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Hard soldering method of high volume fraction SiC particle-reinforced Al matrix composite and kovar alloy dissimilar material

A silicon carbide particle, high volume fraction technology, applied in welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problem of high welding cost, achieve the effect of strong metallurgical bond, dense structure and cost reduction

Inactive Publication Date: 2010-06-16
HENAN POLYTECHNIC UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the present invention is to provide a brazing method for high volume fraction silicon carbide particles reinforced aluminum matrix composite materials and Kovar alloy dissimilar materials, so as to solve the problem of high welding cost caused by metallization treatment of existing brazing dissimilar materials

Method used

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  • Hard soldering method of high volume fraction SiC particle-reinforced Al matrix composite and kovar alloy dissimilar material

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specific Embodiment approach 1

[0007] Embodiment 1: The brazing method of high volume fraction silicon carbide particles reinforced aluminum matrix composite material and Kovar alloy dissimilar material in the present invention is carried out according to the following steps: 1. The volume fraction of silicon carbide particles is 55%~75% % SiC p / ZL101 and Kovar alloy 4J29 connection surface and the surface of the foil-shaped solder are cleaned, and the foil-shaped solder is placed on SiC p / ZL101 and Kovar alloy 4J29 are clamped with a clamp to obtain the workpiece to be welded; 2. Put the workpiece to be welded into the vacuum furnace at a vacuum degree of 3×10 -3 Under the condition of Pa, brazing is carried out at a heating rate of 20°C / min to 560°C. The holding time of brazing is 10 minutes, and then cooled to room temperature with the furnace; that is, the high volume fraction silicon carbide particle reinforced aluminum matrix composite material and Kovar alloy are completed. hard brazing.

[0008]...

specific Embodiment approach 2

[0009] Specific embodiment two: the difference between this embodiment and specific embodiment one is: in step one, SiC p / ZL101 surface cleaning is done step by step with 200#, 400#, 800# and 1000# water sandpaper, then polished with W3.5 diamond grinding paste, then ultrasonically cleaned in acetone for 10 minutes; then dried. Other steps and parameters are the same as in the first embodiment.

specific Embodiment approach 3

[0010] Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is that in step 1, the surface of Kovar metal is cleaned with 200# sandpaper, and then ultrasonically cleaned in acetone for 10 minutes; then dried. Other steps and parameters are the same as those in Embodiment 1 or Embodiment 2.

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Abstract

The invention discloses a hard soldering method of high volume fraction SiC particle-reinforced Al matrix composite and a kovar alloy dissimilar material, relating to a hard soldering method of a dissimilar material. The invention solves the problem that welding cost is high because the existing hard soldering of the dissimilar material needs metalizing treatment. The method of the invention comprises the following steps: after cleaning master batches and foil-shaped brazing filler metal, putting the foil-shaped brazing filler metal between the master batches, and then putting into a vacuum furnace for soldering to finish hard soldering of the master batches. The method of the invention obtains soldering seams with compact issue and forms firm metallurgical bonding. The invention does not need to carry out metallization processing on the master batch, thus lowering welding cost.

Description

technical field [0001] This invention relates to a method of brazing dissimilar materials. Background technique [0002] Kovar alloys (such as 4J29, etc.) are widely used in electronic packaging materials because of their low thermal expansion coefficient. However, in the field of aerospace, it is hoped that the weight of electronic devices is light. Therefore, a silicon carbide particle-reinforced aluminum matrix composite material with a high volume fraction (55% to 75%) of a high volume fraction (55% to 75%) of Kovar alloy with a thermal expansion coefficient similar to that of Kovar alloy Came into being. At the same time, due to the internal requirements of electronic packaging devices, the materials of some devices cannot be completely replaced by aluminum-based composite materials. In addition, due to the limitation of the internal chip on the ambient temperature, aluminum-based composite materials and Kovar alloys must be used in the manufacturing process. Dissimil...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/008
Inventor 牛济泰罗相尉陈思杰李强赵丕峰徐冬霞王长利曾岗张宝友
Owner HENAN POLYTECHNIC UNIV
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