shielding cover, a circuit board, and a control cover. The through-hole connecting rod, integrally injection molded into the inner groove of the bottom housing, is connected to the through hole of the circuit board. The heat sink is installed at the bottom of the circuit board, and the electromagnetic interference shielding cover is installed at the top of the circuit board. The bottom housing and the control cover are snap-fitted together. This multi-band module for a remote control board is designed for rapid heat dissipation and electromagnetic interference protection of the circuit board. The heat generated by the circuit board during operation is conducted and dissipated through the heat-conducting plate and the bottom alloy heat sink. The mounting screws are connected to the mounting track groove through the threaded holes, so the electromagnetic interference shielding cover can be adjusted widely according to the position of the electronic components. The outer shielding cover, together with the electromagnetic interference shielding plate, is designed to prevent electromagnetic interference of the electronic components.

1. A phased antenna array calibration station, comprising: an enclosure including: a rectangular first internal room including at least one exterior door, a power supply, a cooling unit, a control device configured to control power, cooling, and testing within the second internal room, and an antenna under test (AUT); and a rectangular second internal room including at least one interior door abutting the first internal room, an opening in one wall of the second internal room, radio frequency (RF) absorbing material covering all interior surfaces of the second internal room, and at least one movable electromagnetic interference (EMI) shield configured to form an EMI seal around the opening and active elements of the AUT aligned with the opening; and a support fixture configured to support the AUT and align the active elements of the AUT with the opening in the second internal room including a cooling and electronics unit (CEU) configured to cool the AUT and operate the AUT.

Materials are provided that can be used for electromagnetic interference (EMI) shielding, and methods of fabricating the same and methods of using the same are also provided. Polymer-based fiber thin films can have superior electrical conductivity and excellent EMI shielding efficiency while being ultra-flexible and ultra-lightweight. The fiber thin films can be dual polymer thin films and can incorporate quantum dots (QDs) (e.g., magnetic quantum dots) and / or two-dimensional (2D) conductive nanomaterials within a dual polymer matrix comprising a conductive polymer and a nonconductive polymer. The resultant composite thin film can have low density, high porosity, and high electrical conductivity.

The present invention relates to a semiconductor package. The semiconductor package of the present invention includes a package substrate, a first semiconductor die disposed on the package substrate, a second semiconductor die disposed on the package substrate to be spaced apart from the first semiconductor die, and at least one capacitor disposed on at least one electrical path between the first semiconductor die and the second semiconductor die, wherein the at least one capacitor includes a first pad or bump connected to the first semiconductor die and a second pad or bump connected to the second semiconductor die, and alternating current (AC)-couples the first semiconductor die and the second semiconductor die, thereby enhancing electromagnetic interference (EMI) shielding performance of chip-to-chip communication and improving signal integrity.