Resin composition, prepreg, laminated board and laminated board covered with metal foil

Abstract

The invention relates to an epoxy modified acrylate resin composition, prepreg, a laminated board and a laminated board covered with metal foil. The prepreg, the laminated board and the laminated board covered with the metal foil are prepared by using the epoxy modified acrylate resin composition. The resin composition comprises epoxy modified acrylate resin (A), inorganic filler (C) which is subjected to surface treatment through a silane coupling agent (B) which is of a structure shown in the formula (I), epoxy resin (D), cyanate ester resin (E) and bismaleimide resin (F). The inorganic filler (C) is modified by adopting the silane coupling agent (B) of the structure shown in the formula (I), the dispersity of the inorganic filler (C) in the epoxy modified acrylate resin (A) is improved,the interlamination binding force of the prepared laminated board and the binding force of the laminated board and the metal foil are high, and the prepreg, the laminated board and the laminated board covered with the metal foil have good heat resistance, dampness-heat resistance and low thermal expansion coefficient and modulus and are suitable for high-end encapsulation. The formula (I) is shown in the description.

Description

technical field [0001] The invention relates to the technical field of packages for electronic products, in particular to an epoxy-modified acrylate resin composition and prepregs, laminates and metal foil-clad laminates prepared using the same. Background technique [0002] The rapid development of smart phones, tablet computers, etc., puts forward higher requirements for packaging, high reliability, high performance, thinner, smaller, etc., high-density packaging has become a solution, such as POP packaging (package stacking technology), MCP package (multi-chip package), 2.5D&3D package (three-dimensional package). Due to the increase in packaging density, the requirements for mounting and connectivity are higher, and the low warpage of the packaging carrier (here specifically refers to the packaging substrate) is particularly important. In order to achieve low warpage, suppressing warpage through high rigidity has become a known solution. However, as the complexity of th...

AI Technical Summary

Problems solved by technology

Uneven dispersion and distribution will lead to: 1. Agglomeration of fillers, covering water and other impurities, affecting heat and humidity resistance; 2. Uneven parts of the resin composition, differences in heat resistance of different parts of the cured product, resulting in uneven internal stress , aggravate the occurrence of warping; 3. Stress concentration, the deterioration of the mechanical properties of the cured product, and at the same time have a greater impact on other properties, such as electrical properties, etc.

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