Soldering method of high volume fraction SiC particle-reinforced Al matrix composite and kovar alloy

A silicon carbide particle, high volume fraction technology, used in welding equipment, metal processing equipment, manufacturing tools, etc., can solve problems such as low joint strength

Inactive Publication Date: 2010-06-16
ZHONGYUAN ENGINEERING COLLEGE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to solve the problem that it is difficult to weld into an engineering structure due to the low strength of the high volume fraction SiCp/Al comp

Method used

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  • Soldering method of high volume fraction SiC particle-reinforced Al matrix composite and kovar alloy
  • Soldering method of high volume fraction SiC particle-reinforced Al matrix composite and kovar alloy
  • Soldering method of high volume fraction SiC particle-reinforced Al matrix composite and kovar alloy

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specific Embodiment approach 1

[0008] Embodiment 1: In this embodiment, the soldering method of high volume fraction silicon carbide particle reinforced aluminum matrix composite material and Kovar alloy is carried out according to the following steps: 1. After a. degreasing, b. pickling roughening , c. sensitization, d. activation, e. reduction, f. the steps of acidic Ni-P plating on the surface of the SiCp / Al composite material with a volume fraction of silicon carbide particles of 55% to 75% for electroless Ni-P plating; 1. Degrease the SiCp / Al composite material and Kovar metal surface to be welded with acetone for 8 minutes respectively after step 1, make the flux into a paste with ethanol and apply it on both sides of the foil-shaped solder. A flux layer with a thickness of 40-80 microns is formed on both sides of the brazing filler metal, and then the foil-like brazing filler metal is placed between the SiCp / Al composite material and the Kovar metal surface to be welded, and the SiCp / Al composite mate...

specific Embodiment approach 2

[0009] Embodiment 2: This embodiment differs from Embodiment 1 in that: "a. Degreasing" described in step 1 is ultrasonically treated in acetone for 10 minutes at room temperature, washed with water, and dried. Other steps and parameters are the same as in the first embodiment.

specific Embodiment approach 3

[0010] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is: the "b. pickling and coarsening" described in step one is at room temperature in HF and HNO 3 Corrosion coarsening in the mixed solution for 10 minutes, then washed with water and dried, wherein the HF and HNO 3 HF, HNO in the mixed solution 3 The mass of water and water is 1:3:1. Other steps and parameters are the same as those in Embodiment 1 or Embodiment 2.

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Abstract

The invention discloses a flame soldering method of a high volume fraction SiC particle-reinforced Al matrix composite and kovar alloy, relating to a soldering method of a dissimilar material. The invention solves the problem of small possibility of welding engineering structure because the strength of the welding joint of SiCp/ Al composite and kovar alloy melting is low. The method of the invention is characterized in that Ni-p is chemically plated on the surface of the high volume fraction SiC particle-reinforced Al matrix composite, and then soldering is carried out under the soldering acid and protective atmosphere after a piece to be soldered is assembled. The solder, the kovar alloy and a nickel coating of the invention mutually diffuse to form compact metallurgical bonding. In the method of the invention, the shear strength of joint connected by SiCp/ Al of which the SiC particle volume fraction is 55% with kovar alloy 4J29 is 225 MPa.

Description

technical field [0001] The present invention relates to a method of soldering dissimilar materials. Background technique [0002] High volume fraction SiCp / Al composite materials have been recognized in my country's aerospace photoelectric detection systems (precision components) and microelectronic systems (electronic packages) in recent years due to their multifunctional features of structure / thermal control / anti-resonance integration and favored. Due to the internal requirements of electronic packaging devices, the materials of some devices cannot be completely replaced by aluminum-based composite materials. In addition, the internal chip limits the ambient temperature. In the manufacturing process, aluminum-based composite materials and Kovar alloy must be used. Material soldering technology. [0003] The materials industry usually regards the volume fraction of the reinforcing phase as exceeding 30% as a composite material with a high volume fraction. Due to the huge ...

Claims

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Application Information

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IPC IPC(8): B23K1/008
Inventor 牛济泰卢金斌冯强裴寅鑫穆云超罗相尉郭建刘英张瑞杰
Owner ZHONGYUAN ENGINEERING COLLEGE
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