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Curing agent, composition, cover plate and manufacturing method and application of cover plate
Pending
CN122080365A
Good solvent resistance
Improve the degree of cross-linking reaction
Capacitor housing/encapsulation
Polymer science
Firming agent
The invention provides a curing agent, a composition, a cover plate and a manufacturing method and application thereof, the curing agent comprises phenolic resin and arylamine
formaldehyde
resin, and the arylamine
formaldehyde
resin comprises a compound with a
structural formula
1; in the
structural formula
1, R1, R2, R3 and R4 are independently selected from one of
hydrogen
, amino,
alkyl
and alkylene, and n is the
degree of polymerization
and meets the requirement of weight-average molecular weight of 300-5000; the curing agent provided by the invention can improve the degree of cross-linking reaction with
high polymer
materials such as
epoxy
resin when being used for preparing the bolt
capacitor
cover plate, and improves the
solvent
resistance.
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Owner:
NANTONG TOP ELECTRONICS MATERIALS CO LTD
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