Polishing composition

Inactive Publication Date: 2005-01-06
KAO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention relates to the following: (1) a polishing composition containing an α-alumina, an intermediate alumina, an oxidizing agent and water; (2) a method for reducing waviness of a substrate to be polished, including the step

Problems solved by technology

However, such mechanical conditions are effective but not to a satisfactory level.
However, these polishing compositions ca

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example

Examples 1 to 17, Comparative Examples 1 to 5

[Method for Formulating Polishing Composition]

There were mixed together given amounts of α-alumina (average primary particle size: 0.07 μm, average secondary particle size: 0.3 μm, specific surface area: 15 m2 / g, purity: 99.9%), θ-alumina (average secondary particle size: 0.2 μm, specific surface area: 120 m2 / g, purity: 99.9%), an oxidizing agent, an acid and other additives as listed in Tables 1 to 3, and balance ion-exchanged water, while stirring, and pH-adjusted with an aqueous ammonia, to give a polishing composition.

[Polishing Method]

A substrate surface made of a Ni—P plated aluminum alloy, the substrate surface having an average deviation, of all points from plane fit to test part surface Ra of 0.2 μm, as determined by Talystep commercially available from Rank Taylor-Hobson Limited (size of tip end of profilometer: 25 μm×25 μm, by-pass filter: 80 μm, measurement length: 0.64 mm), a thickness of 1.27 mm and a diameter of 3.5 i...

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Abstract

A polishing composition containing an α-alumina, an intermediate alumina, an oxidizing agent and water; a method for reducing waviness of a substrate to be polished, including the step of applying the polishing composition to the substrate to be polished; and a method for manufacturing a substrate, including the step of polishing a substrate to be polished with the polishing composition. The polishing composition is suitable for polishing substrates for precision parts such as substrates for magnetic recording media for magnetic discs, optical discs, opto-magnetic discs, and the like; photomask substrates; glass for liquid crystals; optical lenses; optical mirrors; optical prisms; and semiconductor substrates.

Description

FIELD OF THE INVENTION The present invention relates to a polishing composition having a high polishing rate and being capable of reducing waviness of a substrate to be polished. Further, the present invention relates to a method for reducing waviness of a substrate to be polished with the polishing composition, and a method for manufacturing a substrate with the polishing composition. BACKGROUND OF THE INVENTION In hard disks, in order to make the minimum recording area smaller and to increase storage capacity, the flying height of the magnetic head has been desired to be lowered. In order to lower the flying height of the magnetic head, it is necessary to reduce both the short-wavelength waviness (a waviness having a wavelength of from 50 to 500 μm) and the long-wavelength waviness (a waviness having a wavelength of from 0.5 mm or more). The term “waviness” as referred to herein means surface dents and projections having a wavelength longer than that of the surface roughness. In...

Claims

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Application Information

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IPC IPC(8): B24B37/00C09G1/02C09K3/14C09K13/00G11B5/84G11B7/26G11B11/105
CPCC09K3/1463C09G1/02
Inventor FUJII, SHIGEOKITAYAMA, HIROAKI
Owner KAO CORP
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