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89results about How to "Reduce waviness" patented technology

Superconducting magnet coil with wedge-shaped section for reducing waviness and conductor winding and forming method

The invention discloses a superconducting magnet coil with a wedge-shaped section for reducing waviness and a conductor winding and forming method. The superconducting magnet coil with a wedge-shaped section for reducing waviness comprises a mould which comprises a plurality of forming blocks and a central supporting column. Each forming block comprises two arc-shaped blocks in butt joint at one ends. An assembling hole is arranged in the inner wall of each arc-shaped block. A plurality of positioning blocks are respectively arranged on both sides of the central supporting column form top to bottom. Each positioning block is separated from the adjacent positioning blocks up and down. The pair of arc-shaped blocks of each forming block is respectively locked on the central supporting column from both sides of the central supporting column, and a wire is continuously winded and formed on the mould around the central supporting column along the gap between adjacent forming blocks. According to the superconducting magnet coil with a wedge-shaped section for reducing waviness and the conductor winding and forming method provided by the invention, under the premise of guaranteeing the assembling space and reducing the cost, the outermost waviness in the circumference of a large ring is effectively reduced so that the waviness in a rim area of a plasma in the center of the magnet coil is further reduced, the stable operation of the plasma is ensured, and the fabrication design and process of the coil conductor are reasonable and convenient to realize.
Owner:INST OF PLASMA PHYSICS CHINESE ACAD OF SCI

Flexible floating breakwater and containing device thereof

The invention discloses a flexible floating breakwater. The flexible floating breakwater comprises a first capsule body, a second capsule body, a third capsule body and an outer net structure, wherein the first capsule body is made of flexible materials, and the first capsule body is internally provided with gastight space capable of being filled with water; the second capsule body is made of the flexible materials, the second capsule body is internally provided with gastight space capable of being filled with gas, and the second capsule body is arranged on an inner surface of the first capsule body in the length direction of the first capsule body; the third capsule body is made of the flexible materials, the third capsule body is internally provided with gastight space capable of being filled with gas, and the third capsule body is arranged on an outer surface the first capsule body in pairs in the length direction of the first capsule body; the whole capsule body is wrapped by the outer net structure. The flexible floating breakwater can be installed quickly and anchored by a matched anchoring system, the flexible floating breakwater floats and is unfolded on water, when the flexible floating breakwater is arranged at an open water area, the function of reducing the wave effect can be achieved, and after work is finished, the flexible floating breakwater can be recovered, stored, transported quickly and recycled.
Owner:CCCC SECOND HARBOR ENG

Processing method of thin plate-shaped sapphire wafer

ActiveCN110539209AGood surface accuracyStrong machining accuracyLapping machinesMaterial removalSapphire wafer
The invention discloses a processing method of a thin plate-shaped sapphire wafer. The processing method is characterized by comprising the following steps that a thin plate-shaped sapphire wafer is sequentially subjected to double-sided free abrasive grinding, double-sided consolidation hard abrasive grinding disc coarse grinding, double-sided consolidation hard abrasive grinding disc fine grinding and double-sided consolidation soft abrasive grinding disc mechanical polishing treatment. The double-sided grinding of the free abrasive is mainly used for reducing the ripple degree of the thin plate-shaped sapphire wafer and controlling the flatness. The grinding pressure can be increased by the double-sided consolidation abrasive grinding disc grinding, the material removal rate is improved, the processing precision and the surface quality controllability are high, and the processing efficiency is high. The double-sided consolidation soft abrasive grinding disc mechanical polishing treatment can greatly improve the grinding and polishing efficiency of the wafer, avoids a large amount of loss of the traditional silica sol polishing solution, reduces the cost, and is green and environment-friendly. According to the processing method, the thin plate-shaped sapphire wafer can be processed and manufactured with high precision, high quality and high efficiency.
Owner:DALIAN UNIV OF TECH

Spherical Roller Outer Diameter Superfinishing Technology

The invention discloses a superfine process for the outer diameter of a spherical roller. The superfine process comprises the following specific steps of: 1, debugging according to the size of a workpiece and selecting machine tool fittings of different specifications; 2, switching on a general power supply of a machine tool and a cooling pump and selecting a working status; 3, adjusting the machine tool and setting parameters thereof; 4, feeding with a blanking cylinder of a feeding / blanking mechanism; 5, driving the roller to rotate with a workpiece transmission mechanism, making an oscillating mechanism oscillate and making a superfine mechanism jump into a processing position; 6, performing rough processing and superfine processing with the superfine mechanism; 7, stopping the superfine mechanism, the oscillating mechanism and the workpiece transmission mechanism; and 8, blanking with the feeding / blanking mechanism. The invention has the advantages: the spherical roller has a long service life; the roughness value is small, the Ra is 0.05 mum after superfine processing, the circular degree is increased by 30 percent and is less than 1 mum, and the corrugation is reduced by 30 percent and is less than 1 mum; and the spherical roller is arranged on an elevator bearing after superfine processing, so that the noise is lowered by 30 percent and meets the user requirement in comparison to the noise before superfine processing.
Owner:WUXI RUIDING MACHINE TOOLS
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