Full closed-loop automatic laser board splitting machine and method for PCBs

Abstract

The invention provides a full closed-loop automatic laser board splitting machine for PCBs. The full closed-loop automatic laser board splitting machine comprises a laser board splitting machine body, a laser cutting mechanism, a circulating automatic feeding mechanism, a grabbing and lifting mechanism, a control system and an image recognition system. The circulating automatic feeding mechanism is arranged on the laser board splitting machine body. The laser cutting mechanism, the grabbing and lifting mechanism and the image recognition system are located above the circulating automatic feeding mechanism. The circulating automatic feeding mechanism is used for conveying a jig to the position of the grabbing and lifting mechanism, and the jig is used for loading the PCBs. The grabbing and lifting mechanism is used for elevating the jig to the position of the focus of the laser cutting mechanism. The image recognition system is used for shooting the PCBs and sending a shooting result to the control system. The control system controls the laser cutting mechanism to cut PCB areas on the multiple integrated PCBs according to the shooting result, and the grabbing and lifting mechanism is also used for arranging the jig on the circulating automatic feeding mechanism for recycling. By means of the full closed-loop automatic laser board splitting machine, full-automatic laser board splitting is achieved, the labor intensity can be effectively reduced, and the production efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of PCB board processing, in particular to a full-closed-loop PCB board laser automatic board splitting machine and a board splitting method. Background technique [0002] Generally, the PCB boards used in electrical appliances are relatively small, which is caused by the need for miniaturization and miniaturization of electrical appliances. A large PCB board, and finally these large integrated PCB boards are divided into small unit PCB boards, which is the sub-board of the PCB board, for example figure 1 The PCB board can be split into four small PCB boards. The process of dividing the board is to cut off the connection point 1-2, and at the same time separate the side board 1-1, and finally get four small PCB boards. [0003] Conventional PCB board splitting methods use machine milling to split boards. This method is transplanted from mechanical processing, but there are many problems: [0004] 1. The pr...

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Problems solved by technology

[0004] 1. The processing dust will pollute the PCB board, so the separated small PCB boards need to be cleaned twice, and the increased process also increases the processing cost;

[0005] 2. The vibration generated in the milling process may damage the internal copper foil of the multi-layer PCB board, which will cause the yield rate to not be guaranteed at 100%;

[0006] 3. A specific fixture is required to target a specific PCB board, so the cost of the fixture is too high

However, the initial laser splitting is actually a marking machine mode splitting, and it belongs to a single-piece production operation, with relatively low efficiency and high labor intensity.

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