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Curing agent, composition, cover plate and manufacturing method and application of cover plate

PendingCN122080365AGood solvent resistanceImprove the degree of cross-linking reactionCapacitor housing/encapsulationPolymer scienceFirming agent
The invention provides a curing agent, a composition, a cover plate and a manufacturing method and application thereof, the curing agent comprises phenolic resin and arylamine formaldehyde resin, and the arylamine formaldehyde resin comprises a compound with a structural formula 1; in the structural formula 1, R1, R2, R3 and R4 are independently selected from one of hydrogen, amino, alkyl and alkylene, and n is the degree of polymerization and meets the requirement of weight-average molecular weight of 300-5000; the curing agent provided by the invention can improve the degree of cross-linking reaction with high polymer materials such as epoxy resin when being used for preparing the bolt capacitor cover plate, and improves the solvent resistance.
Owner:NANTONG TOP ELECTRONICS MATERIALS CO LTD