65 results about "Abrasive grinding" patented technology

The invention relates to a chemical mechanical grinding system and method for a hard and brittle semiconductor wafer, and the chemical mechanical grinding method comprises the following steps: preparing an oil-based thermal activity-optical activity composite grinding fluid by adopting an organic thermal decomposition type oxidizing agent, an organic optical decomposition oxidizing agent, polyethylene glycol, glycerol and vegetable oil; building an ultraviolet light-diamond abrasive grinding wheel chemical mechanical grinding platform which has an ultraviolet light irradiation function and is adjustable and controllable in irradiation intensity and ultraviolet light wavelength; the chemical mechanical grinding platform and the minimal quantity lubrication liquid supply device are started, and the wafer to be machined and the diamond abrasive grinding wheel are controlled to rotate relative to each other for opposite grinding; turning on an ultraviolet light generator to accurately irradiate the thermal activity-optical activity composite grinding liquid drops on the surface of the wafer, inducing a thermal decomposition type oxidizing agent and an optical decomposition type oxidizing agent to generate active free radicals by utilizing grinding heat energy and ultraviolet light irradiation energy, and initiating a free radical oxidation reaction of a wafer surface layer material to form an oxidation layer with low interface bonding force; the oxide layer on the surface of the wafer is removed through small-load micro-cutting of the diamond abrasive, and the semiconductor wafer with the subsurface almost free of mechanical damage is efficiently obtained.

A diamond coating optimization implementation method for a hard and brittle material milling cutter comprises the following steps: according to a determined process environment and a pretreated specific milling cutter, sequentially carrying out a bottom coating orthogonal test to obtain corresponding optimal key control parameters, and carrying out a top coating orthogonal test to obtain corresponding optimal key control parameters; and finally, optimized manufacturing of the diamond coating of the hard and brittle material milling cutter is achieved after fusion. By optimizing the coating structure and the number of dynamic effective abrasive particles, the abrasive particle grinding effect is achieved, it is ensured that machining is conducted below the ductile-brittle transition critical cutting thickness, the abrasion resistance and machining quality of the tool are remarkably improved, and the problems that in the hard and brittle material machining process, the tool is fast in abrasion and poor in surface quality are effectively solved.

The invention provides a steel formwork surface grinding device. The steel formwork surface grinding device comprises a wall-climbing robot, a mounting mechanism and a grinding mechanism. The wall-climbing robot is provided with an installation position, the installation mechanism comprises a frame assembly and a driving assembly, the frame assembly is detachably connected to the installation position, the driving assembly is installed on the frame assembly, the grinding mechanism comprises a first flange, a rotating rod, an end plate, a steel wire grinding piece and a diamond abrasive grinding piece, one end of the rotating rod is fixedly connected with the first flange, and the other end of the rotating rod is fixedly connected with the end plate. The steel wire grinding piece and the diamond grinding piece are both installed on the end plate, the steel wire grinding piece is arranged on the outer side of the diamond grinding piece in a surrounding mode, and the first flange can be connected to the driving assembly so that the driving assembly can drive the grinding mechanism to rotate. In this way, the grinding mechanism is driven to rotate through the driving assembly, and the wall-climbing robot moves on the to-be-ground steel formwork, so that concrete sticky skin and rust on the steel formwork can be cleaned up.

The invention provides a grinding surface quality prediction method based on a fixed abrasive grinding pad with a specific geometric structure, and belongs to the technical field of high-end equipment precision machining.The grinding surface quality prediction method comprises the steps that geometric structure parameters of the fixed abrasive grinding pad are obtained, and the geometric structure parameters comprise groove structure parameters and abrasive particle pattern distribution parameters; according to the groove structure parameters, flow field simulation is conducted, and first uniformity parameters representing the chip removal capacity in the grinding process are obtained; according to the abrasive particle pattern distribution parameters, track field simulation is carried out, and second uniformity parameters representing abrasive particle motion tracks are obtained; and comprehensively evaluating the quality of the grinding surface according to the first uniformity parameter and the second uniformity parameter.

The invention provides a method for judging the grinding track uniformity of a non-standard grinding tool of a floor machine based on a discrete coefficient, which comprises the following steps of: observing the morphological characteristics of abrasive particles on the surface of the non-standard grinding tool to obtain characterization parameters of the abrasive particles, and simulating the randomness of the quantity of the abrasive particles with different particle sizes on the surface of the abrasive material through a distribution theory to obtain the uniformity of the grinding track of the non-standard grinding tool. Calculating the number of abrasive particles with different particle sizes so as to establish an abrasive surface abrasive particle distribution model; according to a motion transmission structure of the floor machine, a grinding disc kinematics model is established, a grinding track equation of a grinding disc is deduced, and therefore a grinding track curve of all grinding particles is drawn; and grid division is carried out on the ground area, and the average value of the number of track points of a grid, the standard deviation of track uniformity and the discrete coefficient CV of the track uniformity are calculated so as to judge the uniformity of the track in the whole area. The method can be used for judging the uniformity of the grinding track of the non-standard grinding material, and a reasonable basis is provided for kinematics design of a grinding disc of a floor machine.

The invention relates to the field of polymerized abrasives, in particular to a novel stacked abrasive grinding and polishing material and a preparation process thereof. The scheme comprises the following steps: (1) immersing a base material into an adhesive, and preparing a back bottom layer on one surface of the base material after immersion to obtain a pretreated base material; (2) primer coating: coating the primer on the other surface of the pretreated base material to obtain a glued base material; (3) sand planting is conducted, specifically, sand is evenly planted on the primer side of the glued base material, sand planting particles are in a quadrangular frustum pyramid shape, then a layer of composite glue is coated, and a semi-finished product is obtained after drying; and (4) curing preparation: heating and curing the semi-finished product for 6-24 hours to obtain the novel stacked abrasive grinding and polishing material. The novel stacked abrasive grinding and polishing material prepared by the scheme has the characteristics of long service life, good heat dissipation performance and stable roughness.

The invention belongs to the technical field of grinding materials and grinding tools, and particularly relates to a ceramic-metal composite grinding block for coarse grinding of microcrystalline glass. The ceramic-metal composite grinding block for coarse grinding of the microcrystalline glass comprises a base body, ceramic diamond segment rows and metal diamond segment rows are alternately arranged in the length direction of the base body, and the grinding area ratio of all ceramic diamond segments to all metal diamond segments is (1-2.5): 1. The ceramic diamond segment is prepared from a ceramic bond, diamond, a pore forming agent, green silicon carbide powder and a wetting agent, and the metal diamond block is prepared from metal powder, graphite powder and diamond. The advantages of the two segments are utilized, the arrangement mode of the two segments, the grinding area proportion and the formula composition of the two segments are regulated and controlled, the combined action enables the composite grinding block to have the service life and the sharpness, the grinding surface of the microcrystalline glass is free of scratches, and the process requirements of the microcrystalline glass can be efficiently met with low cost.

The invention discloses a preparation method of a composite stacked abrasive grinding wheel for thinning a silicon carbide wafer, which comprises the following steps: uniformly mixing a diamond abrasive, a soft abrasive and a first ceramic bond according to a first mass ratio to obtain a mixed dry material; uniformly mixing the mixed dry material with a thickening agent, a dispersing agent and purified water according to a second mass ratio to obtain slurry; continuously and uniformly mixing the slurry, granulating, drying and sintering to obtain a composite stacked abrasive material; preparing a forming material based on the composite stacked abrasive, a second ceramic bond, a pore forming agent and a wetting agent; carrying out cold press molding on the molding material and then carrying out vacuum sintering to obtain the grinding wheel grinding block; and the composite stacked abrasive grinding wheel can be obtained by adhering the grinding wheel grinding block to the grinding wheel base body. The composite stacking abrasive grinding wheel prepared according to the method is better in self-sharpening performance and lower in machining energy consumption, the grinding machining stability is improved, and meanwhile the quality of a machined wafer is improved.

The present invention is a core-shell abrasive polishing disc capable of changing the motion state of the abrasive, a preparation method and an application thereof. The abrasive on the polishing disc is a core-shell abrasive, which is composed of an inner layer of abrasive and an outer layer of colloid that wraps the abrasive. During the rough machining process, the core-shell abrasive is evenly solidified in the polishing disc, the matrix has a large holding force on the core-shell abrasive, has a large material removal capacity for the workpiece, and can quickly achieve flattening of the workpiece; according to the machining process, by adding an organic solvent polishing liquid to the surface of the polishing disc, the colloid shell of the core-shell abrasive is dissolved to form pores, and the internal abrasive can move locally freely in the pores to achieve the yield of the abrasive on the workpiece surface, obtain a high-quality machined surface, and avoid the waste of free abrasive. The rough and fine machining process cycle of the workpiece is achieved by adding an organic solvent and trimming the polishing disc, so as to shorten the polishing process and improve the machining efficiency and surface quality.

The utility model relates to the technical field of electroplated abrasive grinding tools, in particular to a reliable sand feeding device for electroplated abrasive grinding tools, which comprises an auxiliary plate, a limiting box and a control device, a rotating rod is arranged on the upper side wall of the auxiliary plate, a groove is arranged on the inner side wall of the auxiliary plate, a first motor is arranged in the groove, and a second motor is arranged in the groove. Symmetrical limiting rods are arranged at the two ends of the upper side wall of the auxiliary plate, the control device comprises a control rod, a sliding block and a spray head, a second motor is arranged on the outer side wall of one limiting rod, symmetrical control plates are arranged between the two limiting rods, symmetrical connecting plates are arranged at the lower end of the sliding block, adjusting rods are arranged in the connecting plates, and the adjusting rods are connected with the second motor. And a connecting pipe with a suction pump is arranged on the rear side wall of the spray head, so that the adaptability and the flexibility of the device are enhanced, the sand feeding efficiency and the sand feeding precision are improved, the labor intensity of operators is reduced, and the production efficiency and the product quality are also improved.

There is provided a vitrified bond super-abrasive grinding wheel having a super-abrasive grain layer, wherein the super-abrasive grain layer 6 includes a super-abrasive grain 3, a pore 5 and a vitrified bond 2, and in the super-abrasive grain layer 6, an area ratio of a coarse vitrified bond grain having an area of 30 μm2 or larger is 10% or less.

The invention discloses agglomerated abrasive grinding fluid, and belongs to the technical field of agglomerated abrasives, the agglomerated abrasive grinding fluid comprises a box body, a first water sump is arranged in the box body, a second water sump is arranged in the box body, a third water sump is arranged in the box body, the surface of the box body is fixedly connected with a fixing frame, the surface of the fixing frame is fixedly connected with a motor, and the motor is fixedly connected with a motor. According to the supply system applied to the agglomerated abrasive grinding fluid, by arranging a motor, a first chain wheel, a second chain wheel, a second rotating shaft and a cleaning brush, when a filter plate is cleaned, people control the motor to operate through a control switch, and then the first chain wheel and the second chain wheel are driven to rotate; and meanwhile, a second rotating shaft is driven to rotate, the second rotating shaft rotates to drive a cleaning brush to rotate, so that impurities on the surface of the filter plate are cleaned, under the action of a motor, a first chain wheel, a second chain wheel, the second rotating shaft and the cleaning brush, people can clean the impurities on the surface of the filter plate more conveniently, and the filtering effect is prevented from being influenced.

This invention discloses a tooth grinding machine for wide-width band saw blade processing, including limiting plates and a workpiece processing mechanism. A saw blade body portion is inserted between two limiting plates, and each limiting plate has an inclined hole on its side. The inclined hole faces opposite directions to the tooth grooves on the saw blade body. The bottom end of the limiting plate extends into the material collection hopper. The advantages of this invention are: during the feeding process, the abrasive is also driven to rotate by the processing actuator, which can fully fill the gap formed between the annular surface in the middle of the processing actuator and the inner wall of the tooth groove, thus achieving the effect of abrasive grinding the inner wall of the tooth groove. The abrasive is fed in a state of simultaneous movement and rotation, resulting in a finer and smoother grinding surface; it fully utilizes the abrasive, reducing the number of times it needs to be added; and it can automatically adjust and position the tooth grooves on the saw blade body, allowing for rapid adjustment to the grinding state.

Abrasive elements can be secured to a perimeter of a base disk using double-sided adhesive tape, thereby forming an abrasive grinding wheel.

The invention belongs to the field of abrasive grinding tools, and particularly relates to a wafer thinning grinding wheel and a preparation method thereof.The wafer thinning grinding wheel comprises a base plate 1, an abrasive coating 11 is fixed to the end face of the base plate 1, abrasive particles are arranged in the abrasive coating 11, and the abrasive particles comprise first abrasive particles 12 located at the bottom of the abrasive coating 11 and close to the end face of the base plate 1; the abrasive material further comprises second abrasive particles 13 arranged in a layer above the first abrasive particles 12, the average diameter of the first abrasive particles 12 is 110%-140% of the diameter of the second abrasive particles 13, and the minimum diameter of the first abrasive particles 12 is not lower than 70% of the maximum diameter.

The disclosure relates to fixed-abrasive grinding plates, fixed-abrasive grinding tools formed therefrom, and related methods. The grinding plate generally has a composite structure with abrasive beads (e.g., beads with diamond abrasives), a porosity additive, and an inorganic filler and / or flux agent distributed throughout a binder matrix formed from a polymeric resin (e.g., a cured, thermoset resin) or a vitreous material (e.g., a fired, vitrified glass frit matrix).

The present invention relates to the field of ceramic superhard abrasive tools, and specifically to a system for removing the abrasive layer of a ceramic superhard abrasive tool, which includes a support plate; anti-slip feet, the lower end of the support plate is uniformly and fixedly connected with anti-slip feet; an abrasive groove, the middle part of the upper end of the support plate is fixedly connected with an abrasive groove; a storage battery, the upper end of the support plate is fixedly connected with a storage battery on the left side of the abrasive groove; a switch, the front end of the storage battery is fixedly connected with a switch; a U-shaped high-frequency heater, the upper end of the storage battery is fixedly connected with a U-shaped high-frequency heater; a cutting tool cylinder, the upper end of the support plate is fixedly connected with a cutting tool cylinder on the right side of the abrasive groove; an adjusting bolt, the right side of the cutting tool cylinder is movably connected with an adjusting bolt; by setting an expansion mechanism on the rotating shaft, the technical problem is solved that in the existing abrasive layer removal system, when removing the abrasive layer, the inner holes of different specifications of tools are different, resulting in the inability to fix the whole tool.

The invention discloses a gas-magnetic-liquid parallel tangential synergistic grinding wheel femtosecond laser trimming device. According to the technical scheme, the gas-magnetic-liquid parallel tangential synergistic grinding wheel femtosecond laser trimming device is characterized by comprising a double-blowing gas system, an electric magnetic field system, a femtosecond laser trimming system, a grinding wheel and a liquid phase cooling box. Plasma formed in the femtosecond laser trimming process can be blown off under the auxiliary action of the two-way air blowing pipe, the plasma is prevented from returning to cover the surface of a grinding wheel, and the chip containing space around abrasive particles and the height of the abrasive particles protruding out of a binding agent are reduced; the cooling liquid in the liquid-phase cooling box can avoid the defects of hot cracks, graphite metamorphic layers, re-coagulation layers, residual tensile stress and the like caused by heat accumulation around the diamond abrasive particles; uniform magnetic field distribution formed by the electric magnetic field system can adjust distribution uniformity of substances on the surfaces of the abrasive particles, pits and convex points on the surfaces of finished diamonds caused by non-uniform energy absorption of the diamond abrasive particles are avoided, and accordingly finishing efficiency and finishing quality are greatly improved.

The utility model relates to a magnetic grinding machine which comprises a box body, a main motor, a tray, a magnetic disc and an annular driving mechanism, the main motor, the tray, the magnetic disc and the annular driving mechanism are installed in the box body, a supporting plate is fixedly installed on the box body, a grinding barrel is placed on the supporting plate, the main motor is fixedly installed on the tray, and the magnetic disc is placed on the tray. The main motor is connected to the magnetic disk, the main motor can drive the magnetic disk to rotate relative to the tray, the annular driving mechanism is connected to the tray, and the annular driving mechanism can drive the tray and the magnetic disk to move annularly. The center of the grinding area of the grinding barrel in the grinder is not hollow, so that the effective area of the grinding area of the grinding barrel and the grinding efficiency of the grinding barrel are improved.

The invention discloses a preparation method of a superhard abrasive particle tool and the superhard abrasive particle tool, and belongs to the technical field of abrasive grinding tools, and the preparation method comprises the following steps: S1, brushing first glue on the surface of a brazing alloy sheet, scattering superhard abrasive particles on the first glue, enabling the superhard abrasive particles to be adhered to the brazing alloy sheet, and removing the superhard abrasive particles which are not adhered to obtain a first semi-finished product; s2, braze welding alloy powder is scattered on the surface of the first semi-finished product, the braze welding alloy powder is scattered on the first glue between a braze welding alloy sheet and the super-hard abrasive particles, redundant braze welding alloy powder is removed, then drying and curing are conducted, the super-hard abrasive particles are fully fixed, and a second semi-finished product is obtained; s3, the brazing alloy sheet of the second semi-finished product is attached to the surface of the base body, and a third semi-finished product is obtained; and S4, the third semi-finished product is subjected to brazing preparation, and a tool finished product is obtained. According to the method, the brazed superhard abrasive particles are stably connected to the base body, and the method has the advantages of being low in preparation cost, simple in overall process and high in production efficiency.

The invention relates to a preparation method of a laminated chip inductor, and belongs to the technical field of laminated chip inductor preparation. The preparation method of the laminated chip inductor sequentially comprises the steps of sanding and burdening, curtain coating, punching, electrode printing and lamination pressing in the integral forming stage, and vacuum holes of a printing platform of a printing machine comprise dense holes located in the periphery of the printing platform and sparse holes located in the center of the printing platform; when the electrode is printed, the area of the electrode pattern area is not less than 90% of the total area of the diaphragm. According to the preparation method, the height difference can be avoided, and the pressing difficulty is reduced, so that the overlying pressure during overlying forming is reduced, the overlying deformation is reduced, the number of cut electrodes is reduced, the sensitivity consistency is improved, and the qualified rate and the hit rate of products are improved.

The preparation method comprises the following steps: adopting a hole template as a template for arranging abrasives at intervals, and arranging the abrasives on a soldering lug to prepare a single-layer blank working layer; a single-layer blank working layer is prepared, a soldering lug is arranged on the single-layer blank working layer, then a pore forming agent is arranged on the soldering lug to prepare the single-layer blank working layer again, the steps are repeated to prepare the multi-layer super-hard abrasive grinding wheel blank, and abrasive distribution in the grinding wheel working layer is in a regular and ordered form through regular arrangement of abrasives. The grinding materials are regularly arranged to ensure that each grinding material has enough chip accommodating space, so that the adhesion of grinding chips on the surface of the grinding wheel is effectively avoided; and meanwhile, each grinding material is stressed uniformly, and the abrasion is consistent, so that the service life of the grinding wheel is prolonged.

A ski or snowboard edge sharpener may include an abrasive grinding wheel, a belt-driven drive train or direct drive system that connects a motor and grinding wheel drive mechanism and decreases the grinding wheel's speed of rotation relative to the speed of the motor, a grinding wheel mount allowing selection and use grinding wheels of different grits and materials and grinding wheel controls allowing the control of the cut depth and the grinding wheel angles relative to the longitudinal and transverse planes of the ski edge surface to be sharpened. In some embodiments, the sharpener may alternatively include a grinding wheel and motor that drives the grinding wheel drive mechanism. Such configurations may allow repeated sharpening of a ski edge at specific / chosen angles with a specific / chosen surface finish. A position lockdown device that is part of each of the control mechanisms may be included.

It reduces the crack rate without shortening the lifespan of the grinding wheel. [Solution] The method for manufacturing a glass plate includes a rough polishing step S2 in which the end face Ga of the glass plate G is processed with a grinding wheel 3, and a finish polishing step S3 in which the end face Ga of the glass plate G is processed with a grinding wheel 4 after the rough polishing step S2. In the rough polishing step S2, the end face Ga of the glass plate G is processed with a mixed abrasive grinding wheel which is made up of a mixture of abrasive grains of different grits.

The application provides a knowledge and data double-driven broken mill equipment health management industry model construction method, and belongs to the technical field of artificial intelligence.In the application, firstly, broken mill equipment multi-source knowledge and operation and maintenance data are acquired, knowledge extraction, sequence reconstruction and unified vectorization processing are performed, a mixed vector with semantic alignment is formed, differences of heterogeneous data are eliminated, and standardized input is provided for a model;then, a neural engine is constructed based on a Transformer, a symbolic reasoning engine is constructed in combination with an expert rule base and forward reasoning, an interactive checkable double-engine collaborative reasoning architecture is formed, data generalization and mechanism constraint are considered;next, real-time operation and maintenance data and query input architecture are constructed, a result is generated by the neural engine, and the symbolic engine is checked, iteratively modified, and a reliable reasoning sample is obtained;finally, a health management instruction set is constructed, a low-rank adaptive fine-tuning model is adopted, RAG retrieval and thinking chain prompting are fused, and finally integrated and highly reliable broken mill equipment health management industry model construction is completed.

The invention relates to a semiconductor silicon wafer thinning process based on chemical-mechanical coordination and multi-step stress management, which belongs to the technical field of semiconductor manufacturing and comprises the following operation steps: 1, a chemical-mechanical coarse grinding stage: thinning the back surface of a silicon wafer by using a fixed abrasive grinding wheel and a chemical active grinding fluid; and 2, an in-situ stress management relay layer coating and curing stage: coating and curing a polymer film on the back surface of the thinned silicon wafer in situ to serve as a stress management relay layer. And 3, a chemical mechanical accurate grinding and relay layer synchronous removal stage: performing accurate grinding on the silicon wafer covered with the relay layer by using a fine-grained grinding material and a chemical active medium, and synchronously realizing refining of the surface of the silicon wafer and complete removal of the relay layer. By introducing a chemical activation step and a stress management relay layer, pure mechanical removal is converted into chemically-assisted plastic domain removal, and processing stress is actively managed, so that efficient, low-damage and low-stress thinning is realized in a single device or process sequence.

According to the single-layer superhard abrasive grinding wheel and the preparation method thereof, a circle of equidistant through grooves are designed in the positions of the outer edges of the two sides of a grinding wheel base body, graphite frames used for storing solid paraffin are welded in the through grooves, and a layer of regularly-arranged abrasive particles are brazed on the outer edge face of the base body over the unmachined through grooves; regularly arranged through holes are designed in the arc-shaped surface, flush with the outer edge surface of the base body, of the graphite frame, abrasive particles with smaller particle sizes are brazed, the graphite frame is filled with solid paraffin, and finally the outer edge surface of the grinding wheel is filled with a layer of solid paraffin which is close to but does not exceed the height of the abrasive particles. According to the single-layer superhard abrasive grinding wheel of the special structure, the temperature of a grinding arc area of the single-layer superhard abrasive grinding wheel can be effectively reduced through paraffin phase change, grinding adhesion is reduced, a large amount of grinding heat can be taken away through paraffin phase change and can reach 30%-50%, the grinding performance is greatly improved, the machining efficiency of the grinding wheel is improved, and the service life of the grinding wheel is prolonged.

The present disclosure relates to fixed abrasive grinding plates, fixed abrasive grinding tools formed therefrom, and related methods. Grinding plates generally have a composite structure with abrasive beads (e.g., beads containing diamond abrasive), porosity additives, and inorganic fillers and / or fluxing agents dispersed throughout a binder matrix formed from a polymeric resin (e.g., a cured thermosetting resin) or a glassy material (e.g., a fired vitrified glass frit matrix).

The present invention discloses a rail transit steel rail turnout grinding simulation test device and a test method. The rail transit steel rail turnout grinding simulation test device includes a rotary unit, a reciprocating unit, a turnout swing unit and a pressurizing unit. The rotary unit includes a mold rotary mechanism, a temperature monitoring mechanism and a turnout mold. The movable end of the mold rotary mechanism is detachably connected to the turnout mold through a torque sensor, which is used to drive the turnout mold to rotate and monitor the torque. The temperature monitoring mechanism is used to monitor the temperature during the grinding process. The present invention uses a reciprocating unit, a rotary unit, a turnout swing unit and a pressurizing unit to disassemble the four main influencing parameters that originally acted on the turnout mold in a complex manner: mold moving speed, mold rotation speed, mold grinding angle, and mold grinding pressure into four independent action parameters, thereby improving the controllability and operability of each single parameter under laboratory conditions.

The invention discloses a grinding and polishing method for finely regulating and controlling damage and flatness of a large-size cadmium zinc telluride wafer, and relates to the field of semiconductor wafer processing. According to the method, traditional suspended abrasive grinding and polishing and paraffin chip bonding are replaced through the steps of UV film chip bonding (PET / PO and the like are selected as a base material, and air bubbles are removed in vacuum), thickness measurement, grinding wheel grinding and thinning (damage is controlled through segmented feeding), ultraviolet peptizing and chip taking, chemical mechanical polishing (specific polishing liquid and parameters) and acid and plasma cleaning. The grinding and polishing device can be used for grinding and polishing wafers with the wafer ring size larger than 12 inches and can also be compatible with wafers of 8 inches or below, the thickness deviation of the ground and polished wafers is smaller than or equal to + / -2 micrometers, the surface shape PV is smaller than or equal to 6 micrometers, deep scratches do not exist, and volatile organic reagents are not needed. The method is simple and efficient in process, and can be used for preparing an epitaxial-level tellurium-zinc-cadmium substrate (for a tellurium-cadmium-mercury infrared detector) and a detection-level tellurium-zinc-cadmium material (for a medical X-ray detector and the like).