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The application discloses an embedded voltage-stabilized heat-dissipation PCB structure with a thermoelectricity synergic regulation layer and a preparation method thereof. The structure comprises at least one PCB inner layer and a chip power supply pad arranged on the inner layer, and a ring-shaped or C-shaped thermoelectric material pattern (ZT>0.5 at room temperature) is embedded in a region corresponding to the chip power supply pad directly below the inner layer. A first end of the thermoelectric material pattern is electrically connected to a power supply layer, and a second end is electrically connected to a grounding layer or a heat-dissipation through hole. The application utilizes the temperature difference during the operation of a chip to drive the thermoelectric material to generate a reverse electromotive force to inhibit power supply ripple, and simultaneously utilizes the Peltier effect to actively pump heat, so that the inner layer is integrated with voltage stabilization and heat dissipation. The power supply ripple can be reduced by 25% to 42% and the surface temperature of the chip can be reduced by 11 DEG C to 14 DEG C by using the PCB structure. The application directly integrates the thermoelectric function in the PCB inner layer, does not occupy the surface layer area, and is suitable for the packaging substrate of high-performance computing chips.

The utility model discloses a double-layer thermal shrinkage film for packaging multi-connected bottles and cans, which comprises an inner thermal shrinkage film, a plurality of bottles and cans form a bottle and can group, two ends of the inner thermal shrinkage film are provided with first holes for the bottle and can group to enter, the inner thermal shrinkage film after being heated and shrunk wraps the bottle and can group, and the first holes are positioned on two sides of the bottle and can group; the two ends of the outer thermal shrinkage film are provided with second holes allowing the bottle and can set to enter, the outer thermal shrinkage film shrunk after being heated wraps the bottle and can set and the inner thermal shrinkage film together, and the second holes are located in the two sides of the bottle and can set; wherein the first hole is covered by the outer thermal shrinkage film, the opening direction of the first hole is perpendicular to the opening direction of the second hole, and the second hole is located at the two ends of the bottle and can set in the length direction. The inner thermal shrinkage film and the outer thermal shrinkage film are wrapped in a vertically staggered mode, inherent holes of the thermal shrinkage films are completely covered, dirt and dust are effectively prevented, the packaging sealing performance and the overall strength are improved, and grabbing and carrying are facilitated.