Non-destructive grinding method and device for welding column of CCGA device

Abstract

The invention discloses a non-destructive grinding method and device for a welding column of a CCGA device. The method comprises the steps of carrying out potting on the welding column end of the CCGA device to be trimmed through adopting a method for carrying out potting on the welding column of the CCGA device to be trimmed through injection molding resin, then grinding the potted welding column end of the CCGA device to be trimmed until the remaining height of the welding column meets the design requirement, fixing the welding column through adopting an injection molding method before being ground so as to ensure that the side wall of the welding column cannot be damaged in the grinding process, the perpendicularity of the welding column cannot become poor, and finally, removing injection molding resin for potting the welding column in a chemical dissolution mode after grinding is completed. Therefore, no mechanical stress exists in the whole process, lossless grinding of the welding column is achieved, the welding column deformation and damage caused by mechanical clamping can be greatly reduced, and the method has important application value for manufacturing high-reliability CCGA and has good application prospects and economic benefits. Through detection, high-quality welding column grinding with the perpendicularity within 3 degrees and no mechanical damage to the side wall can be achieved, and the method is superior to a column planting grinding method in the current industry.

Description

technical field [0001] The invention belongs to the technical field of high-reliability electronic packaging, and in particular relates to a non-destructive grinding method and device for welding posts of CCGA devices. Background technique [0002] After the CCGA device has completed the pillar planting, the free end surface of the welding pillar is usually an irregular arc surface, and the coplanarity is poor. At the same time, the substrate of the CCGA device has a certain warpage, which aggravates the height difference of the free end of the welding pillar. In the industry, the coplanarity of the unground solder post after planting the post is generally (100 μm), and the problem of virtual soldering is prone to occur during welding, which affects the reliability of the solder post connection, and even causes the function of the CCGA device to fail. Therefore, grinding the solder post is a must Process steps necessary for CCGA devices. At present, the existing welding col...

AI Technical Summary

Problems solved by technology

The hard clamping of the welding post by this method will cause side wall damage, and at the same time, due to the large diameter of the limiting hole (small hole diameter will cause assembly difficulties), the verticality of the welding post will deteriorate, and the above problems are unavoidable in the production process.

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