Ceramic and metal dissimilar material connecting method and ceramic surface treatment process

A treatment process and ceramic surface technology, which is applied in the connection of metal dissimilar materials, ceramic surface treatment process, and ceramic field, can solve the problems of weak bonding force of the metallized layer, and achieve improved bonding strength, reliable glass-metal mechanical connection, and good bonding Effect

Inactive Publication Date: 2018-11-13
哈尔滨赫捷科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a method for connecting ceramics and metal dissimilar materials and a ceramic surface treatment process, which can effectively solve the limitations of direct brazing applications when connecting ceramic materials and metal materials and the bonding force of indirect brazing ceramic surface metallization layers. weaker question

Method used

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Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0040] A method for connecting ceramic and metal dissimilar materials, the method comprising the following steps:

[0041] S1, preparation of mixed solder paste;

[0042] S2. Treatment of ceramic and metal surfaces;

[0043] S3. Solder paste coating and treatment on ceramic surface;

[0044] S4. Connecting the treated ceramics coated with solder paste and the treated metal.

[0045] The preparation process of the mixed solder solder paste, the process steps are as follows:

[0046] A, by mass fraction, take by weighing Ni powder and bismuth borate glass powder (Bi 2 o 3 -B 2 o 3 -ZnO-SiO 2 );

[0047] B, Ni powder and bismuth borate glass powder (Bi 2 o 3 -B 2 o 3 -ZnO-SiO 2 ) are mixed, ground by wet grinding method, and mixed solder powder is obtained after drying;

[0048] C. Take the mixed solder powder and add terpineol to make a mixed solder paste, which is Sn-Ag-CuO solder paste.

[0049] The preparation process of the mixed solder paste, in A, the massfr...

specific Embodiment approach 2

[0068] A method for connecting ceramic and metal dissimilar materials, the method comprising the following steps:

[0069] S1, preparation of mixed solder paste;

[0070] S2. Treatment of ceramic and metal surfaces;

[0071] S3. Solder paste coating and treatment on ceramic surface;

[0072] S4. Connecting the treated ceramics coated with solder paste and the treated metal.

[0073] The preparation process of the mixed solder solder paste, the process steps are as follows:

[0074] A, by mass fraction, take by electronic balance Cu powder and bismuth borate glass powder (Bi 2 o 3 -B 2 o 3 -ZnO-SiO 2 );

[0075] B, Cu powder and bismuth borate glass powder (Bi 2 o 3 -B 2 o 3 -ZnO-SiO 2 ) are mixed, ground by wet grinding method, and mixed solder powder is obtained after drying;

[0076] C. Take the mixed solder powder and add terpineol to make a mixed solder paste, which is Sn-Ag-CuO solder paste.

[0077] The preparation process of the mixed solder paste, in A, ...

specific Embodiment approach 3

[0096] A method for connecting ceramic and metal dissimilar materials, the method comprising the following steps:

[0097] S1, preparation of mixed solder paste;

[0098]S2. Treatment of ceramic and metal surfaces;

[0099] S3. Solder paste coating and treatment on ceramic surface;

[0100] S4. Connecting the treated ceramics coated with solder paste and the treated metal.

[0101] The preparation process of the mixed solder solder paste, the process steps are as follows:

[0102] A, by mass fraction, take Ag powder and bismuth borate glass powder (Bi 2 o 3 -B 2 o 3 -ZnO-SiO 2 );

[0103] B, Ag powder and bismuth borate glass powder (Bi 2 o 3 -B 2 o 3 -ZnO-SiO 2 ) are mixed, ground by wet grinding method, and mixed solder powder is obtained after drying;

[0104] C. Take the mixed solder powder and add terpineol to make a mixed solder paste, which is Sn-Ag-CuO solder paste.

[0105] The preparation process of the mixed solder paste, in A, the massfraction of Ag ...

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Abstract

The invention belongs to the field of connection of ceramic materials and dissimilar materials, and particularly relates to a ceramic and metal dissimilar material connecting method and a ceramic surface treatment process. The ceramic and metal dissimilar material connecting method includes the steps: S1 mixed solder paste preparation; S2 ceramic and metal surface treatment; S3 ceramic surface solder paste spraying and treating; S4 solder paste spraying and treated ceramic and the treated metal connection. According to the method, surfaces of ceramic parent materials are treated by grass-metalcomposite powder according to good physical and chemical compatibility between grass and ceramic, the bonding strength among surface treatment layers and the ceramic parent materials is improved, andthe surface treatment layers can be effectively moistened by metal solders, so that the ceramic is effectively connected with the ceramic/metal dissimilar materials by the metal solders.

Description

technical field [0001] The invention belongs to the field of connecting ceramic materials and dissimilar materials, in particular to a method for connecting ceramic and metal dissimilar materials and a ceramic surface treatment process. Background technique [0002] Ceramic materials refer to a class of inorganic non-metallic materials made of natural or synthetic compounds through shaping and high-temperature sintering. It has the advantages of high melting point, high hardness, high wear resistance and oxidation resistance. It can be used as structural material, tool material, and because ceramics also have some special properties, they can also be used as functional materials. However, due to the poor processing performance and weak impact resistance of ceramics, it is difficult to process and manufacture large-scale and complex parts, and it is difficult to use them as structural components alone. Usually, they need to be connected with metals to form ceramic and metal ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B37/02B23K35/40
CPCB23K35/40C04B37/026C04B2237/123C04B2237/124C04B2237/125C04B2237/126C04B2237/52
Inventor 林盼盼姜重来林铁松何鹏
Owner 哈尔滨赫捷科技有限公司
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