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82results about How to "Reliable mechanical connection" patented technology

Smoke discharge pipe assembly for gas-fired equipment

The invention provides a smoke discharge pipe assembly for gas-fired equipment. The smoke discharge pipe assembly at least comprises a first smoke discharge pipe and a second smoke discharge pipe, wherein a conductor is respectively arranged on the first smoke discharge pipe and the second smoke discharge pipe, the smoke discharge pipe assembly also comprises a pipe connecting mechanism, the pipe connecting mechanism is connected between the first smoke discharge pipe and the second smoke discharge pipe for realizing the fixed mechanical connection of the first and second smoke discharge pipes, and meanwhile, the elastic connection of conducting bodies of the first and second smoke discharge pipes is realized. Through the introduction of the pipe connection mechanism, the mechanical connection between the adjacent smoke discharge pipes becomes stable, firm and reliable, so that the displacement, staggering or disconnection condition is reduced. Even when the conditions occur, or the breaking of a circuit formed by connecting the conducting bodies of the smoke discharge pipes in series is caused when the installation is not carried out according to the specification, a control circuit of a gas water heater can detect the condition, and corresponding measures such as hot water operation stopping can be executed, so that the waste gas leakage can be further prevented.
Owner:VAILLANT WUXI HEATING EQUIP

Dynamic sealing and pressure compensation structure for shear valve slurry pulser

The invention discloses a dynamic sealing and pressure compensation structure for a shear valve slurry pulser. The dynamic sealing and pressure compensation structure comprises a rubber cylinder structure, wherein the rubber cylinder structure is arranged in an annular cavity formed by a cavity structure of a stator and an output shaft, one end of the rubber cylinder sleeves on the outer side of the output shaft, and the other end of the rubber cylinder structure sleeves on the outer side of a pulser shell; the stator sleeves on the outer side of the output shaft of a motor, and a rotor is connected to the tail end of the output shaft of the motor; and a cavity structure is arranged in the stator, the rubber cylinder structure is arranged in the annular cavity formed between the cavity part, close to the rotor, of the cavity structure and the output shaft, and the pulser shell is mounted in the annular cavity between the cavity part, far from the rotor, of the cavity structure and the output shaft. The invention relates to but is not limited to oil exploration equipment. By virtue of the dynamic sealing and pressure compensation structure, the configuration of the optimal dynamic sealing mechanism can be realized, and the service life of a dynamic sealing part can be effectively prolonged; and meanwhile, the configuration of an optimal pressure compensation mechanism can be realized, and the routing process of short sections in an instrument can be effectively optimized.
Owner:CHINA NAT OFFSHORE OIL CORP +1

Three-dimensional stacked interconnection structure for SiC device based on nano-silver soldering paste, and preparation method

The invention provides a three-dimensional stacked interconnection structure for a SiC device based on nano-silver soldering paste, and a preparation method. The interconnection structure comprises the nano-silver soldering paste and a ceramic plate. The nano-silver soldering paste is disposed in through holes in the ceramic plate, and a conductive circuit is formed after sintering. Furthermore, the nano-silver soldering paste is sintered to achieve the stacked interconnection of chip electrodes. The ceramic plate serves as an insulating plate and an underlay layer, thereby increasing the distance between two chips, and avoiding the edge breakdown effect between the chips. The connection of the interconnection structure can achieve the longitudinal interconnection of a plurality of chips,and the selected material comprises a ceramic substrate and a nano-silver soldering paste. The main component of the sinter nano-silver soldering paste is silver, and the conductivity and temperatureresistance of the sintered nano-silver soldering paste are close to the conductivity and temperature resistance of pure silver. The nano-silver soldering paste and the ceramic substrate are both madeof high temperature resistant materials, and can be used for the interconnection of a big power chip. Compared with other parking modes, the structure is simple in structure, is high in operability, is wide in application range, and can achieve the simple and effective high-temperature and high-voltage stacked packaging.
Owner:INST OF ELECTRONICS ENG CHINA ACAD OF ENG PHYSICS
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