Modified polyamide acid resin slurry and preparation method thereof, and adhesive-free copper-clad plate

A technology of polyamic acid resin and copper clad laminate, applied in chemical instruments and methods, synthetic resin layered products, other household appliances, etc., can solve the problems of poor dielectric properties, environmental problems, poor dimensional stability of copper foil, etc.

Pending Publication Date: 2020-11-20
ZHONGSHAN POLYTECHNIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are several problems in the copper clad laminate made by the above method: (1) the polyamic acid resin slurry is first made into a film, and the price of the film making equipment is high, and the price of the high frequency film is higher; Existence reduces the flexibility, solder resistance, and heat resistance of the product, and leads to poor dimensional stability during copper foil etching; (3) The loss caused by the adhesive layer at high frequencies is too large, and the dielectric properties det

Method used

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  • Modified polyamide acid resin slurry and preparation method thereof, and adhesive-free copper-clad plate
  • Modified polyamide acid resin slurry and preparation method thereof, and adhesive-free copper-clad plate
  • Modified polyamide acid resin slurry and preparation method thereof, and adhesive-free copper-clad plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0092] 4,4'-biphenyldianhydride (11.77g), 2,2'-difluoro-4,4'-biphenyldianhydride (3.30g), p-phenylenediamine (3.78g), 3,3' -bis(trifluoromethyl)-4,4'-diaminobiphenyl (3.20g), 2'-trifluoromethyl-2-phenylbenzimidazole-6,4-diamine (1.40g), Porous silica (2.61g), 3-aminopropyltrimethoxysilane (1.74g) and N-methylpyrrolidone (228mL, 234.45g) were mixed, and after copolymerization and blending (room temperature, nitrogen atmosphere) for 16h, Obtain polyamic acid resin slurry;

[0093] The polyamic acid resin slurry is mixed with 4-picoline (9.31g) and acetic anhydride (12.76g) at room temperature to obtain a homogeneous mixture of polyamic acid-imidization reagent; Spread a copper foil film on the platform, then cast the above-mentioned polyamic acid-imidization reagent uniform mixture on the copper foil at a speed of 200-300mm / min, and then coat the polyamic acid resin slurry layer The copper foil is imidized, that is, the temperature is raised from 15°C to 130°C at a rate of 5-1...

Embodiment 2

[0098] 4,4'-biphenyldianhydride (11.77g), 2,2'-difluoro-4,4'-biphenyldianhydride (3.30g), p-phenylenediamine (3.24g), 3,3' -bis(trifluoromethyl)-4,4'-diaminobiphenyl (4.8g), 2'-trifluoromethyl-2-phenylbenzimidazole-6,4-diamine (1.40g), Porous silica (2.72g), 3-aminopropyltrimethoxysilane (1.82g) and N-methylpyrrolidone (239mL, 245.10g) were mixed, and after copolymerization and blending (room temperature, nitrogen atmosphere) for 16h, Obtain polyamic acid resin slurry;

[0099] The polyamic acid resin slurry is mixed with 4-picoline (9.31g) and acetic anhydride (12.76g) at room temperature to obtain a homogeneous mixture of polyamic acid-imidization reagent; Spread a copper foil film on the platform, then cast the above-mentioned polyamic acid-imidization reagent uniform mixture on the copper foil at a speed of 200-300mm / min, and then coat the polyamic acid resin slurry layer The copper foil is imidized, that is, the temperature is raised from 15°C to 130°C at a rate of 5-10...

Embodiment 3

[0104] 4,4'-biphenyl dianhydride (10.30g), 2,2'-difluoro-4,4'-biphenyl dianhydride (3.30g), pyromellitic dianhydride (1.09g), terephthalic Diamine (3.24g), 2'-trifluoromethyl-2-phenylbenzimidazole-6,4'-diamine (1.40g), 3,3'-bis(trifluoromethyl)-4, 4'-diaminobiphenyl (4.8g), porous silica (2.68g), 3-aminopropyltrimethoxysilane (1.78g) and N-methylpyrrolidone (235mL, 241.29g) were mixed for copolymerization And after blending (room temperature, nitrogen atmosphere) 16h, obtain polyamic acid resin slurry;

[0105] The polyamic acid resin slurry is mixed with 4-picoline (9.31g) and acetic anhydride (12.76g) at room temperature to obtain a homogeneous mixture of polyamic acid-imidization reagent; Spread a copper foil film on the platform, then cast the above-mentioned polyamic acid-imidization reagent uniform mixture on the copper foil at a speed of 200-300mm / min, and then coat the polyamic acid resin slurry layer The copper foil is imidized, that is, the temperature is raised fr...

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Abstract

The invention discloses a modified polyamic acid resin slurry, which has the characteristics of proper viscosity, good leveling coating performance, strong adhesion and the like, and is wide in raw material source range, low in cost and suitable for large-scale production. According to the invention, the adhesive-free copper-clad plate prepared from the modified polyamic acid resin slurry and a copper foil has excellent dielectric properties, low hygroscopicity and dimensional stability, can meet the specification requirements of a high-frequency flexible printed circuit board on a copper-cladplate, and improves the quality of the circuit board; and more importantly, an adhesive-free copper-clad plate prepared from the modified polyamide acid resin slurry and a copper foil has a great cost advantage. The invention also discloses a preparation method of the modified polyamide acid resin slurry.

Description

technical field [0001] The invention relates to the technical fields of high-frequency flexible communication materials and high-frequency flexible printed circuits, in particular to a modified polyamic acid resin slurry, a preparation method thereof, and an adhesive-free copper-clad laminate. Background technique [0002] Under 5G or high-frequency and high-speed working conditions, the reasonable selection of the circuit board transmission line dielectric material, parameter design, and structure have a decisive impact on the loss of the transmission line. The integrity and accuracy of signal transmission require the miniaturization of the transmission line dielectric material, Multi-layered, refined, and has the characteristics of low dielectric constant and low loss, and requires the substrate to have low moisture absorption characteristics. At present, the transmission medium material used in 5G communication is mainly flexible copper clad laminate (FCCL), and its base ...

Claims

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Application Information

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IPC IPC(8): C08G73/10C08K9/06C08K7/26B32B15/08B32B15/20B32B27/28B32B33/00
CPCC08G73/1067C08G73/1071C08G73/1039C08G73/1064C08G73/1085C08K9/06C08K7/26B32B15/20B32B15/08B32B33/00B32B27/281B32B2307/204B32B2307/734B32B2307/206B32B2457/08
Inventor 马鹏常赵文华彭绍鸿庄雨琪戴春桃
Owner ZHONGSHAN POLYTECHNIC
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