48 results about "MAP sensor" patented technology

A method for generating maps of a desired area that are referenced to a universal uniform spatial reference frame includes a mobile platform having a mapping processor and at least one mapping sensor is provided. The mapping sensor is applied to determine the location of features to be mapped relative to the mobile platform. The mobile platform is moved to a new location, and the mapping sensor is further applied to determine the location of features to be mapped relative to the mobile platform. These steps are repeated until the desired area is mapped. The at least one mapping sensor is also applied to locate at least one position on the map of the desired area on a universal uniform spatial reference frame. Positions on the map of the desired area are transformed into the universal uniform spatial reference frame.

A precision soft-touch gripping mechanism has a mounting plate attached to a robot arm. The plate supports a stepper motor. The output shaft of the stepper motor is connected through a spring to an elongated finger that slides in a central longitudinal slot of the plate and supports a first wafer gripping post, while on the end opposite to the first wafer gripping post the mounting plate pivotally supports two L-shaped fingers with a second and third wafer gripping posts on their respective ends. The mounting plate in combination with the first sliding finger and two pivotal fingers forms the end effector of the robot arm which is thin enough for insertion into a wafer-holding slot of a wafer cassette. The end effector is equipped with a mapping sensor for detecting the presence or absence of the preceding wafer, wafer position sensors for determining positions of the wafer with respect to the end effector, and force sensors for controlling the wafer gripping force. Several embodiments relate to different arrangements of gripping rollers and mechanisms for control of the gripping force and speed of gripping required for gripping the wafer with a soft and reliable touch.

An object of the invention is to save the trouble of mapping sensor chips on a map information system. A map information management unit 124 is accessed via a network 122. Neighborhood information based on a present position measured by an own position measuring unit 102 is obtained by searching a map DB 127. A sensor information setting unit 106 displays the neighborhood information in a display unit 108. An ID reading unit 104 reads an ID 111 of a sensor chip 110, and registers the ID 111 in the map DB 127 after associating it with equipment information displayed in the display unit 108. The measurement values measured by a sensor 112 are transmitted from an antenna 114 and received by a sensor information receiving unit 119 of the receiver 118. A sensor information communication unit 120 accesses the network 122 and the measurements are transmitted to a sensor information management unit 123. The measurement values are accumulated in a sensor DB 126. The sensor DB 126 is searched using a sensor ID associated in the map DB 127 and the measurements are viewed as map information associated with equipment.

A precision soft-touch end effector has a mounting plate attached to a robot arm. The plate supports a stepper motor. The output shaft of the stepper motor is connected through a spring to an elongated finger that slides in a central longitudinal slot of the plate and supports a first wafer gripping post, while on the end opposite to the first wafer gripping post the mounting plate pivotally supports two L-shaped fingers with a second and third wafer gripping posts on their respective ends. The mounting plate in combination with the first sliding finger and two pivotal fingers forms the end effector of the robot arm which is thin enough for insertion into a wafer-holding slot of a wafer cassette. The end effector is equipped with a mapping sensor for detecting the presence or absence of the preceding wafer, wafer position sensors for determining positions of the wafer with respect to the end effector, and force sensors for controlling the wafer gripping force. Several embodiments relate to different arrangements of gripping rollers and mechanisms for control of the gripping force and speed of gripping required for gripping the wafer with a soft and reliable touch.

An air intake manifold assembly for an internal combustion engine composed of a plurality of molded synthetic resin shells assembled to each other so as to define a plenum chamber, a plurality of inlet channels leading from said plenum chamber to cylinder inlets of the internal combustion engine, and a throttle body passageway leading from a throttle body mount into the plenum chamber; with a groove formed in a surface of at least one of the shells facing an adjacent shell and extending from an inlet opening to the throttle body passageway or the plenum chamber so as to form an elongate passage between the assembled shells leading from the inlet to the throttle body passage or plenum chamber, and a method of forming such an intake manifold assembly.

A mobile handset device collects sensor data about the physiological state of the user of the handset. The mobile handset device receives multimedia content, which is consumed on the mobile handset. In a deployment phase, the sensor data is used to classify the user's emotional response to individual pieces of media content consumed on the mobile device. A classification model built in a training phase may be used to map sensor data to classification labels indicative of the user's emotional response to multimedia.

An exhaust gas recirculation diagnosis device may include an EGR module that supplies an intake manifold with exhaust gas from an exhaust manifold, a MAP (manifold absolute pressure) sensor that measures pressure of the intake manifold, and a control portion that controls the EGR module such that the flow rate of the exhaust gas that is supplied from the exhaust manifold to the intake manifold is controlled by stages and monitors the value of the MAP sensor in a fuel cut off condition to diagnose whether the EGR module is faulty. The exhaust gas recirculation diagnosis device uses MAP sensor to perform exhaust gas recirculation and to diagnose the fault of the exhaust gas recirculation device.

Method for measuring a height map of a test, including measuring a coarse height map of the test surface with a pre-map sensor provided to an optical profiler with a relatively long working distance and / or a large field of view, storing the coarse height map in a memory, subdividing the coarse height map into sections appropriate for the field of view of a high resolution optical profiler sensor provided to the optical profiler, calculating corresponding X, Y and Z positions for the optical profiler sensor with respect to the test surface, calculating a trajectory in the X, Y, Z-direction for the optical profiler sensor with respect to the test surface using the calculated X, Y, Z-positions, moving the optical profiler in the X, Y, Z-direction with respect to the test surface according to the trajectory, and measuring a high accuracy height map with the high resolution optical profiler sensor.

An engine airflow management system includes an inlet portion to receive ambient air and a mass airflow (MAF) sensor to sense mass flow rate of air passed through the inlet portion. The airflow management system includes a throttle body to selectively restrict airflow and a throttle position sensor (TPS) to sense an opening value of the throttle body. The airflow management system includes an intake manifold in fluid connection with the throttle body configured to direct airflow to a number of combustion cylinders. A manifold air pressure (MAP) sensor detects air pressure at the intake manifold. A controller is programmed to monitor signals from each of the MAF sensor, TPS, and the MAP sensor and generate a residual error value based on a difference between a model-based value and a corresponding monitored signal. A response action is based on a trend of at least two residual error values.

A system and methods for the evaluation of the integrity of a wafer cassette and the disposition thereof are based upon evaluation of wafer measurement data obtained using a wafer sorter cassette mapping system utilized in-line during wafer sorting operations. In one embodiment, wafers are placed into slots in the wafer cassette. A wafer sorter cassette mapping sensor is scanned over the wafers in the wafer cassette. The positions of the wafers are measured while scanning the sensor over the wafers. The wafer position measurements are evaluated using a modeling system to determine slot positions, and a determination of the integrity of the cassette is generated. If the integrity determination indicates that the cassette is deformed beyond a predetermined value, the cassette is replaced. The measurement data may be stored in a data base for further trend analysis or for replacement forecasting.

A real-world vehicle includes multiple data sources that generate sensor data that is spatially-mapped to a real-world region; a data fusion system is configured to fuse or integrate (i) the spatially-mapped sensor data with (ii) virtual data, that has been generated outside of the vehicle or generated independently of the operation of the vehicle, and is spatially-mapped to a virtual world. This enables a fusion of the real and virtual worlds which enables a self-driving car to interact not only with the physical world but also to virtual objects introduced into the path of the car (e.g. by a test or development engineer) to test how well the car and its autonomous driving systems cope with the virtual object.

A method is provided for compensating for a valve lift deviation between engines equipped with a CVVL mechanism, in which the valve lift deviation is compensated for by an MAF sensor for measuring a reference air flow rate and an MAP sensor for measuring the pressure of an intake manifold. The method includes determining whether learning conditions for learning a valve lift deviation are met; after the determination, comparing a value MAP_MES measured by the MAP sensor and a modeled pressure MAP_MDL of a surge tank; if the MAP_MES value and the MAP_MDL value are different, learning the valve lift, and after the learning, calculating the final valve lift by adding the learned value of the valve lift to the basic valve lift characteristics. Various types of deviations in valve lift can be solved by using a learned value of valve lift deviation, the engines can have the same characteristics because a deviation in intake air flow rate is minimized by learning the valve lift of the engines, and the quality of the engine of the CVVL mechanism can be improved.

An apparatus for diagnosing a failure of a sensor may include an engine; an intake manifold; a turbocharger including a turbine rotated by exhaust gas of the combustion chamber and a compressor provided at the intake line, rotated in connection with the turbine, and compressing external air; a map sensor measuring a pressure of a front end portion of the compressor; a differential pressure sensor measuring a differential pressure of front and rear end portions of an EGR valve provided at an EGR apparatus; an operation information detecting device measuring operation information including an engine speed and a load; and a controller determining whether an exhaust gas pressure is constant from the operation information and comparing a change amount of the differential pressure sensor signal and a change amount of the map sensor signal in the condition that the exhaust gas pressure is constant to diagnose a failure of the differential pressure sensor.

A system and methods are described for the evaluation of the integrity of a wafer cassette and the disposition thereof based upon evaluation of wafer measurement data obtained using a wafer sorter cassette mapping system utilized in-line during wafer sorting operations. One method comprises initially placing two or more wafers into two or more of a plurality of slots in the wafer cassette. A wafer sorter cassette mapping sensor affixed to the wafer sorter is then scanned over the two or more wafers in the slots of the wafer cassette, using a wafer sorter. The positions of the wafers in the wafer cassette are then measured while scanning the sensor over the wafers. The wafer position measurements are then evaluated using a modeling system to determine slot positions within the cassette associated with the wafer position measurements, and a determination of the integrity of the cassette is generated based on the slot position determinations. If the integrity determination indicates that the cassette is deformed beyond a predetermined value, the cassette may be replaced and / or the measurement data may be stored in a data base for further trend analysis or for replacement forecasting.

The invention relates to a diagnostic system and a method for sensor in homogenous charge compression iginition engine system. An engine control system for a homogenous charge compression ignition (HCCI) engine includes an airflow determination module and a sensor diagnostic module. The airflow determination module generates a first plurality of estimates of airflow into the HCCI engine when the HCCI engine is operating in a first combustion mode, wherein the first plurality of estimates are based on an intake manifold absolute pressure (MAP), a mass air flow (MAF) rate, and a camshaft position. The sensor diagnostic module determines a state of at least one of a first plurality of sensors based on a predetermined threshold and differences between one of the first plurality of estimates and others of the first plurality of estimates, wherein the first plurality of sensors includes a MAP sensor, a MAF sensor, and a camshaft sensor.

A real-world vehicle includes: a plurality of data sources that generate sensor data that is spatially mapped to a real-world region; and a data fusion system configured to fuse or integrate (i) the spatially mapped sensor data with (ii) virtual data that has been generated outside the vehicle or has been generated independently of operation of the vehicle and is spatially mapped to a virtual world. This enables a fusion of the real world and the virtual world, enabling a self-driving automobile not only to interact with the physical world, but also to interact with virtual objects introduced into the path of the automobile (e.g., by a test or development engineer) to test how well the automobile and its autonomous driving system handle the virtual objects.

The mapping sensor system of the invention is intended for use with a mechanical arm of an industrial robot which loads and unloads flat circular objects, such as semiconductor wafers, into and from wafer cassettes on operations of processing the semiconductor wafers in stand-alone or cluster machines used in semiconductor production. The mapping system consists of a light source, a light-receiving element, and a light beam shaper. The light source is installed on the front end of the robot arm and directs the light via the beam shaper to the leading edge of the semiconductor wafer. The beam reflected from the wafer edge is sensed by a light-receiving element, such as a photodiode. The shaper modifies the shape and the cross-section of the beam directed towards the wafer so as to provide reflection from the curvilinear surface of the edge, irrespective of the existence of the notch, most optimum for detection by the photodiodes and without generation of false signals. In one embodiment, the beam shaper contains a special objective with a cylindrical lens. In another embodiment, the beam shaper comprises an anamorphotic objective with an array of microlenses.

Method for measuring a height map of a test, including measuring a coarse height map of the test surface with a pre-map sensor provided to an optical profiler with a relatively long working distance and / or a large field of view, storing the coarse height map in a memory, subdividing the coarse height map into sections appropriate for the field of view of a high resolution optical profiler sensor provided to the optical profiler, calculating corresponding X, Y and Z positions for the optical profiler sensor with respect to the test surface, calculating a trajectory in the X, Y, Z-direction for the optical profiler sensor with respect to the test surface using the calculated X, Y, Z-positions, moving the optical profiler in the X, Y, Z-direction with respect to the test surface according to the trajectory, and measuring a high accuracy height map with the high resolution optical profiler sensor.

An exhaust gas recirculation diagnosis device may include an EGR module that supplies an intake manifold with exhaust gas from an exhaust manifold, a MAP (manifold absolute pressure) sensor that measures pressure of the intake manifold, and a control portion that controls the EGR module such that the flow rate of the exhaust gas that is supplied from the exhaust manifold to the intake manifold is controlled by stages and monitors the value of the MAP sensor in a fuel cut off condition to diagnose whether the EGR module is faulty. The exhaust gas recirculation diagnosis device uses MAP sensor to perform exhaust gas recirculation and to diagnose the fault of the exhaust gas recirculation device.

The speed of a turbocharger may be estimated using data from sensors that are readily available in most engine management systems. In some cases, a pressure measurement from a MAP sensor may be used, in combination with one or more computational models, to provide an efficient, lower cost estimate of turbo speed that can be used to control operation of the engine and / or the turbocharger.

The embodiment of the invention relates to an intelligent automatic repairing method and apparatus for a multi-parameter environmental monitoring device. The method comprises the following steps that:a sensor monitoring module monitors a sensor in a monitoring device; a data analysis module parses working state parameters of a plurality of sensor to obtain actual working life values of the plurality of the sensors; when the actual working life value of each sensor is in a corresponding sensor life threshold value range, a sensor monitoring value corresponding to the working state parameter ofthe sensor is determined; when the sensor monitoring value is abnormal, the data analysis module sends a data recovery command to an intelligent recovery module; the intelligent recovery module determines the abnormal sensor according to the abnormal sensor monitoring value and determines one or more mapping sensors corresponding to the abnormal sensor; normal sensor monitoring values of the mapping sensors are obtained and an alternate sensor monitoring value of the abnormal sensor monitoring value is obtained; and the normal sensor monitoring values and the alternate sensor monitoring valueare sent to a display module.

The left-right span between a light projection section 5a and a light receiving section 5b of a mapping sensor 5 having an optical axis L1 extending in a left-right horizontal direction is arranged to be narrower than the span of a front opening of a open cassette 12 which is a smaller one of differently-sized containers conveyed to a load port, and the mapping sensor is attached to a mapping device 4. A first protrusion sensor 6 having an optical axis L2 extending in the left-right horizontal direction is attached to the mapping device 4 to be separated from the mapping sensor 5 in a moving direction of the mapping sensor 5. Furthermore, a second protrusion sensor 7 having an optical axis extending in the up-down moving direction of the mapping sensor 5 is provided.

An apparatus for diagnosing a failure of a sensor may include an engine; an intake manifold; a turbocharger including a turbine rotated by exhaust gas of the combustion chamber and a compressor provided at the intake line, rotated in connection with the turbine, and compressing external air; a map sensor measuring a pressure of a front end portion of the compressor; a differential pressure sensor measuring a differential pressure of front and rear end portions of an EGR valve provided at an EGR apparatus; an operation information detecting device measuring operation information including an engine speed and a load; and a controller determining whether an exhaust gas pressure is constant from the operation information and comparing a change amount of the differential pressure sensor signal and a change amount of the map sensor signal in the condition that the exhaust gas pressure is constant to diagnose a failure of the differential pressure sensor.

An improved laser-based wafer carrier mapping sensor is provided. The sensor includes a number of improvements including laser source improvements; optical improvements; and detector improvements. Laser source improvements include the type of laser sources used as well as the specification of size and power of such sources. Optical improvements include features that intentionally defocus the laser stripe on the wafer as well as additional features that help ensure precision stripe generation. Detector improvements include increasing gain while decreasing the effects of ambient light. Various combinations of these features provide additional synergies that facilitate the construction of a sensor with significantly improved dynamic response while decreasing the frequency of false cross slot errors.

Disclosed herein is a media recognition device. The device includes, an alley defined by a floor and a wall that is receptive of media passable therethrough, a movable member movable in response to contact with media as the media passes through the alley, a sensor in operable communication with the movable member configured to output a signal proportional to a position of the movable member, and a processor in operable communication with the sensor. The processor is configured to map the output signal of the sensor as the media passes through the alley, the processor is further configured to recognize or distinguish the map of the media from stored maps of known media.

A substrate processing apparatus has a transfer mechanism arranged on a transfer base and configured to transfer a processing substrate between predetermined transfer positions, a mapping sensor arranged on the transfer base and configured to detect an arrangement state of a processing substrate inside a processing substrate accommodating case which accommodates a plurality of processing substrate in a shelf-like form, and a Z-axis teaching jig provided on or in the vicinity of one of the transfer positions. This substrate processing apparatus detects, by the mapping sensor, a height of the Z-axis teaching jig so as to perform teaching of Z-axis to the transfer mechanism with respect to the one of the transfer positions.