21 results about "Profilometer" patented technology

The application provides a 3D printer and a working method of a laser profiler. The 3D printer is provided with a calibration plate. Before a target object is scanned by the laser profiler, the print head and / or the print bed of the 3D printer can be moved, so that the laser profiler has different distances with the print bed. The camera and the laser emitter of the laser profiler controlled under different distances respectively shoot laser images with laser lines and calibration images without laser lines. Then, based on the calibration images and the laser images under different distances, the laser plane parameters of the laser profiler are calculated, so that the calibration of the laser profiler is realized in the 3D printer. When the calibration parameters of the laser profiler change due to vibration or other reasons, the laser profiler of the 3D printer can be recalibrated, so that the scanning precision of the laser profiler is ensured, and the precision of the 3D printer is ensured.

The application relates to the field of semiconductor detection equipment and discloses a high-precision wafer profiler, which comprises a frame body mechanism, a wafer loading table mechanism, an optical detection mechanism, a temperature compensation mechanism and a central processing mechanism, wherein the frame body mechanism comprises a base, the wafer loading table mechanism is arranged above the base, the optical detection mechanism is arranged above the wafer loading table mechanism, the optical detection mechanism comprises a thickness detection assembly, a notch detection assembly and an edge detection assembly, the thickness detection assembly, the notch detection assembly and the edge detection assembly are integrated in one device, the device is highly integrated, carrying errors and repeated positioning errors are eliminated, the base is integrally cast from natural marble or high-strength cast iron, the measurement precision is stable, the XYZ theta four-degree-of-freedom motion module is combined with a fine adjustment mechanism of an optical lens, the accurate control and rapid focusing of the wafer position to be detected can be realized, and different specifications of wafers to be detected can be adapted.

The utility model belongs to the profile gauge technical field, and disclose a kind of profile gauge for powder metallurgy mould detection, including workbench, the workbench top is fixed with lifting mechanism, the lifting mechanism bottom is equipped with profile gauge test body, the workbench top is equipped with locating plate, the locating plate top is detachably equipped with stop block, the locating plate top is slidably equipped with fixed plate.The utility model is cooperated through locating plate, fixed plate, clamping block and threaded rod, can realize the firm clamping of different size mould, avoid the displacement of mould in detection process, guarantee the accuracy of detection data, simultaneously, through the setting of L-shaped plate A, L-shaped plate B, inner slide and restraint band, can effectively support to inclined mould, expand the adaptation range of equipment to different state mould, further improve the reliability of detection, realize the effect of self-adapting positioning and fixing to different size mould.

This invention discloses a visual inspection device for the end face of a tablet pressing mold, comprising a cabinet and a workpiece. The cabinet houses a worktable with a clamping mechanism for limiting and clamping the workpiece. A first visual inspection mechanism is mounted on the worktable, and a second visual inspection mechanism is located on the upper part of the worktable near the clamping mechanism. Compared to existing technologies, this device, with its adjustable clamping mechanism and two visual inspection mechanisms, effectively improves inspection efficiency through their combined operation. The clamping mechanism rotates the workpiece under the drive of a stepper motor. The first visual inspection mechanism integrates an end face inspection camera and a laser profilometer, simultaneously measuring end face parameters and scanning surface defects. The second visual inspection mechanism is equipped with multiple axial inspection cameras, enabling precise modeling of the overall contour of the workpiece, thus avoiding efficiency losses caused by multiple clamping operations.

Embodiments of the present application provide a detection system, an opening and closing clamp, and a reverse arch detection method of a folding screen. The detection system is used to detect a folding screen of a folding electronic device, the folding electronic device being foldable along a folding axis, and the folding screen having an axis region corresponding to the position of the folding axis. The detection system comprises an opening and closing clamp and a profilometer. The opening and closing clamp comprises a base, a fixing assembly and a turnover mechanism arranged on the base. The fixing assembly is used to fix the folding electronic device on the turnover mechanism. The turnover mechanism has a rotating shaft and a bearing surface for bearing the folding electronic device, so that the turnover mechanism can drive the folding electronic device to fold or flatten along the folding axis, thereby adjusting the opening and closing angle of the folding electronic device. The profilometer is arranged towards the bearing surface of the turnover mechanism, and is used to obtain line profile data of the axis region of the folding screen, thereby dynamically detecting the state of the folding screen during folding or flattening of the folding electronic device.

The application discloses a kind of high-precision polishing method of cylindrical aspherical optical element based on mechanical arm, comprising the following steps:1) for the high-precision coordinate system space error compensation of cylindrical asphere processed by mechanical arm: obtain dynamic processing information by real-time acquisition of multiple sensors, and automatically adjust processing pose according to the dynamic processing information to keep processing state consistency, finally obtain the cylindrical aspherical element of set precision;2) for the further error compensation of cylindrical asphere processed after compensation coordinate system based on profilometer and three-coordinate measurement: for the reference inconsistency problem caused by profilometer measurement principle, the model is established based on the reference of three-coordinate measuring instrument and profilometer combination;Wherein high-precision measurement analysis calculation model is proposed based on profilometer measurement result, for compensating high-precision surface precision;The deviation of space coordinate system is calculated by the deviation of compensation position in the initial compensation based on profilometer, and closed-loop compensation is completed.

This application provides a method, equipment, medium, and product for compensating the grinding trajectory of rail welds, relating to the field of machine control technology. The method includes: scanning the top of the rail with a laser profilometer to obtain rail top contour point cloud data of the area containing the weld, arranged in scanning order; establishing a reference straight line based on the coordinate points of the first and last rail top contours, calculating the vertical distance from each rail top contour coordinate point to the reference straight line, and determining the robot base coordinate system position coordinates of the weld center point according to distribution characteristics; scanning the rail cross-sectional contour at a first preset distance to the left and a second preset distance to the right of the weld center position to obtain actual weld pose point cloud data; transforming it to the robot base coordinate system using a calibration transformation matrix and a base transformation matrix; and correcting the preset grinding trajectory based on the actual weld's position deviation and attitude deviation relative to the standard weld to generate the grinding execution trajectory. This solution solves the technical problem of insufficient accuracy in grinding trajectory compensation.

Embodiments of the present application provide a kind of profilometer camera calibration method, device and electronic equipment, specifically include: the three-dimensional point cloud data obtained by profilometer camera acquisition calibration block is acquired, for each surface of calibration block, the model constraint condition of each surface is determined, and the local point cloud data belonging to each surface of calibration block is determined from three-dimensional point cloud data, the extrinsic parameter that makes the local point cloud data of each surface and the model constraint condition of each surface match is determined as the target extrinsic parameter of profilometer camera, profilometer camera is calibrated.So, by the embodiment provided in the present application, profilometer camera can be calibrated based on the surface model constraint condition of calibration block with the help of simple structure calibration block, can effectively reduce the calibration cost of profilometer camera, effectively improve the measurement accuracy of profilometer camera.

This invention relates to a point cloud-based system and method for detecting defects and depth in engraved marking characters, belonging to the fields of machine vision, 3D measurement, and industrial automation. The system includes a laser profilometer, a robotic arm, a PLC, a computer, and data acquisition and processing software modules. The method acquires point cloud data from the workpiece surface and performs two tasks in parallel: first, extracting character contours from the point cloud to generate a two-dimensional image, comparing it with a standard character template to achieve quantitative defect detection of missing and redundant areas; second, separating the character engraving portion from the point cloud, calculating the depth of each area, and averaging the values ​​to achieve engraving depth measurement. This invention can simultaneously complete the quantitative detection of character contour defects and the precise measurement of engraving depth based on the same point cloud data, overcoming the shortcomings of low detection efficiency and inability to correlate appearance and structural quality in existing technologies. It can be widely applied to the quality control of engraved marking characters on painted surfaces.

The invention relates to a method for measuring a first height map and a second height map of a sample surface with a profilometer and combining the first and second height maps to a composite height map. The invention further relates to a profilometer configured for measuring a first height map and a second height map and combining the first and second height maps to a composite height map.

The utility model discloses a kind of flaw detection equipment based on 2D camera and 3D camera, it is related to flaw detection technical field, the flaw detection equipment includes detection table and the detection machine shell being arranged on the detection table, further include 2D camera adjusting assembly, laser profilometer 3D camera, 3D camera adjusting assembly and mobile platform component.The utility model is first by industrial area 2D camera and carries out global rapid detection, only when identifying that there is scratch, laser profilometer 3D camera is started to the specific area detection, avoids the invalid shooting of 3D camera to no flaw area, greatly shortens detection time, reduces resource consumption;The 2D camera of the equipment can quickly obtain the plane position and profile information of the multiple side scratches of workpiece, and the 3D camera can accurately measure the depth of the scratched area, which ensures comprehensive investigation of the scratches on the workpiece surface and accurate detection of the scratch depth, improving the integrity and accuracy of the detection.

The application discloses a kind of indentation test method and system suitable for complex curved surface parts, it is related to the technical field of material mechanical property test, the method comprises: confirming initial space coordinate system;The surface of the part to be tested is scanned by three-dimensional profilometer, three-dimensional topography data is obtained, curved surface equation is obtained, and tangent plane equation at target measuring point on the part to be tested is calculated;Confirm the angle between the plane intersection line of tangent plane and the initial space coordinate system and horizontal plane, and according to the angle and the preset interval between the telescopic rod, two telescopic rods are calculated and controlled to move;The center point coordinate of spherical hinge moving assembly, the projection point coordinate of vertical projection on the plane where the positioning table is located is calculated to calculate the coordinate of the center of positioning table, and the coordinate difference between projection point coordinate and the center coordinate is calculated to carry out indentation test to the target measuring point, the application can quickly, accurately and non-destructively carry out indentation test to complex curved surface parts.

This invention discloses a pinch roll wear control method based on roll profile optimization. The device includes the following steps: S1, differentiated design of the pinch roll; S2, dynamic balancing treatment of the pinch roll; S3, wear detection of the pinch roll surface; and S4, strip displacement monitoring and latent damage detection. This method changes the contact trajectory between the strip and the roll surface through differentiated chamfer design, making the contact stress evenly distributed along the width direction of the strip, thus solving the problem of uneven wear on the pinch roll surface caused by strip transportation. Furthermore, by using a laser displacement sensor, ultrasonic detection, and an industrial camera, it overcomes the limitation of laser profilometers in only detecting surface wear, achieving comprehensive detection of latent damage and impurity adhesion on the roll surface, meeting user needs.

The application discloses a multi-objective calculation method for slurry grading optimization of solid waste aggregate, and relates to the technical field of data processing and analysis. The method comprises the following steps: arranging an electrical resistance tomography array, a high-speed linear array camera and a three-dimensional laser profilometer in a slurry conveying pipeline detection section and performing multi-modal synchronous acquisition to obtain conductivity distribution grayscale images, two-dimensional flow images and surface height point cloud data; pumping the slurry prepared according to a candidate grading scheme to the slurry conveying pipeline detection section, calculating a grayscale difference value based on the conductivity distribution grayscale images and calculating a grading deviation based on the two-dimensional flow images, and performing iterative subdivision on an equilateral triangle grading domain according to the grayscale difference value and the grading deviation to obtain a Pareto optimal solution set. The application can directly reflect the real flow state and particle distribution characteristics of the slurry, reduce the dependence on experience and static tests, and improve the pertinence and stability of the grading design.

This application discloses a method for detecting the cross-sectional dimensions of scribing processes. The method includes: scanning the scribing area using a line laser profilometer to obtain a cross-sectional point cloud set; processing the single-frame point cloud to locate the bottom feature points and two surface feature points of the scribing cross-section; and reconstructing the cross-section into a three-dimensional spatial distribution based on the feature points and scribing processing information, and calculating the scribing depth and width. This application accurately calculates the depth and width of the scribing cross-section by precisely locating feature points from a single-frame point cloud and combining this with processing information for three-dimensional reconstruction. Compared to traditional offline sampling inspection methods, this application achieves automated online detection of scribing processes, providing reliable real-time feedback for subsequent processing and contributing to closed-loop control and consistency improvement in scribing processes.

This application relates to a method for measuring the thickness of ultrathin film materials, comprising: acquiring surface mass spectra on the surfaces of the ultrathin film and the substrate using a single ion source to determine the characteristic ion peaks of the ultrathin film and the substrate; selecting an etchable micro-region, etching the ultrathin film using a sputtering ion source, alternating the etching and spectral acquisition processes until the characteristic ion peaks of the substrate appear and their intensity stabilizes, thus completing the etched micro-region; repeating the etching to form multiple spaced target etched micro-regions; placing the sample in a profilometer, controlling the probe to move on the surface of the micro-region, recording the depth curve of the etched pits, reading the thickness of multiple micro-regions and taking the average value to obtain the thickness of the ultrathin film. This method is applicable to polymer ultrathin films with a thickness of 1-200 nm and substrates of glass, ITO, silicon wafers, or mica. Through uniform etching and multi-point averaging, the accuracy and repeatability of film thickness measurement are improved.

The utility model discloses a kind of high-precision piston size and glossiness detection device of quick, it is related to part detection field, including the material detection table for bearing piston material and the cover plate being located in material detection table top, along with the rotation of material detection table, piston material rotates synchronously.The periphery of the material detection table is provided with a laser profilometer, and a laser range finder that can move synchronously with the cover plate is provided above the material detection table.When the piston material is located on the material detection table to receive detection operation, the cover plate is lowered, and the top end of the piston material is abutted, and the laser range finder is moved into the inside of the piston material.The utility model can comprehensively and quickly implement detection operation on piston material, improve the efficiency and accuracy of detection work.And in the process of implementing detection operation, different sizes of pistons in the specified range can be implemented detection operation, the scope of application is wide, the time required for replacing detection instrument is reduced, and the portability of detection operation is improved.

This invention relates to the field of mold polishing technology, specifically to an automatic polishing method and system for neodymium iron boron molding dies. The method includes: clamping the die to be polished and using a laser profilometer to measure reference points and establish a workpiece coordinate system; registering the surface model and surface roughness parameters in the workpiece coordinate system to obtain the surface data to be processed; resampling the areas to be polished to determine the polishing depth and planning graded polishing trajectories; and calling the corresponding polishing modules to execute the graded polishing trajectories. Addressing the problem of uneven polishing and surface misalignment that easily occur in existing automated polishing systems when handling complex surface polishing tasks, this invention determines the available polishing depth at different points based on the error between the surface data to be processed and the ideal surface data, and plans graded polishing trajectories for polishing modules with different roughnesses. This eliminates rough surfaces and burrs, while ensuring that the final polishing result matches the ideal surface data.