Method for electroplating surface of molybdenum and copper alloy

A molybdenum-copper alloy and nickel-plating technology is applied in the field of electroplating on the surface of molybdenum-copper alloy, which can solve the problems of unsuitable parts with small volume, low yield, and excessive copper corrosion.

Active Publication Date: 2012-02-08
CHENGDU SIWI HIGH TECH IND GARDEN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing molybdenum-copper alloy electroplating process mainly has the following problems: 1. The oxide film is easy to form on the surface of the molybdenum-copper alloy and is difficult to remove. The substrate cannot be effectively activated before electroplating, thereby affecting the bonding force of the coating; 2. The existing The oxide film removal methods mainly include sandblasting, anodic etching and chromic acid treatment, etc., but the sandblasting method is only suitable for parts with simple shapes and large volumes, and is not suitable for parts with complex shapes and small volumes; the anode Etching method is easy to cause over-corrosion of copper when processing molybdenum-copper alloy; chromic acid treatment method needs t...

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] A method for electroplating a molybdenum-copper alloy surface, comprising the following steps:

[0032] ① Degreasing

[0033] Cathodic electrolytic degreasing is used to remove oil stains on the surface of molybdenum-copper alloy parts; the solution used for degreasing includes sodium hydroxide with a concentration of 5 g / L, sodium carbonate with a concentration of 20 g / L, and a concentration of 40 g / L trisodium phosphate Na 3 PO 4, Sodium silicate Na at a concentration of 5 g / L 2 SiO 3 , the solution temperature is 70°C, and the cathode current density is 3 A / dm 2 , the degreasing time is 5min, after degreasing, clean it with tap water;

[0034] ②Pickling

[0035] The solution used for pickling includes: nitric acid with a volume specific concentration of 400ml / L, and sulfuric acid with a volume specific concentration of 400ml / L. Remove the oxide film and stains on the surface of the parts to obtain a uniform and clean metal surface. Immediately put the molybde...

Embodiment 2

[0048] A method for electroplating a molybdenum-copper alloy surface, comprising the following steps:

[0049] ① Degreasing

[0050] Cathodic electrolytic degreasing is used to remove oil stains on the surface of molybdenum-copper alloy parts; the solution used for degreasing includes sodium hydroxide with a concentration of 25 g / L, sodium carbonate with a concentration of 100 g / L, and a concentration of 80 g / L trisodium phosphate Na 3 PO 4, Sodium silicate Na at a concentration of 15 g / L 2 SiO 3 , the solution temperature is 80°C, and the cathode current density is 6 A / dm 2 , the degreasing time is 15min, after degreasing, clean it with tap water;

[0051] ②Pickling

[0052] The solution used for pickling includes: nitric acid with a volume specific concentration of 420ml / L, and sulfuric acid with a volume specific concentration of 420ml / L. Remove the oxide film and stains on the surface of the parts to obtain a uniform and clean metal surface. Immediately put the mol...

Embodiment 3

[0065] A method for electroplating a molybdenum-copper alloy surface, comprising the following steps:

[0066] ① Degreasing

[0067] Cathodic electrolytic degreasing is used to remove oil stains on the surface of molybdenum-copper alloy parts; the solution used for degreasing includes sodium hydroxide with a concentration of 15 g / L, sodium carbonate with a concentration of 50 g / L, and a concentration of 60 g / L trisodium phosphate Na 3 PO 4, Sodium silicate Na at a concentration of 10 g / L 2 SiO 3 , the solution temperature is 75°C, and the cathode current density is 5 A / dm 2 , the degreasing time is 10min, after degreasing, clean it with tap water;

[0068] ②Pickling

[0069] The solution used for pickling includes: nitric acid with a volume specific concentration of 410ml / L, and sulfuric acid with a volume specific concentration of 410ml / L. Remove the oxide film and stains on the surface of the parts to obtain a uniform and clean metal surface. Immediately put the moly...

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Abstract

The invention discloses a method for electroplating the surface of a molybdenum and copper alloy. The method comprises the following steps of: 1, removing oil; 2, scouring; 3, activating; 4, planting nickel; 5, carrying out vacuum heat treatment; 6, removing oil; 7, activating; and 8, carrying out subsequent electroplating. An oxide film on the surface of the molybdenum and copper alloy can be completely removed through steps of scouring and activating, a thin nickel layer is electroplated on the surface of the molybdenum and copper alloy through steps of plating nickel and carrying out vacuum heat treatment, and then the vacuum heat treatment is carried out, so that a diffusion layer with better bonding force is formed by a nickel plating layer and a base material and then is activated, and a required plating layer can be electroplated continuously. According to the method, the problem of poor bonding force of the electroplating layer of the molybdenum and copper alloy is solved, theoxide film before the molybdenum and copper alloy is electroplated is removed, process parameters of nickel pre-plating and vacuum heat treatment are determined, and an activating method of electroplating on a nickel-plated base layer is determined.

Description

technical field [0001] The invention belongs to the field of surface treatment, and relates to a method for electroplating the surface of a molybdenum-copper alloy. Through the method, a coating with good binding force can be obtained on the surface of the molybdenum-copper alloy. Background technique [0002] Molybdenum-copper alloy is a kind of powder metallurgy material, which is mainly used in the production of high-temperature resistant devices. Because of its good thermal conductivity and electrical conductivity, and its thermal expansion coefficient matches that of ceramics, it is also widely used in the microelectronic metal packaging industry. In order to improve the anti-oxidation and brazing performance of the surface of the part, it needs to be electroplated. [0003] The existing electroplating process of molybdenum-copper alloy mainly has the following problems: 1. The oxide film is easy to form on the surface of molybdenum-copper alloy and is difficult to remo...

Claims

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Application Information

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IPC IPC(8): C25D5/34C25D5/38C25D5/50C25D3/12
Inventor 李忠宝陈天军
Owner CHENGDU SIWI HIGH TECH IND GARDEN
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