691 results about "Electromagnetic interference shielding" patented technology

The present disclosure relates to a semiconductor device package which includes a carrier, an electronic component, conductive elements, a package body, a shield, a magnetic insulating layer, and a patterned conductive layer. The carrier has a top surface on which the electronic component is disposed. The conductive elements are disposed on the top surface of the carrier. The package body is disposed on the top surface of the carrier and encapsulates the electronic component and a portion of each of the conductive elements. The shield is disposed on the package body and covers an exterior of the package body. The magnetic insulating layer is disposed on a top surface of the shield. The patterned conductive layer is disposed on the magnetic insulating layer. Each of the conductive elements electrically connects the patterned conductive layer to the electronic component.

A semiconductor package includes a substrate, a semiconductor die, a package body, an electromagnetic interference shield, a dielectric structure and an antenna element. The substrate comprises a grounding segment and a feeding point. The semiconductor die is disposed on the substrate. The package body encapsulates the semiconductor die. The electromagnetic interference shield is formed on the package body. The dielectric structure encapsulates the electromagnetic interference shield. The antenna element is formed on the dielectric structure and electrically connecting the grounding segment of the substrate and the feeding point.

A fully integrated, low cost, amplified electro-acoustic loudspeaker is disclosed in which an amplifier circuit (30, 130, 230, 330, 930, 1030), radio-frequency receiver amplifier circuit (430, 530), optical receiver amplifier circuit (630, 730), or network based amplifier circuit (830) is directly mounted on the loudspeaker's magnetic assembly (105, 505, 705, 805), contained within the loudspeaker's moving assembly (20, 29, 629, 42, 45, 50, 65), or a combination thereof. The amplified loudspeaker's magnetic assembly (5, 105, 405, 505, 705, 805, 905, 1005) is utilized as an electro-magnetic interference shield and/or a heat dissipating element for the attached electronic circuitry. In selected embodiments of the amplified loudspeaker system, the former (42) containing voice coil (45) is additionally utilized for convection cooling of the amplifier circuit (30, 230) or receiver/amplifier circuit combination (430, 630).

A semiconductor device package includes a semiconductor device mounted and electrically coupled to a substrate, a package body encapsulating the semiconductor device against a portion of an upper surface of the substrate; and an electromagnetic interference shielding layer formed over the package body and substantially enclosing the semiconductor device. The present invention further provides methods for manufacturing the semiconductor device package.

Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a substrate unit including a grounding element; (2) a semiconductor device disposed adjacent to an upper surface of the substrate unit; (3) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device; and (4) an EMI shield disposed adjacent to exterior surfaces of the package body and electrically connected to a connection surface of the grounding element. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit, and the connection surface of the grounding element is electrically exposed adjacent to the lateral surface of the substrate unit. The grounding element corresponds to a remnant of an internal grounding via, and provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield.

Heat dissipation and electromagnetic interference (EMI) shielding for an electronic device having an enclosure. An interior surface of the enclosure is covered with a conformal metallic layer which, as disposed in thermal adjacency with one or more heat-generating electronic components or other sources contained within the enclosure, may provide both thermal dissipation and EMI shielding for the device. The layer may be sprayed onto the interior surface in a molten state and solidified to form a self-adherent coating.

A jacket for radio frequency (RF) shielding a Magnetic Resonance Device (MRD) from external environment electromagnetic interference during its operation, which allows for homogenized imaging conditions. The RF shielding jacket is sized and shaped like an envelope to accommodate the MRD, with at least a portion of the RF shielding jacket including an electromagnetic interference shield. The RF shielding jacket is also combined with passive temperature insulating properties.

A chip package including at least a shielding layer for better electromagnetic interferences shielding is provided. The shielding layer disposed over the top surface of the laminate substrate can protect the chip package from the underneath EMI radiation. The chip package may further include another shielding layer over the molding compound of the chip package.

A chip package including a shielding layer having a plurality of conductive connectors for better electromagnetic interferences shielding is provided. The conductive connectors can be flexibly arranged within the molding compound for better shielding performance. The shielding layer having the conductive connectors functions as the EMI shield and the shielding layer is electrically grounded within the package structure.

Electromagnetic interference (EMI) shielding structure and methods of making such structures are provided. In one case, a method is provided for making a lightweight composite structure for electromagnetic interference shielding, including the steps of providing a nanoscale fiber film which comprises a plurality of nanoscale fibers; and combining the nanoscale fiber film with one or more structural materials to form a composite material which is effective as an electromagnetic interference shielding structure. In another case, a method is provided for shielding a device which includes an electrical circuit from electromagnetic interference comprising the steps of providing a nanoscale fiber film which comprises a plurality of nanoscale fibers; and incorporating the nanoscale fiber film into an exterior portion of the device to shield an interior portion of the device from electromagnetic interference.

A composite material for electromagnetic interference shielding is provided. The composite material comprises a stack including at least two electrically conductive nanoscale fiber films, which are spaced apart from one another by at least one insulating gap positioned between the at least two nanoscale fiber films. The stack is effective to provide a substantial multiple internal reflection effect. An electromagnetic interference shielded apparatus and a method for shielding an electrical circuit from electromagnetic interference is provided

A printed circuit board (PCB) assembly is provided that includes a PCB, an integrated circuit package, an electromagnetic interference (EMI) shield ring, and a heat sink lid. A first surface of the package is mounted to a first surface of the PCB. The EMI shield ring is mounted to the first surface of the PCB in a ring around the package. A first surface of the heat sink lid includes a recessed region and first and second supporting portions separated by the recessed region. The heat sink lid is mated with the EMI shield ring such that the package is positioned in an enclosure formed by the EMI shield ring and the recessed region of the heat sink lid. A second surface of the package may interface with a surface of the recessed region.

A fiber optic gasket includes one or more apertures to individually retain optical fibers from one or more fiber optic cards positioned within an enclosure. A slit within the fiber optic gasket associated with each aperture facilitates placement of an optical fiber within an aperture. The fiber optic gasket includes a layer of conductive material for electromagnetic interference protection. When installed in the enclosure, the fiber optic gasket comes in contact with a door that is removably connected to the enclosure. An electro-magnetic interference shield is provided at the interface between the door and the fiber optic gasket. Optical fibers can extend out of the enclosure without causing harmful electromagnetic energy from leaving or entering the enclosure.

An improved EMI shielded detection system. The disclosed system may include features configured to increase radio wave and microwave absorbance while retaining significant transparency at visible and/or infrared wavelengths, thus increasing EMI shielding efficiency. This may be accomplished through the use of a conductive mesh having appropriately chosen dimensions and spacing, and embedded in a transparent medium. To minimize the impact of the mesh on the effective aperture of the medium, the strands of the mesh may be made relatively narrow, and to provide sufficient shielding despite the narrow strand width, the mesh may be embedded relatively deeply in the medium.

A chip package including a plurality of conductive bodies and a shielding layer for better electromagnetic interferences shielding is provided. The shielding layer over the molding compound contacts with the conductive bodies disposed on the substrate, and the shielding layer and the conductive bodies function as EMI shield. The shielding layer is electrically grounded through the conductive bodies connected to the laminate substrate and the ground plane of the substrate.

A method of manufacture of an integrated circuit packaging system includes: providing a lead frame having a die attach paddle pad and a peripheral lead pad with an inner lead pad between the die attach paddle pad and the peripheral lead pad; forming a component side of the lead frame for exposing an upper portion of a peripheral lead under the peripheral lead pad; forming an encapsulation on the lead frame and the upper portion of the peripheral lead; exposing the peripheral lead pad; depositing a conductive shielding layer on the encapsulation connected to the peripheral lead pad; and forming a mounting side of the lead frame for forming a lower portion of the peripheral lead over a peripheral lead contact pad.

This invention relates to computer systems and hardware, and in particular to a radial computer system, hardware for building a radial computer system and a method for building a radial computer system. According to one aspect of the invention, a clustering concept for a scalable computer system includes computer elements aligned by a joiner into an arc shaped configuration. The radial configuration of the cluster and associated hardware provide a computer system that reduces high speed cable lengths, provides additional connection points for the increased number of cable connections, provides electromagnetic interference shielding, and provides additional space for cooling hardware. These features result in an improved scalable computer system.