Resin composition, prepreg, laminated board and metal foil-coated laminated board

A resin composition and prepreg technology, applied in the field of prepreg, laminate and metal foil-clad laminate, can solve the problems of inapplicability, different warpage requirements, cracking of welding parts, etc. The effect of low heat resistance and moisture and heat resistance

Active Publication Date: 2018-07-03
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] For the packaging form with complex packaging form, due to its fixity, the warpage requirements for different parts are different, which is obviously not applicable
At the same time, the thermal stress generated during the installation process of chips and other components cannot be relieved, and the soldering parts are easily cracked, which makes the circuit invalid

Method used

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  • Resin composition, prepreg, laminated board and metal foil-coated laminated board
  • Resin composition, prepreg, laminated board and metal foil-coated laminated board
  • Resin composition, prepreg, laminated board and metal foil-coated laminated board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0067] Hereinafter, the present disclosure will be specifically described using examples.

[0068]

[0069] Epoxy resin (A1): biphenyl aralkylene type epoxy resin ("NC-3000-H" manufactured by Nippon Kayaku Co., Ltd., structure represented by formula (5))

[0070] Epoxy resin (A2): naphthyl type epoxy resin ("HP-6000" manufactured by DIC Corporation, structure represented by formula (6))

[0071]

[0072] R in formula (6) 10 is a hydrogen atom, methyl or ethyl.

[0073] Epoxy resin (A3): bisphenol A epoxy resin ("828US" manufactured by Mitsubishi Chemical Corporation)

[0074] Cyanate resin (B1): Bisphenol A type cyanate resin ("BA-3000S" manufactured by Lonza Corporation)

[0075] Cyanate resin (B2): phenolic cyanate resin ("PT-30S" manufactured by Lonza Corporation)

[0076] Bismaleimide resin (C1): bis(3-ethyl-5-methyl-4-bismaleimidophenyl)methane ("TY-2002" manufactured by Tianyi Chemical Co., Ltd.)

[0077] Bismaleimide resin (C2): diphenylmethane type bismaleimi...

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Abstract

The invention provides resin compositions. Prepreg, a laminated board and a metal foil-coated laminated board which are obtained by using the resin compositions have good heat resistance, heat and humidity resistance, low coefficient of thermal expansion and low modulus. The resin compositions contain epoxy resin (A), cyanate resin (B) and bismaleimide resin (C), have structures represented by a formula (1), a formula (2), a formula (3) and a formula (4), and contain high-molecular-weight resin (D) with a weight-average molecular weight of 100,000-200,000 and inorganic filler (E).

Description

technical field [0001] The invention relates to the technical field of packages for electronic products, in particular to a resin composition and prepregs, laminates and metal foil-clad laminates prepared using the resin composition. Background technique [0002] With the development of packaging forms, the packaging density is getting higher and higher, such as POP packaging (package stacking technology), MCP packaging (multi-chip packaging), and the requirements for the coefficient of thermal expansion (CTE) and rigidity of the packaging substrate are getting higher and higher. For packaging with a single package form, such as BGA package (Ball Grid Array Package), a package substrate with low XY direction CTE and high rigidity can show the effect of reducing warpage. [0003] For packaging forms with complex packaging shapes, due to their fixity, different warpage requirements for different parts are different, which is obviously not applicable. At the same time, the the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L79/00C08L79/08C08L63/10C08K9/06C08K7/18C08K3/22C08K5/098C08J5/24B32B27/38B32B27/28B32B27/12B32B9/00B32B9/04B32B17/00B32B17/06B32B17/02B32B15/20B32B15/092B32B15/08B32B15/04
CPCB32B5/02B32B5/26B32B9/00B32B9/04B32B9/047B32B15/04B32B15/08B32B15/092B32B15/14B32B15/20B32B17/00B32B17/067B32B27/12B32B27/28B32B27/38B32B2260/021B32B2260/046B32B2262/101B32B2307/306B32B2307/308C08J5/24C08J2363/00C08J2463/00C08J2479/00C08J2479/08C08K2003/2227
Inventor 唐军旗李志光
Owner GUANGDONG SHENGYI SCI TECH
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