Method for connection between composite type green low-melting solder glass and silicon carbide reinforced aluminum matrix composites

A technology for strengthening aluminum-based, low-melting glass, applied in welding/cutting media/materials, welding media, welding equipment, etc., can solve the problems of low joint strength, incompatibility, low strength, etc. The effect of dense structure and high strength of welded joints

Active Publication Date: 2014-07-02
HARBIN INST OF TECH
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Problems solved by technology

[0004] The purpose of the present invention is to solve the problem of low strength of the silicon carbide reinforced aluminum matrix composite material after connection and low joint strength in the existing connection method when the content of silicon carbide reinforcement in the existing silicon carbide reinforced aluminum matrix composite material is high. There is a problem of incompatibility between the solder and the surface of the silicon carbide reinforced aluminum matrix composite material, and a method for connecting the silicon carbide reinforced aluminum matrix composite material with a composite green low-melting glass solder is provided

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  • Method for connection between composite type green low-melting solder glass and silicon carbide reinforced aluminum matrix composites

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specific Embodiment approach 1

[0028] Specific implementation mode one: This implementation mode is a method for connecting silicon carbide reinforced aluminum matrix composite materials with composite green low-melting glass solder, which is specifically completed according to the following steps:

[0029] 1. Classification of basic glass powder: put the basic glass powder in a ball mill jar, and at a speed of 100r / min~200r / min, the mass ratio of the grinding ball to the basic glass powder is (35~45):1 Put the powder into the 200-mesh metal sieve for vibration, and put the powder through the 200-mesh sieve into the 500-mesh metal sieve for vibration, and the powder that does not pass through the 500-mesh sieve The powder is the basic glass powder with a particle size of 25 μm to 75 μm;

[0030] The basic glass powder in step 1 is one or a mixture of bismuthate-based lead-free low-temperature sealing glass powder or phosphate-based lead-free low-temperature sealing glass powder;

[0031] The bismuth salt-b...

specific Embodiment approach 2

[0052] Specific embodiment 2: The difference between this embodiment and specific embodiment 1 is: the bismuth salt-based lead-free low-temperature sealing glass powder described in step 1, the specific proportion is from 45 parts to 50 parts Bi 2 o 3 , 25 ~ 35 copies B 2 o 3 , 10-20 parts of BaO, 5-10 parts of ZnO, 0.1-1 part of Al 2 o 3 , 0.1 to 1 part of SiO 2 and 0.1 part to 1 part Li 2 O composition. Other steps are the same as in the first embodiment.

specific Embodiment approach 3

[0053] Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is that the specific proportion of the phosphate-based lead-free low-temperature sealing glass powder described in step 1 is 40 to 60 parts by weight. P 2 o 5 , 30-40 parts of SnO, 15-20 parts of ZnO, 15-20 parts of B 2 o 3 , 1 to 5 parts of Al 2 o 3 , 1 to 5 parts of SiO 2 And 1~2 parts of Li 2 O composition. Other steps are the same as those in Embodiment 1 or 2.

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Abstract

The invention provides a method for connection between composite type green low-melting solder glass and silicon carbide reinforced aluminum matrix composites and relates to a method for connecting the silicon carbide reinforced aluminum matrix composites. The method aims at solving the problems that the silicon carbide reinforced aluminum matrix composites connected through an existing connection method are low in strength and the joint strength, and the surface of existing solder and the surface of the silicon carbide reinforced aluminum matrix composites are incompatible when the content of silicon carbide reinforced bodies in existing silicon carbide reinforced aluminum matrix composites is increased. The method includes the steps of classifying basis glass power, weighing, pretreating beta-SiC whiskers, preparing composite type lead-free low-temperature sealing glass powder, mixing, stirring, removing impurities, coating and assembling and welding test pieces. Through the method, the silicon carbide reinforced aluminum matrix composites can be connected in a low-temperature soldering mode.

Description

technical field [0001] The invention relates to a method for connecting silicon carbide reinforced aluminum matrix composite materials. Background technique [0002] At present, the methods of connecting silicon carbide reinforced aluminum matrix composites mainly include fusion welding, friction welding, diffusion welding, brazing, etc., among which the brazing method is the most studied and most widely used connection method, which is used to solve the problem of silicon carbide reinforced aluminum matrix composites in the engineering field. The connection problem of aluminum matrix composites plays an important role. There are mainly two kinds of solders commonly used for brazing aluminum-based composites: aluminum-silicon and zinc-aluminum. No matter which solder is used, the wetting of the composite material is not ideal. This is mainly because there is a dense oxide film and silicon carbide reinforcement on the surface of the aluminum matrix of the composite material....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/008B23K1/20B23K1/19B23K35/40B23K35/363
CPCB23K1/008B23K1/19B23K1/20B23K1/206B23K35/025B23K35/3602B23K2103/16
Inventor 何鹏林铁松林盼盼马楠陈诚
Owner HARBIN INST OF TECH
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