Chip package and manufacturing method thereof

a technology of chip and manufacturing method, applied in the field of semiconductor devices, can solve the problems of serious and challenging problems of electronic devices or systems, such as electromagnetic interference (emi), and achieve the effect of less effort and better design flexibility

Inactive Publication Date: 2010-05-06
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Benefits of technology

[0007]In view of the foregoing, the present invention provides a manufacturing m

Problems solved by technology

Electro-magnetic interference (EMI) is a serious and challenging problem for most electronic devices or systems.
Conventionally, EMI shielding s

Method used

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  • Chip package and manufacturing method thereof
  • Chip package and manufacturing method thereof
  • Chip package and manufacturing method thereof

Examples

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Embodiment Construction

[0023]Reference will now be made in detail to the present preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.

[0024]The manufacturing methods as described in the present invention can be used for fabricating various package structures and are more suitable for fabricating stacked type packages, multiple-chip packages, or high frequency device packages (including radio frequency device packages). Moreover, the manufacturing methods as described in the present invention are compatible with packaging processes utilizing build-up substrate manufacturing process or array substrate manufacturing process.

[0025]FIGS. 1A through 1G are schematic views showing a manufacturing method of the chip package according to the preferred embodiment of the present invention. FIGS. 1A, 1B, 1B′ and 1C are shown in three-dimension...

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Abstract

A chip package including a plurality of conductive bodies and a shielding layer for better electromagnetic interferences shielding is provided. The shielding layer over the molding compound contacts with the conductive bodies disposed on the substrate, and the shielding layer and the conductive bodies function as EMI shield. The shielding layer is electrically grounded through the conductive bodies connected to the laminate substrate and the ground plane of the substrate.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims the priority benefit of U.S. provisional application Ser. No. 61 / 109,937, filed on Oct. 31, 2008. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of specification.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a semiconductor device, and more particularly to a chip package.[0004]2. Description of Related Art[0005]Electro-magnetic interference (EMI) is a serious and challenging problem for most electronic devices or systems. As EMI disturbances commonly interrupt, degrade or limit the effective performance of the electronic device or the whole circuit of the electronic system, it is necessary for the electronic devices or systems to have efficient EMI protection to ensure the effective and safe operation.[0006]EMI protection is particularly important in small-sized, densely packaged or sensitive electro...

Claims

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Application Information

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IPC IPC(8): H05K9/00B29D31/00
CPCH01L21/561H01L21/78H01L2924/00011H01L2924/15311H01L2924/00014H01L2924/14H01L2924/181H01L2924/15313H01L2924/014H01L2924/01024H01L2924/01006H01L23/3121H01L23/552H01L24/97H01L2224/16225H01L2224/97H01L2924/01013H01L2924/01029H01L2924/01033H01L2924/01047H01L2924/01078H01L2924/01079H01L2924/1815H01L2924/3025H05K1/0218H05K3/0032H05K3/0052H05K3/284H05K2203/0415H01L2224/81H01L2924/00H01L2224/0401
Inventor KO, DONGKYUNLEE, JUNGAN, JAESUN
Owner ADVANCED SEMICON ENG INC
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