35results about How to "No mechanical stress" patented technology

The invention discloses a method for engraving a character or a graphics on a metal mold. The method comprises the following steps: firstly, placing the metal mold on a three-dimensional work table ofa laser engraving machine, and adjusting the metal mould to a corresponding engraving position; secondly, making a character or a graphics to be engraved and adjusting the parameters of the laser engraving machine; and thirdly, scanning layer by layer to reach a required depth. The method for engraving the character or the graphics on the metal mold can solve the problems of the complex flow of the conventional CNC or EDM and liquid medicine corrosion process, simplify the structure design of the mould without generating mechanical extrusion or stress in the process and has the advantages ofsmall heat-affected region, fine process, no deformation of a workpiece, high processing efficiency, low cost and easy operation without pollution.

The invention discloses a laser parallel processing device and processing method for array air holes of a leather product. The laser parallel processing device comprises a laser system, an optical light guide system,an X-Y two-dimensional honeycomb adsorption platform system and a computer control system, wherein an optical path outlet of the laser system is opposite to an optical path inlet of the optical light guide system, and an optical path outlet of the optical light guide system is opposite to a working area of the X-Y two-dimensional honeycomb adsorption platform system; the optical light guide system involves a pneumatic optical shutter, a quarter slide, a reflector, an adjustable beam expander lens, an adjustable diaphragm, a dichroic mirror, a laser beam splitting unit and a scanning galvanometer; and a laser beam optical path output by the laser system sequentially passes through the pneumatic optical shutter, the quarter slide, the reflector, the adjustable beam expander lens, the adjustable diaphragm, a surface of the dichroic mirror, the laser beam splitting unit, the scanning galvanometer, and a to-be-processed leather surface, and the other surface of the dichroicmirror is provided with a red light unit.

The invention concerns a lid (2) comprising a skirt (3) for covering the opening of a can (1), in particular a paint can. The invention is characterized in that the skirt (3) comprises a peripheral edge (30), at least one stud (71) formed in the edge (30) and elastically coupled to said edge (30), at least one lock (72) mounted sliding on said edge such that said lock may take up a locking position wherein said lock is adapted to retain said stud in a position for engaging the lid on the can.

The invention relates to a method for manufacturing a special-shaped chip through laser cutting, which is characterized in that: firstly, a semiconductor silicon wafer needed to be cut is positioned through the match of a computer system and a charge coupled device image sensor; secondly, laser beams are adopted to be vertically irradiated on the surface of the semiconductor silicon wafer; thirdly, a workbench for load bearing the semiconductor silicon wafer is moved so as to be moved relatively to the laser beams; and finally, the laser beams are used for cutting the semiconductor silicon wafer in a melting and vaporizating manner according to set parameters so as to obtain the special-shaped chip. Therefore, mechanical stress cannot be generated in the process, so that the semiconductor chip to be processed cannot be damaged, and the semiconductor chip can be processed quickly, high-efficiently, simply and conveniently.

The invention provides a laser wire stripping device, comprising a rack, a working platform, a laser generation chamber, laser heads, a movement mechanism and a control mechanism; wherein, the laser generated by the laser generation chamber is transmitted to the laser heads by a reflection mirror group to realize laser light path transmission; the movement mechanism controls the laser heads to realize wire stripping; the laser heads are symmetrically arranged with one at an upper position and the other at a lower position by taking the working platform as a symmetrical surface; the movement mechanism comprises a Y axis movement part for realizing forward and back motion, an X axis for realizing side-to-side motion and an upper and lower laser switching mechanism for realizing up-and-down motion; the device of the invention has the advantages of high working efficiency and low equipment cost, in addition, the device can well strip coaxial cable metallic shield layers and aluminium foil shield layers, does not cause shield layer deformation, does not damage insulating layers and conductors, features high yield and the like.

The invention discloses a combined microstructure guide rail and a manufacturing method thereof, and relates to the technical field of surface treatment of machine tool guide rails. The combined microstructure guide rail is characterized in that a combined microstructure is distributed on the surface of the guide rail; the combined microstructure is in pit morphology and micro groove morphology; and the micro groove morphology is characterized in that micro grooves connected with single pits in the length direction of the guide rail are processed in micro pit morphology arrays. According to the combined microstructure guide rail, the crawling phenomenon of the guide rail is solved, lubricating performance is improved, abrasion resistance is improved, the service life of the guide rail canbe effectively prolonged, and comprehensive performance is improved.

The invention relates to a battery (10), in particular for a vehicle, having at least two battery cells (12) and having at least one connecting element (16) that connects at least one electrical terminal (14) of a first battery cell (12) to an electrical terminal (14) of at least one further battery cell (12). The connecting element (16) comprises a plurality of individual wires (18) that are compacted in a respective connecting area (20). The connecting element (16) is in contact with the respective electrical terminal (14) of the battery cell (12) in the respective connecting area (20) of said connecting element. The invention further relates to a method for making such a battery (10).

The invention provides a method and device for packaging flexible OLED screens through laser welding. The method comprises the steps that laser beams emitted by a laser device are transmitted to a 3D dynamic focusing vibration lens, and through high-speed scanning of the 3D dynamic focusing vibration lens, the laser beams penetrate through upper layer light-transmitting materials of the flexible OLED screens and reach lower layer light absorbing materials of the flexible OLED screens; and through a set packaging track, contact faces of upper layer packaging materials and lower layer packaging materials of the flexible OLED screens are fused. The process is simple, the consistency is good, and automatic production can be achieved easily.

The invention relates to a laser processing platform for circular cylinder punching. The laser processing platform comprises a working table. The working table is provided with a rotating platform anda laser bracket. The laser bracket comprises a lifting sliding table, a translation sliding table and a laser generator, the lifting sliding table is provided with the translation sliding table, andthe laser generator is disposed on the translation sliding table. The front end of the laser generator is fixedly connected with an angle adjustment joint, and a laser head is connected with the lasergenerator through the angle adjustment joint. The rotating platform is driven by the rotating platform motor on the lower part of the working table, and the rotating platform is a disc table. Three radial grooves and a plurality of annular grooves with the center of the disc as the center of the circle are uniformly distributed on the rotating platform. The three radial grooves are internally provided with rodless cylinders, and rubber blocks are disposed on sliding blocks of the rodless cylinders. The laser processing platform meets the punching requirements of large-sized cylindrical workpieces, the translation sliding table is arranged to realize the laser rapid focusing adjustment, the laser head for angle adjustment realizes processing of a vertical cylinder, a cone cylinder and a cylinder plane, and the rotating platform is arranged to realize rotary curved surface processing.

The invention relates to a machining method of a fuel cell bipolar plate. According to the machining method, flow channels are processed on a graphite bipolar plate blank by utilizing laser accordingto a target flow channel structure chart, so that a formed graphite bipolar plate is obtained. The spot diameter of the laser in the method of the invention is micron-sized. According to the machiningmethod, the laser is used for machining the flow channels, so that no mechanical stress is generated in laser machining; the spot diameter is small, and therefore the laser can machine the flow channels with narrower ridge width which are arranged more densely; and the ultra-dense flow channels are beneficial to the diffusion of reaction gas and the improvement of the performance of the bipolar plate. The machining method further involves surface cleaning treatment and surface hydrophobic treatment performed on the formed graphite bipolar plate, so that and water does not tend to accumulate in the flow channels which have been subjected to the surface hydrophobic treatment. The gas conveying capacity of the bipolar plate formed by the machining method is enhanced, and the performance of the bipolar plate is also improved.

The invention provides an ultrafast-continuous laser asynchronous polishing powder feeding additive manufacturing metal surface process. The ultrafast-continuous laser asynchronous polishing powder feeding additive manufacturing metal surface process comprises the following steps of performing laser micro-milling on the surface of a powder feeding additive manufacturing metal material by using ultrafast laser, and removing a macroscopic convex deposition layer on the surface of the powder feeding additive manufacturing metal material to obtain a sample piece with a flat processing surface; putting the sample piece into an oxygen isolation container, introducing protective gas, performing laser polishing on the machined surface of the sample piece by utilizing the continuous laser, heatinga machined surface material to a molten state, forming material micro-flow by surface tension of a liquid material, removing micro-morphology left by laser micro-milling, and performing cooling and solidifying to form a smooth surface; and achieving surface polishing of the surface of the powder feeding additive manufacturing metal material from large waviness to the submicron level. Non-contact polishing is adopted, mechanical stress cannot be generated on the surface of the material, and introduction of related machining defects is avoided. Compared with a traditional polishing process, automatic machining can be achieved, the machining efficiency is high, and environmental pollution is small.

The invention discloses equipment for processing a micro-surface structure. The equipment comprises a surface polish-grinding device, a laser etching device, an apparatus fixing device suspending rackand a pedestal. The surface polish-grinding device and the laser etching device are successively arranged on the suspending rack; the pedestal supports the suspending rack; the surface polish-grinding device comprises a polish-grinding head for polish-grinding the surface of a to-be-processed apparatus; the polish-grinding head is controlled by a first driving mechanism to lift; the laser etchingdevice comprises a laser head for etching the to-be-processed apparatus with laser; the laser head is controlled by a second driving mechanism to lift; the apparatus fixing device is used for fixingthe to-be-processed apparatus. According to the apparatus processed by the technical means, the surface micro-structure is obtained while the surface integrity is ensured. The invention also providesa method of processing the micro-surface structure with the beneficial effects.

The invention discloses a laser welding method and device for a loudspeaker dustproof film. The laser welding method comprises the steps that the to-be-welded position of a loudspeaker plastic shell is coated with a laser absorbent, and then the dustproof film is tightly pressed and attached to the to-be-welded position; and a laser beam is adopted to illuminate the to-be-welded position, and thecontact surface, making contact with the dustproof film, of the loudspeaker plastic shell is melted, so that the dustproof film is welded to the loudspeaker plastic shell. According to the laser welding method for the loudspeaker dustproof film, non-contact-type welding processing of loudspeaker plastic shell plastic and the dustproof film is achieved, auxiliary materials do not need to be added,processing traces cannot be seen after welding is conducted, the appearance is attractive, the enough strength is ensured through whole face processing, the quality of a product is greatly improved, the whole service life is greatly prolonged, secondary pollution and waste cannot be caused, and mechanical stress and thermal stress are not produced; and the laser welding method is simple in processand good in consistency, and automatic production is easy to realize.

The invention provides a flash memory manufacturing method which comprises the following steps: providing a structure comprising a semiconductor substrate, an insulating medium layer, a polycrystalline silicon layer, a silicon nitride layer and an oxide layer side wall; carrying out first type ion implantation on the structure, and forming a plurality of bit lines corresponding to each groove; carrying out annealing treatment on the structure; and arranging isolated bit lines at the interval of a preset number of bit lines, wherein the isolated bit line is formed by carrying out second type ion implantation on the bit line after the first type ion implantation. The flash memory manufacturing method provided by the invention can achieve the effect identical with the effect achieved by shallow trench isolation, and can not generate mechanical stress simultaneously.

A length-adjustable steering shaft (1) for a motor vehicle, having an inner shaft part (2), which is held coaxially, and so as to be displaceable in a rotational axis direction (6), in an outer shaftpart (4), wherein the two shaft parts (2, 4), in cross section, have profiles which engage into one another for the purposes of transmitting torques, and on the inner shaft part (2), there is arrangeda profiled sleeve (3) on which the outer shaft part (4) is arranged in telescopic fashion, is improved with regard to simplified production in that the profiled sleeve (3), in a first end region (7)which in the assembled state surrounds a free end (10) of the inner shaft part (2), has at least one radially inwardly protruding stop (8) for the abutment against a face surface (11) of the inner shaft part (2) in one axial direction (6), and in that an end region (12) of the inner shaft part (2) is equipped with a radially outwardly protruding projection (13) for the abutment of the profiled sleeve (3) in the opposite axial direction (6). The invention furthermore encompasses a profiled sleeve (3) for the abovementioned steering shaft (1), which profiled sleeve, with regard to simplified assembly, has at least one radially inwardly protruding stop (8) in a first end region (7).

The invention discloses a non-destructive grinding method and device for a welding column of a CCGA device. The method comprises the steps of carrying out potting on the welding column end of the CCGA device to be trimmed through adopting a method for carrying out potting on the welding column of the CCGA device to be trimmed through injection molding resin, then grinding the potted welding column end of the CCGA device to be trimmed until the remaining height of the welding column meets the design requirement, fixing the welding column through adopting an injection molding method before being ground so as to ensure that the side wall of the welding column cannot be damaged in the grinding process, the perpendicularity of the welding column cannot become poor, and finally, removing injection molding resin for potting the welding column in a chemical dissolution mode after grinding is completed. Therefore, no mechanical stress exists in the whole process, lossless grinding of the welding column is achieved, the welding column deformation and damage caused by mechanical clamping can be greatly reduced, and the method has important application value for manufacturing high-reliability CCGA and has good application prospects and economic benefits. Through detection, high-quality welding column grinding with the perpendicularity within 3 degrees and no mechanical damage to the side wall can be achieved, and the method is superior to a column planting grinding method in the current industry.

The invention discloses a wafer laser tagging method and a wafer laser tagging system. The wafer laser tagging method comprises the following steps: enabling a to-be-tagged surface of a wafer to face the transmission direction of a laser beam; establishing a tagging document through tagging software, and setting tagging contents in the tagging document; importing the tagging document into image processing software, and determining a tagging position; laser tagging processing is conducted on the tagging position through a laser beam; the processing process is free of consumables and pollution, the cost is lower, and the anti-counterfeiting property is better; a hyperfine mark is formed on the surface or inside the wafer under the action of a high-energy-density laser beam; non-contact machining is adopted, mechanical stress is avoided, and the product quality can be effectively improved; and positioning and code assigning can be achieved through machine vision, the alignment precision is high, the clamp can be placed at any angle within the machining plane range, the code assigning position consistency is good, and the production efficiency is greatly improved.