191 results about "Electromagnetic interference shielding" patented technology

Methods, systems, and apparatuses for grounding of integrated external electromagnetic interference (EMI) shields are provided. A portion of a module substrate, different from a circuit board substrate, may protrude past the module as a location for one or more grounding pads to which the EMI shield is grounded. The EMI shield may cover at least a portion of the thickness of the module substrate. The EMI shield may be comprised of one or more parts, which may be coupled to one another. The module substrate may include conductive vias. The EMI shield may include a sprayed and / or printed coating. The EMI shield may include a darkened coating.

An assembly is provided which includes a package and a printed circuit board. The package includes a housing bounding a region and an acoustic sensor within the region. The housing includes a base with a first hole. The sensor is configured to generate signals indicative of sound received by the sensor through the first hole. The printed circuit board is in mechanical communication with the base and includes a second hole aligned with the first hole such that sound received by the second hole propagates through the first hole to the sensor. The printed circuit board further includes an electrically conductive layer, at least a portion of which extends across the second hole and is configured to allow the sound to propagate through the second hole and to at least partially shield the region containing the sensor from electromagnetic interference.

The present disclosure is directed polymer-free, non-composite densified carbon nanotube (DCN) structures from thin carbon nanotube (CNT) films and methods of making the same. CNT thin films can be cut, folded, stacked and pre-arranged in the form of cylinders, discs, domes, frames, gaskets, jars, rings, sacks, seals and sheets on a smooth reaction vessel surface and subsequently densified with the use of chlorosulfonic acid (HClSO3) at elevated temperatures. The disclosed DCN structures can be used as EMI shielding, lightweight structural and functional components in extreme conditions commonly encountered in space exploration, polar expeditions and military operations, and also as hydrophilic filtration media that resist surface fouling and provide high flux.

A battery pack with electromagnetic compatibility (EMC) for an electric vehicle is presented that includes a battery pack housing, at least one battery module enclosed within the battery pack housing, and an electronics assembly enclosed within the battery pack housing, in which the electronics assembly comprises a DC-DC converter and an electronics assembly casing, wherein at least one of the electronics assembly and battery pack housing includes an electromagnetic interference (EMI) shield to enable EMC. The electronics assembly includes a battery management system (BMS) circuit board and a DC-DC converter control circuit board and a DC-DC converter power electronics board. The electronics assembly is of substantially a same dimension of a battery module, in which the EMI shield comprises at least one of a metallic screen, metallic wires, a metallic tape, a metallic sheet, a metallic coating, paramagnetic materials, carbon based materials and metallic and / or carbon particle-infused composites.

A paddle card includes a printed circuit board (PCB), a shielded cable, and an electromagnetic interference (EM) shield. The PCB includes a first metal layer on a top surface of the PCB, a second metal layer within the PCB, and a cavity in the top surface of the PC. The cavity exposes the second metal layer. The first metal layer includes a first ground pad. The second metal layer includes a signal pad located within the cavity. The shielded cable includes a signal conductor coupled to the first signal pad. The EMI shield is coupled to the ground pad and covers the cavity.

Provided is a housing comprising, a plastic assembly comprising a plastic “B” cover having one or more snap on plastic hooks protruding therefrom and one or more grooves cut therein, a display panel sandwiched into the plastic assembly behind the plastic “B” cover, in front of an electromagnetic interference shielding (EMI) material, and a plastic “A” cover having one or more grooves cut therein, the plastic assembly held together by one or more clips sliding along each side of the plastic assembly, and within the one or more grooves of the plastic “B” cover and one or more snap on plastic hooks and the one or more grooves of the plastic “A” cover, the EMI material has one or more press-on grommets which are pressed onto one or more plastic buttons protruding from a surface of the plastic “A” cover to secure the EMI material to the plastic “A” cover.

In one embodiment, a housing is coupled to a device connector (e.g., an M.2-compatible expansion slot) on a circuit board. The housing may be a conductive material (e.g., metal) and sized to cover a device coupled to the connector such that the device may be substantially encompassed by the housing and the circuit board. The housing may contact, directly or indirectly, the device to provide thermal transfer. In addition, the housing may be connected to ground to provide electromagnetic interference (EMI) shielding of the device.

The present disclosure provides an electromagnetic interference testing system and method for an electric automobile under dynamic working conditions. The method includes the steps of: estimating electromagnetic interference presence state information about each of all wiring harnesses connected to a motor driving device based on operation state data, and identifying an abnormal wiring harness in which a signal conduction interference event occurs; tracking and identifying an electromagnetic interference signal of the abnormal wiring harness to obtain propagation path information, and determining, based on this, an electronic device which may be affected by the electromagnetic interference signal inside the electric automobile; and determining whether an operation disorder event occurs in the electronic device, and determining an electromagnetic interference concentrated circuit interval inside the electronic device, which is convenient for subsequent electromagnetic interference shielding processing for corresponding circuit intervals.

Composite materials for simultaneous thermal management and electromagnetic interference screening of radiofrequency-based electronic systems are provided. The materials contain a phase change material and one or more electrically and thermally conductive filler particles. The materials provide a passive system for thermal management and EMI shielding that is lightweight, does not contain moving parts, and does not require an external power supply.

Provided is a consolidated plastic human-machine interface (HMI) chassis comprising: one or more input devices, adjacent to electromagnetic interference (EMI) shielding material, the one or more input devices and electromagnetic interference (EMI) shielding material heat staked with a plurality of plastic heat stakes to a printed circuit board (PCB). The consolidated plastic human-machine interface (HMI) chassis may improve a variety of electronic devices such as laptops, tablets, notebooks, desktop computers, televisions, gaming devices, advertising displays, and others.

The invention discloses a bacterial cellulose / silver nanowire / MXene composite conductive film and a preparation method thereof, and relates to the technical field of flexible conductive materials. The composite film comprises a bacterial cellulose substrate, an MXene conductive layer and a silver nanowire conductive network layer. The preparation method comprises the following steps: S1, preparing bacterial cellulose dispersion liquid; s2, preparation of an MXene dispersion liquid; s3, preparing a silver nanowire dispersion liquid; and S4, preparing the composite film. The composite film with a Janus structure is prepared through a vacuum-assisted layer-by-layer filtering process, and the composite film has high mechanical performance, low square resistance, excellent electromagnetic interference shielding effectiveness, rapid Joule heating performance and excellent environmental stability and mechanical durability. The problem that an existing flexible electromagnetic shielding material is difficult to consider ultrathin performance, high flexibility, strong mechanical performance and multifunctional integration is solved, and the flexible electromagnetic shielding material has wide application prospects in the fields of electromagnetic shielding, flexible electronic devices, wearable heaters and the like.

Apparatuses relating generally to a microelectronic package having protection from electromagnetic interference are disclosed. In an apparatus thereof, a platform has an upper surface and a lower surface opposite the upper surface and has a ground plane. A microelectronic device is coupled to the upper surface of the platform. Wire bond wires are coupled to the ground plane with a pitch. The wire bond wires extend away from the upper surface of the platform with upper ends of the wire bond wires extending above an upper surface of the microelectronic device. The wire bond wires are spaced apart from one another to provide a fence-like perimeter to provide an interference shielding cage. A conductive layer is coupled to at least a subset of the upper ends of the wire bond wires for electrical conductivity to provide a conductive shielding layer to cover the interference shielding cage.

An electronic device includes at least a first radio frequency (RF) path structure and a second RF path structure; and an electromagnetic shield disposed between the first RF path structure and the second RF path structure. The electromagnetic shield comprises a plurality of fence posts extending through at least one dielectric layer and having first ends electrically connected to a common ground metallization layer, and at least one metallization layer overlying the at least one dielectric layer and electrically interconnecting second ends of the plurality of fence posts. The at least one metallization layer interconnects the second ends of the plurality of fence posts in a conductive mesh pattern.

In various embodiments, the present application provides electrically conductive metal-plated fibers and continuous processes of preparing metal-plated fibers. Additionally, provided are polymeric articles comprising the provided metal-plated fibers or other fibers prepared by the provided process, said articles having electromagnetic interference shielding effectiveness.

Methods, systems, and apparatuses for electromagnetic interference (EMI) shielding are provided. An apparatus comprises a plurality of electrical components coupled to a substrate. The plurality of electrical components comprises a first electrical component coupled to a first region of the substrate and at least one other electrical component coupled to at least one other region of the substrate. The first electrical component is configured to emit electromagnetic waves. The apparatus also comprises an EMI shield forming a conductive envelopment around the first region. The first electrical component is inside the conductive envelopment and the one other electrical component is outside of the conductive envelopment. The EMI shield comprises an aperture positioned above the first electrical component. The apparatus further comprises a lens coupled to the EMI shield. The lens is positioned above the first electrical component and is substantially aligned with the aperture.

In one embodiment, a housing is provided that includes a plastic assembly including a plastic "B" cover having one or more snap plastic hooks projecting therefrom and one or more grooves cut therein; a display panel sandwiched in the plastic assembly behind the plastic "B" cover and in front of an electromagnetic interference shielding (EMI) material; and a plastic "A" cover having one or more grooves cut therein, the plastic assembly being held together by one or more clips sliding along each side of the plastic assembly and within the one or more grooves of the plastic "B" cover and within the one or more snap plastic hooks and the one or more grooves of the plastic "A" cover, the EMI material has one or more push grommets that are pressed onto one or more plastic buttons protruding from a surface of the plastic "A" cover to secure the EMI material to the plastic "A" cover.

Materials are provided that can be used for electromagnetic interference (EMI) shielding, and methods of fabricating the same and methods of using the same are also provided. Polymer-based fiber thin films can have superior electrical conductivity and excellent EMI shielding efficiency while being ultra-flexible and ultra-lightweight. The fiber thin films can be dual polymer thin films and can incorporate quantum dots (QDs) (e.g., magnetic quantum dots) and / or two-dimensional (2D) conductive nanomaterials within a dual polymer matrix comprising a conductive polymer and a nonconductive polymer. The resultant composite thin film can have low density, high porosity, and high electrical conductivity.

This utility model discloses a multi-band module for a remote control board, including a bottom housing, a through-hole connecting rod, a heat sink, an electromagnetic interference shielding cover, a circuit board, and a control cover. The through-hole connecting rod, integrally injection molded into the inner groove of the bottom housing, is connected to the through hole of the circuit board. The heat sink is installed at the bottom of the circuit board, and the electromagnetic interference shielding cover is installed at the top of the circuit board. The bottom housing and the control cover are snap-fitted together. This multi-band module for a remote control board is designed for rapid heat dissipation and electromagnetic interference protection of the circuit board. The heat generated by the circuit board during operation is conducted and dissipated through the heat-conducting plate and the bottom alloy heat sink. The mounting screws are connected to the mounting track groove through the threaded holes, so the electromagnetic interference shielding cover can be adjusted widely according to the position of the electronic components. The outer shielding cover, together with the electromagnetic interference shielding plate, is designed to prevent electromagnetic interference of the electronic components.

1. A phased antenna array calibration station, comprising: an enclosure including: a rectangular first internal room including at least one exterior door, a power supply, a cooling unit, a control device configured to control power, cooling, and testing within the second internal room, and an antenna under test (AUT); and a rectangular second internal room including at least one interior door abutting the first internal room, an opening in one wall of the second internal room, radio frequency (RF) absorbing material covering all interior surfaces of the second internal room, and at least one movable electromagnetic interference (EMI) shield configured to form an EMI seal around the opening and active elements of the AUT aligned with the opening; and a support fixture configured to support the AUT and align the active elements of the AUT with the opening in the second internal room including a cooling and electronics unit (CEU) configured to cool the AUT and operate the AUT.

Materials are provided that can be used for electromagnetic interference (EMI) shielding, and methods of fabricating the same and methods of using the same are also provided. Polymer-based fiber thin films can have superior electrical conductivity and excellent EMI shielding efficiency while being ultra-flexible and ultra-lightweight. The fiber thin films can be dual polymer thin films and can incorporate quantum dots (QDs) (e.g., magnetic quantum dots) and / or two-dimensional (2D) conductive nanomaterials within a dual polymer matrix comprising a conductive polymer and a nonconductive polymer. The resultant composite thin film can have low density, high porosity, and high electrical conductivity.

The present invention relates to a semiconductor package. The semiconductor package of the present invention includes a package substrate, a first semiconductor die disposed on the package substrate, a second semiconductor die disposed on the package substrate to be spaced apart from the first semiconductor die, and at least one capacitor disposed on at least one electrical path between the first semiconductor die and the second semiconductor die, wherein the at least one capacitor includes a first pad or bump connected to the first semiconductor die and a second pad or bump connected to the second semiconductor die, and alternating current (AC)-couples the first semiconductor die and the second semiconductor die, thereby enhancing electromagnetic interference (EMI) shielding performance of chip-to-chip communication and improving signal integrity.

The invention belongs to the technical field of intelligent soft materials, and particularly relates to a cold atmospheric pressure plasma modified electromagnetic interference shielding hydrogel material, which is prepared from the following raw materials: 0.2 g of chitosan, 3 g of acrylic acid, 0.5 g of dimethylaminoethyl methacrylate, 2.5 mg of N, N '-methylene bisacrylamide, 100 [mu] L of 0.4 Mol / L 2, 2'-azobis (2-methylpropanamidine) dihydrochloride, and 2 mL of Ti3C2 MXene dispersion liquid. The preparation method comprises the following steps: mixing chitosan, acrylic acid and other raw materials, carrying out ice-water bath ultrasonic dispersion, introducing cold atmospheric pressure plasma (CAP) to modify MXene, and carrying out thermal polymerization to form hydrogel; according to the invention, the bonding force between the MXene and the substrate is enhanced, high mechanical property and terahertz wave band high shielding effectiveness are realized, the process is simplified, the use amount of the MXene is reduced, and the requirements of flexible electronics and wearable equipment are met.

The present application relates to a kind of preparation methods of PDMS-AgNW / MXene / AgNW composite film, it includes the following steps, S1 AgNW aqueous solution and MXene aqueous solution are alternately passed through vacuum-assisted filtration each other, after assembly is completed, post-processing is obtained AgNW / MXene / AgNW film;S2 PDMS is pre-cured in the presence of curing agent, and PDMS film is obtained;S3 the PDMS film obtained by S2 is transferred to at least one side surface of the AgNW / MXene / AgNW film obtained by S1, after bonding is completed, post-processing is obtained PDMS-AgNW / MXene / AgNW composite film.The present application realizes the purpose of high electromagnetic interference shielding, high mechanical stability and integrated excellent strain sensing function using ultrathin functional layer, realizes the application of composite film in electromagnetic interference shielding and human motion detection field.

This utility model discloses a mouse device with identity authentication function, relating to the field of mouse technology. It includes: a mouse body with an internal PCB motherboard integrating a charging management chip, an MCU control chip, a FIDO 2.0 authentication chip, and an NFC communication chip; a fingerprint recognition module disposed on the upper surface of the mouse body and connected to the MCU control chip via an SPI bus; an NFC antenna surrounding the bottom of the mouse body and connected to the NFC communication chip via a 50Ω microstrip line; and an electromagnetic shielding structure disposed between the bottom layer of the PCB motherboard and the top of the NFC antenna. This utility model adopts a modular structure to integrate the FIDO 2.0 authentication chip, fingerprint recognition module, NFC communication module, and MCU inside the mouse. By optimizing the PCB layout and electromagnetic interference shielding measures, it ensures that each module works collaboratively without interfering with each other, facilitating identity authentication during one-handed operation.

The invention discloses a laminated insulation shielding material based on crushed magnetic nanocrystals and a preparation method thereof. The material structurally consists of a nanocrystal unit layer and an insulation coating layer, the nanocrystalline unit layer is formed by laminating 2-4 layers of nanocrystalline strips through an adhesive and carrying out magnetic crushing treatment to form a composite strip containing regular parallelogram fragments, and an eddy current path can be effectively cut off; and the insulating coating layer adopts a polyimide adhesive tape, and after the slit nanocrystal narrow strips are attached to the center, the reserved parts on the two sides are bent upwards to form a'three-surface 'coating structure for the upper surface, the lower surface and the two side edges of the nanocrystal, so that comprehensive and reliable insulation is realized. The preparation method comprises the steps of laminating and compounding, magnetic crushing treatment, two-time slitting, transferring and attaching, and edge covering and forming. The composite material has the advantages of high frequency, low magnetic loss and high insulation reliability, is particularly suitable for electromagnetic interference shielding of electronic equipment with the frequency band from hundred kHz to MHz, and solves the technical problems that a traditional nanocrystalline material is large in high-frequency eddy current loss and prone to short circuit.

The invention belongs to the field of functional fabrics, and provides a preparation method of a terahertz wave absorption type flexible electromagnetic interference shielding fabric, which comprises the following steps: firstly, designing and configuring a composite slurry containing an active wave-absorbing substance with a set viscosity, carrying out curing molding and drying to obtain yarns coated with the active wave-absorbing substances; then, the yarns coated with the active wave-absorbing substances are used for weaving, and the terahertz wave absorption type flexible electromagnetic interference shielding fabric is obtained. Compared with most existing wave-absorbing fabrics, the active wave-absorbing fabric has the advantages that the slurry containing the active wave-absorbing substances is fully fused with the yarns, the yarns filled with the active wave-absorbing substances can be seen microcosmically, and the distribution of the active wave-absorbing substances on the surfaces of the yarns can be seen macroscopically, so that the active wave-absorbing substances are not easy to fall off; the fabric structure and the wave-absorbing effect are more stable, so that the application requirements of light weight, thinness, width and strength of the fabric in the wave-absorbing field are met to the greatest extent.

The application discloses a ladder type cable bridge capable of conveniently fixing and limiting cables, which comprises a cable bridge plate, a limiting and fixing assembly, a hoisting and reinforcing assembly, a hoisting assembly, a reinforcing ladder plate group and an adjusting and limiting assembly, a plurality of installation ventilation slots are formed in the inside of the cable bridge plate, and a plurality of installation holes one are formed in the inside of the cable bridge plate; the limiting and fixing assembly is arranged, a plurality of limiting and fixing assemblies are stacked through top planes and side wing plates, cables are erected, the limiting and straightening effects are achieved, the ventilation effect is realized, metal shielding nets are attached to the inside of glass fiber and resin composite materials as frameworks of limiting plates one and limiting plates two, the insulation performance is ensured, the structural strength is increased, the electromagnetic interference shielding effect is achieved, the convenience in use is increased, and the hollow holes are used for good ventilation, so that the heat dissipation effect is increased.

A multi-chip package includes a first chiplet including power amplifier (PA) circuitry. The multi-chip package also includes a second chiplet including low-noise amplifier (LNA) circuitry. The multi-chip package further includes an electromagnetic interference (EMI) shield between the first chiplet and the second chiplet. The multi-chip package also includes mold compound at least partially encapsulating the first chiplet, the second chiplet, and the EMI shield.