43results about How to "Bonding" patented technology

A circuit board including conductive layers bonded to both surfaces of an insulating ceramic substrate, with a brazing material disposed therebetween. The conductive layers comprise at least 99.98% by mass of aluminum, and display an average crystal grain diameter within a range from 0.5 mm to 5 mm and a standard deviation σ for that crystal grain diameter of no more than 2 mm. Each conductive layer comprises at least 20 ppm of Cu, Fe and Si. The surface area of the crystal with the maximum crystal grain diameter within the conductive layers accounts for no more than 15% of the surface area of the insulating ceramic substrate.

According to embodiments of the present invention, a user's local storage system may be used to create a virtual personal mall comprising one or more virtual personal stores and configured for purchasing products by one or several providers. The virtual personal store and/or virtual personal mall may be organized in virtual shelves. Each virtual shelf may contain a group of products with one or more common properties, for example, books by a certain author and/or published by a certain publisher, and/or supplied by the same virtual personal store provider, etc. The groups may be defined by the virtual personal store provider and/or by the user and/or by a group of users.

Adhesive layers are formed on the two opposing surfaces of a transparent support. At least one of the adhesive layers is made of a material of which the cured state may be changed. The adhesive layer is irradiated with light and a lens sheet is then pressed against the adhesive layer. The adhesive layer is cured. In this illustrative way, a laminate film of the lens sheet fixed to the transparent support via the adhesive layer may be obtained. The laminate film may be bonded to a polarizing plate on the viewer's side of a liquid crystal display element via the other adhesive layer.

A bumping process is disclosed. The bumping process comprises the steps of: providing a wafer having a plurality of bonding pads and a passivation layer, wherein the passivation layer exposes the bonding pads; forming an UBM layer over the wafer to cover the bonding pads; forming two or more photoresist layers over the wafer, wherein the photoresist layers have different exposure and development characteristics; forming at least one or more stair-shaped openings in the photoresist layers by a single exposure corresponding to the bonding pads; filling solder into the stair-shaped openings to form a plurality of solder bumps; removing the entire photoresist layer. The bumping process can provide bumps with higher heights, so that the connection between chips and carriers becomes more reliable.

A semiconductor product is constructed of a wiring substrate in which pads for pin connection are formed, and a substrate with pins in which pins are disposed. The substrate with the pins is formed so that one end of the pin is exposed to one surface of a resin substrate formed by resin molding and the other end of the pin extends from the other surface of the resin substrate and one end of the pin is bonded to a pad of the wiring substrate through a conductive material.

The invention provides a building block for a mechanical construction. The invention further provides a bearing, an actuator system, a housing, a hub, a mechanical connector and a gear box. The building block includes a first printed material being printed via an additive manufacturing process. The first printed material provides a framework of a second material different from the first printed material and at least partially embedded in the first printed material. The framework of the second material may be included in a hollow structure. Alternatively, at least a part of the framework of the second material may constitute at least a part of the inner wall of the hollow structure. The framework of the second material may be pre-fabricated or may also be generated via the additive manufacturing process. A benefit of this building block is that it allows an increase of strength while limiting the overall weight.

An optical switch includes a polymer sheet having an optical waveguide extending linearly therein, keep plates holding the polymer sheet therebetween, and driving means. The polymer sheet has a notch provided to traverse the optical waveguides, and the keep plates each have an opening at a position corresponding to the notch. The opening has an elongated shape along the extending direction of the notch at least on a surface of the keep plate in contact with the polymer sheet. The driving means is for selecting a course of light by switching open and closed states of the notch by pushing and not pushing the polymer sheet via the opening.

Electroconductive paste includes electroconductive powder of Ni, Cu or the like, a first binder resin such as ethyl cellulose resin or the like, a fatty acid which is solid at ordinary temperature (20 to 25° C.), and solvents. The solvents include a cyclic compound type solvent capable of dissolving the first binder resin, an aliphatic hydrocarbon type solvent incapable of dissolving a second binder resin such as butyral resin or the like contained in a ceramic green sheet, and an aromatic hydrocarbon type solvent incapable of dissolving the second binder resin.

This invention relates to a supported nonmetallocene catalyst and preparation thereof. The supported nonmetallocene catalyst can be produced with a simple and feasible process and is characterized by an easily controllable polymerization activity. This invention further relates to use of the supported nonmetallocene catalyst in olefin homopolymerization/copolymerization, which is characterized by a lowered assumption of the co-catalyst as compared with the prior art.

In a lead frame used for manufacturing a semiconductor device by forming a circuit pattern group including unit lead frames having plural upper side terminal parts in the periphery of a semiconductor element mounting region in one line or plural lines and an outer frame surrounding the circuit pattern group in a state of having a gap in a lead frame material and then mounting a semiconductor element every the unit lead frame and carrying out necessary wiring and enclosing the entire surface of the circuit pattern group in which the semiconductor element is mounted and a part of the outer frame with a resin from an upper surface side and further etching from a lower surface side and forming lower side terminal parts joined to the upper side terminal parts of the circuit pattern group, the circuit pattern group and the outer frame are had and the inner edge of the outer frame is formed in an uneven portion in plan view and bonding between the resin and the outer frame is enhanced.

The invention relates to a novel male and female plug used for a dust collector. The bottom part of the plug pin of a male plug is provided with a fastening sealing structure. The fastening sealing structure comprises a sealing convex stand, and a fastening sealing ring and a fastening sealing protrusion which are formed by rubber elastomers. The opening of a female plug is provided with a sealing pit which comprises a first sealing pit and a second sealing pit from outside to inside. The cross section of the first sealing pit has an inverted trapezoid structure and the shape and size of the first sealing pit are matched with those of the sealing convex stand which is sleeved by a plug sealing ring. The shape and size of the second sealing pit are matched with those of the sealing protrusion. The plug pin of the male plug is plugged into the opening of the female plug so as to be closely connected with the opening of the female plug. Problems that the plugging part of the male and female plug is liable to loose and line short circuit and even electric leakage situations are liable to occur are solved so that safety hidden trouble is avoided.

A friction wedge assembly for use in a suspension system of railroad car trucks. The friction wedge assembly comprises a cast metal wedge having a bolster engaging surface, a truck side frame engaging surface and a surface disposed between the bolster engaging surface and the truck side frame engaging surface for engaging a spring that provides the load on the friction wedge assembly. There is a metal bonding matrix disposed on the truck side frame engaging surface of the wedge and a composition liner having a first side engageable with the metal bonding matrix and a radially opposed second side for engaging a metal wear liner on a side frame of such railroad car truck.

A method for fabricating a wire bonding structure is disclosed, which includes: providing a substrate having a plurality of bonding pads; and foaming a ball end of a bonding wire on at least one of the bonding pads by performing a scrubbing process along a path around a periphery of the bonding pad, thereby preventing delamination of the ball end of small size from the bonding pad.

An image receiving sheet includes an image receiving layer including a resin and having a thickness of 1 μm or greater; and an antistatic layer being the outermost layer, including a resin and at least one conductive material selected from conductive particles and a conductive polymer and having a thickness smaller than that of the image receiving layer, on at least one surface of a support, in an order from the support side.