22 results about "Abrasive grinding" patented technology

The invention discloses a preparation method of a composite stacked abrasive grinding wheel for thinning a silicon carbide wafer, which comprises the following steps: uniformly mixing a diamond abrasive, a soft abrasive and a first ceramic bond according to a first mass ratio to obtain a mixed dry material; uniformly mixing the mixed dry material with a thickening agent, a dispersing agent and purified water according to a second mass ratio to obtain slurry; continuously and uniformly mixing the slurry, granulating, drying and sintering to obtain a composite stacked abrasive material; preparing a forming material based on the composite stacked abrasive, a second ceramic bond, a pore forming agent and a wetting agent; carrying out cold press molding on the molding material and then carrying out vacuum sintering to obtain the grinding wheel grinding block; and the composite stacked abrasive grinding wheel can be obtained by adhering the grinding wheel grinding block to the grinding wheel base body. The composite stacking abrasive grinding wheel prepared according to the method is better in self-sharpening performance and lower in machining energy consumption, the grinding machining stability is improved, and meanwhile the quality of a machined wafer is improved.

This invention discloses a tooth grinding machine for wide-width band saw blade processing, including limiting plates and a workpiece processing mechanism. A saw blade body portion is inserted between two limiting plates, and each limiting plate has an inclined hole on its side. The inclined hole faces opposite directions to the tooth grooves on the saw blade body. The bottom end of the limiting plate extends into the material collection hopper. The advantages of this invention are: during the feeding process, the abrasive is also driven to rotate by the processing actuator, which can fully fill the gap formed between the annular surface in the middle of the processing actuator and the inner wall of the tooth groove, thus achieving the effect of abrasive grinding the inner wall of the tooth groove. The abrasive is fed in a state of simultaneous movement and rotation, resulting in a finer and smoother grinding surface; it fully utilizes the abrasive, reducing the number of times it needs to be added; and it can automatically adjust and position the tooth grooves on the saw blade body, allowing for rapid adjustment to the grinding state.

The invention belongs to the field of abrasive grinding tools, and particularly relates to a wafer thinning grinding wheel and a preparation method thereof.The wafer thinning grinding wheel comprises a base plate 1, an abrasive coating 11 is fixed to the end face of the base plate 1, abrasive particles are arranged in the abrasive coating 11, and the abrasive particles comprise first abrasive particles 12 located at the bottom of the abrasive coating 11 and close to the end face of the base plate 1; the abrasive material further comprises second abrasive particles 13 arranged in a layer above the first abrasive particles 12, the average diameter of the first abrasive particles 12 is 110%-140% of the diameter of the second abrasive particles 13, and the minimum diameter of the first abrasive particles 12 is not lower than 70% of the maximum diameter.

The disclosure relates to fixed-abrasive grinding plates, fixed-abrasive grinding tools formed therefrom, and related methods. The grinding plate generally has a composite structure with abrasive beads (e.g., beads with diamond abrasives), a porosity additive, and an inorganic filler and / or flux agent distributed throughout a binder matrix formed from a polymeric resin (e.g., a cured, thermoset resin) or a vitreous material (e.g., a fired, vitrified glass frit matrix).

The invention discloses a gas-magnetic-liquid parallel tangential synergistic grinding wheel femtosecond laser trimming device. According to the technical scheme, the gas-magnetic-liquid parallel tangential synergistic grinding wheel femtosecond laser trimming device is characterized by comprising a double-blowing gas system, an electric magnetic field system, a femtosecond laser trimming system, a grinding wheel and a liquid phase cooling box. Plasma formed in the femtosecond laser trimming process can be blown off under the auxiliary action of the two-way air blowing pipe, the plasma is prevented from returning to cover the surface of a grinding wheel, and the chip containing space around abrasive particles and the height of the abrasive particles protruding out of a binding agent are reduced; the cooling liquid in the liquid-phase cooling box can avoid the defects of hot cracks, graphite metamorphic layers, re-coagulation layers, residual tensile stress and the like caused by heat accumulation around the diamond abrasive particles; uniform magnetic field distribution formed by the electric magnetic field system can adjust distribution uniformity of substances on the surfaces of the abrasive particles, pits and convex points on the surfaces of finished diamonds caused by non-uniform energy absorption of the diamond abrasive particles are avoided, and accordingly finishing efficiency and finishing quality are greatly improved.

A ski or snowboard edge sharpener may include an abrasive grinding wheel, a belt-driven drive train or direct drive system that connects a motor and grinding wheel drive mechanism and decreases the grinding wheel's speed of rotation relative to the speed of the motor, a grinding wheel mount allowing selection and use grinding wheels of different grits and materials and grinding wheel controls allowing the control of the cut depth and the grinding wheel angles relative to the longitudinal and transverse planes of the ski edge surface to be sharpened. In some embodiments, the sharpener may alternatively include a grinding wheel and motor that drives the grinding wheel drive mechanism. Such configurations may allow repeated sharpening of a ski edge at specific / chosen angles with a specific / chosen surface finish. A position lockdown device that is part of each of the control mechanisms may be included.

It reduces the crack rate without shortening the lifespan of the grinding wheel. [Solution] The method for manufacturing a glass plate includes a rough polishing step S2 in which the end face Ga of the glass plate G is processed with a grinding wheel 3, and a finish polishing step S3 in which the end face Ga of the glass plate G is processed with a grinding wheel 4 after the rough polishing step S2. In the rough polishing step S2, the end face Ga of the glass plate G is processed with a mixed abrasive grinding wheel which is made up of a mixture of abrasive grains of different grits.

The application provides a knowledge and data double-driven broken mill equipment health management industry model construction method, and belongs to the technical field of artificial intelligence.In the application, firstly, broken mill equipment multi-source knowledge and operation and maintenance data are acquired, knowledge extraction, sequence reconstruction and unified vectorization processing are performed, a mixed vector with semantic alignment is formed, differences of heterogeneous data are eliminated, and standardized input is provided for a model;then, a neural engine is constructed based on a Transformer, a symbolic reasoning engine is constructed in combination with an expert rule base and forward reasoning, an interactive checkable double-engine collaborative reasoning architecture is formed, data generalization and mechanism constraint are considered;next, real-time operation and maintenance data and query input architecture are constructed, a result is generated by the neural engine, and the symbolic engine is checked, iteratively modified, and a reliable reasoning sample is obtained;finally, a health management instruction set is constructed, a low-rank adaptive fine-tuning model is adopted, RAG retrieval and thinking chain prompting are fused, and finally integrated and highly reliable broken mill equipment health management industry model construction is completed.

The invention relates to a semiconductor silicon wafer thinning process based on chemical-mechanical coordination and multi-step stress management, which belongs to the technical field of semiconductor manufacturing and comprises the following operation steps: 1, a chemical-mechanical coarse grinding stage: thinning the back surface of a silicon wafer by using a fixed abrasive grinding wheel and a chemical active grinding fluid; and 2, an in-situ stress management relay layer coating and curing stage: coating and curing a polymer film on the back surface of the thinned silicon wafer in situ to serve as a stress management relay layer. And 3, a chemical mechanical accurate grinding and relay layer synchronous removal stage: performing accurate grinding on the silicon wafer covered with the relay layer by using a fine-grained grinding material and a chemical active medium, and synchronously realizing refining of the surface of the silicon wafer and complete removal of the relay layer. By introducing a chemical activation step and a stress management relay layer, pure mechanical removal is converted into chemically-assisted plastic domain removal, and processing stress is actively managed, so that efficient, low-damage and low-stress thinning is realized in a single device or process sequence.

The invention discloses a grinding and polishing method for finely regulating and controlling damage and flatness of a large-size cadmium zinc telluride wafer, and relates to the field of semiconductor wafer processing. According to the method, traditional suspended abrasive grinding and polishing and paraffin chip bonding are replaced through the steps of UV film chip bonding (PET / PO and the like are selected as a base material, and air bubbles are removed in vacuum), thickness measurement, grinding wheel grinding and thinning (damage is controlled through segmented feeding), ultraviolet peptizing and chip taking, chemical mechanical polishing (specific polishing liquid and parameters) and acid and plasma cleaning. The grinding and polishing device can be used for grinding and polishing wafers with the wafer ring size larger than 12 inches and can also be compatible with wafers of 8 inches or below, the thickness deviation of the ground and polished wafers is smaller than or equal to + / -2 micrometers, the surface shape PV is smaller than or equal to 6 micrometers, deep scratches do not exist, and volatile organic reagents are not needed. The method is simple and efficient in process, and can be used for preparing an epitaxial-level tellurium-zinc-cadmium substrate (for a tellurium-cadmium-mercury infrared detector) and a detection-level tellurium-zinc-cadmium material (for a medical X-ray detector and the like).

The application provides an abrasive grinding disc based on abrasive particle concentration difference distribution and a manufacturing method thereof, and relates to the technical field of grinding and polishing. The method comprises the following steps: S1, preparing a metal base disc; S2, calculating the abrasive particle concentration of the abrasive block in different regions of the grinding disc based on a workpiece surface quality uniformity model, determining the formula of the abrasive block, and preparing abrasive blocks with different abrasive particle concentrations; S3, pasting the prepared abrasive blocks with different abrasive particle concentrations on the corresponding positions of the metal base disc according to the design, and completing the manufacturing of the grinding disc with different abrasive particle concentration distributions of the abrasive blocks; and S4, installing the manufactured grinding disc on a corresponding grinding machine tool. Through the application, the surface quality uniformity of the ground workpiece and the consistency of the product can be effectively improved.

A device for supplying and recovering a minimal quantity lubricant in a magnetic field-assisted abrasive grinding, including a grinding wheel guard assembly, including a grinding wheel guard, grinding wheel, and wind deflector; a magnetic worktable mounted on the guard, and a magnetic clamp on the worktable; a controllable magnetic field assembly, including a permanent magnet and a first guide rail mechanism mounted on the deflector, the magnet being connected to the mechanism and to a recovering and filtering device; a controllable nozzle assembly, connected to the deflector on an opposite side of the magnetic field assembly, including a nozzle connected to a linear motion mechanism; and a controlling and monitoring assembly, including a vision camera on the worktable, connected to a system control box. The magnetic nanofluid can exert the optimal lubricating properties and cooling performance under the magnetic field-assisted abrasive grinding, and the magnetic nanoparticles can be further recycled.

The invention discloses a drilling tool and a hole machining method.The drilling tool is used for conducting hole machining on a semiconductor gas uniformizing disc, the drilling tool comprises a rack, a drilling assembly, a bearing table and a spraying piece, the drilling assembly is arranged on the rack, and the drilling assembly comprises a plurality of ultrasonic vibration pieces; the bearing table is arranged on the rack, the bearing table is provided with a mounting surface used for bearing the semiconductor gas uniformizing disc, the mounting surface is obliquely arranged, the mounting surface and the ultrasonic vibration pieces are oppositely arranged at intervals, and the distances between the mounting surface and the ultrasonic vibration pieces are the same; the spraying piece is arranged towards the mounting surface and is used for spraying grinding liquid containing grinding materials to the semiconductor gas uniformizing disc; the ultrasonic vibration piece drives the grinding liquid to vibrate through ultrasonic vibration, so that the grinding material conducts high-frequency micro grinding hole machining on the semiconductor gas uniformizing disc. According to the embodiment, synchronous machining of the multiple micropores can be achieved, and therefore the machining efficiency is improved.

The utility model discloses a diamond abrasive grinding wheel with a temperature detection function, which is characterized by comprising a grinding wheel body, the grinding wheel body comprises a grinding wheel base body ring, a grinding wheel abrasive ring is arranged on the outer side of the grinding wheel base body ring, and a pre-embedded cavity is formed in the part, close to the grinding wheel abrasive ring, of the grinding wheel base body ring; a temperature sensing module is arranged in the embedded cavity through a packaging shell with an outer waterproof layer; the temperature sensing module comprises a temperature sensor making contact with the inner side of the grinding wheel abrasive ring. The temperature sensor is connected with the wireless transmission module through a sensing circuit. According to the diamond abrasive grinding wheel with the temperature detection function, the temperature sensor is arranged at the root of the grinding wheel abrasive ring, and due to the excellent heat conductivity of diamond, the grinding temperature can be rapidly conducted into the grinding wheel abrasive ring; and the temperature detected by the temperature sensor at the root of the grinding wheel abrasive ring is transmitted to terminal equipment through an external power supply and a wireless transmission module.

The utility model relates to the technical field of grinding wheels, in particular to a resin and diamond combined abrasive grinding wheel which comprises a cylindrical aluminum base body, a combined annular plate is arranged on the side face of the aluminum base body along the circumference, an expansion connecting structure is arranged on the combined annular plate, and a connecting through hole is formed in the center of the aluminum base body. And the grinding material layer is arranged on the side face of the aluminum base body along the circumference, wraps the combining ring plate and is reinforced and fixed through an expansion connecting structure and the combining ring plate. According to the abrasive grinding wheel combining the resin and the diamond, the combining ring plate is arranged on the side face of the aluminum base body, the expansion connecting structure is arranged on the combining ring plate, the abrasive layer and the combining ring plate are connected through the expansion connecting structure, the connecting area is increased, and the combining strength of the abrasive layer and the aluminum base body is improved. And the grinding quality and efficiency of the grinding wheel as a grinding tool are further ensured.

This invention discloses a high-precision inner surface processing method for grooved monochromatic crystals. The steps include: 1) placing the grooved monochromatic crystal into a material tank and using a grinding head of a magnetron abrasive grinding device to coarsely grind the inner surface of the crystal; the magnetron abrasive grinding device includes a magnetron drive unit and the grinding head; 2) using the grinding head to finely grind the inner surface after step 1); 3) performing wet chemical etching on the inner surface after step 2) to remove the damaged layer; 4) using the grinding head to finely polish the inner surface after step 3); 5) cleaning the inner surface after step 4) to generate a soft hydration layer on the inner surface; 6) cleaning the grooved monochromatic crystal after step 5) and using the grinding head to perform stress-relieving polishing on the inner surface. This method can better transfer the heat generated at the interface during polishing, obtain a better surface structure, and is less restricted by the overlapping part of the primary and secondary crystals of the grooved crystal.

The utility model relates to a sintering device for a white corundum superfine powder abrasive grinding wheel, and effectively solves the problems that in the sintering process of the existing white corundum superfine powder abrasive grinding wheel, the accurate control difficulty of the temperature is large, the sintering temperature of white corundum ceramics is generally between 1700 DEG C and 1850 DEG C, and the specific temperature needs to be determined according to product performance requirements, however, the sintering cost is high. The problems that an existing sintering device is difficult to achieve accurate regulation and control in a whole sintering area, then the situation that temperature fluctuation is large easily occurs in the sintering area, the densification degree of a grinding wheel is affected, the inner structure of the grinding wheel is possibly uneven, and then the overall performance and the service life of the grinding wheel are affected are solved. According to the sintering device for the white corundum superfine powder abrasive grinding wheel, by means of matched rotation of the supporting plate and the rotating disc, the grinding wheel above can be driven to rotate at the constant speed in different directions, then the grinding wheel can be heated more evenly in a sintering area, and a better sintering effect is achieved.

The utility model discloses a screening structure for grinding balls, and mainly relates to the field of grinding ball screening. Comprising a screening box, a feeding hopper is arranged at the top of the screening box, a plurality of discharging openings are formed in the side face of the screening box, an inclined discharging plate is arranged below the feeding hopper, a plurality of screening rods are rotationally connected to the side face of the discharging plate, a supporting rod is arranged in the screening box, one ends of the screening rods make contact with the top of the supporting rod, and the other ends of the screening rods make contact with the top of the supporting rod. And positioning columns matched with the screening rods for use are arranged on the supporting rods, and a plurality of partition plates are slidably connected to the positions, located below the screening rods, in the screening box. The abrasion grinding ball screening device has the advantages that the technical problem that abrasion grinding balls of different sizes cannot be screened conveniently can be solved, the requirement for screening the abrasion grinding balls of different sizes is met by adjusting the distance between every two adjacent screening rods, and the efficiency and convenience of screening the abrasion grinding balls are greatly improved.

The utility model provides a bearing peach-shaped channel superfinishing grinding device which comprises a base, and a workpiece rotating supporting mechanism and an oilstone swinging mechanism are arranged on the base. The workpiece rotating and supporting mechanism comprises a left tip and a right tip, the left tip is provided with a drive plate and a heart-shaped chuck, and the position of the right tip in the axial direction is adjustable. A mounting seat of the oilstone swinging mechanism can be fed in the left-right direction and the front-back direction and comprises an oilstone swinging rotating shaft capable of rotating in a reciprocating mode in the axial direction, an oilstone frame is arranged at the output end of the oilstone swinging rotating shaft, an oilstone box is arranged at the outer end of the oilstone frame, oilstone is assembled in the oilstone box in the vertical direction, and the axial extension line of the oilstone swinging rotating shaft and the oilstone intersect at a point O; and an oilstone pressing rod and a hydraulic valve are arranged on the oilstone frame. The device can finish superfinishing grinding of two curved surfaces of a peach-shaped channel under the condition that one device is used for one-time clamping, meanwhile, the device can be suitable for superfinishing of a shaft workpiece with a plurality of channels, and the adverse effect of multiple times of feeding on the superfinishing grinding precision can be effectively reduced.

This utility model discloses a workpiece clamping table for soft rubber abrasive grinding, comprising: a base plate; an abrasive inlet chamber with a first and a second material chamber separated therefrom; a first positioning sleeve communicating with the interior of the first material chamber; and a clamping mechanism including a telescopic component fixed to a first mounting surface, a clamping block moved by the telescopic component toward or away from the first positioning sleeve, a second positioning sleeve mounted on the clamping block, and a connecting pipe. The clamping block is connected to the telescopic component, one end of the second positioning sleeve is used to connect to the workpiece, and the other end is connected to the second material chamber through the connecting pipe. This utility model sets up a coaxial first and second material chamber within the abrasive inlet chamber, allowing the pressure mechanism of the abrasive flow polishing machine to be arranged vertically, effectively reducing the polishing machine's footprint, reducing the volume of the abrasive inlet chamber itself, and shortening the flow path of the abrasive flow. The workpiece processing station is located outside the pressure mechanism, improving the convenience and safety of workpiece replacement.

This invention belongs to the field of semiconductor manufacturing and abrasive grinding wheel technology, specifically relating to a CMP polishing pad dresser with gradient wear compensation characteristics and its fabrication process. The dresser of this invention includes a substrate and a composite cutting layer distributed on its surface. The composite cutting layer consists of large-particle-size diamond abrasive distributed in a first region of a sector shape and small-particle-size diamond abrasive distributed in a second region. The exposed height of the large-particle-size diamond abrasive is greater than that of the small-particle-size diamond abrasive, and both are embedded and fixed by a multi-layer metal structure including multiple nickel plating layers and an outermost chromium-plated anti-corrosion layer. This invention utilizes the mechanism of diamond abrasive of different particle sizes being exposed in stages according to the wear progress during the dressing process to offset the performance degradation caused by cutting edge dulling, solving the problems of short lifespan and linear decline in dressing rate of traditional dressers. Experiments have shown that this structure can significantly extend the lifespan of the dresser and maintain the stability of the dressing rate over a long period, which is of great significance for improving the consistency of wafer planarization processes.

The application discloses a kind of multilayer abrasive grinding wheel and its preparation method, adopt hole template as abrasive interval arrangement template, and the abrasive layer is prepared on the welding sheet;Welding sheet is set on single-layer blank working layer, then pore-forming agent is arranged on welding sheet to prepare single-layer blank working layer again, and the above-mentioned step is repeated to prepare multilayer superhard abrasive grinding wheel blank, the regular arrangement of abrasive makes the abrasive distribution in grinding wheel working layer present regular, ordered form, in the process of grinding wheel grinding processing, the regular arrangement of abrasive can ensure that each abrasive has enough chip space, thereby effectively avoiding the adhesion of grinding wheel surface grinding chip;Meanwhile, each abrasive is stressed more evenly, and wear is consistent, thereby improving the service life of grinding wheel.