There is provided an epoxy compound that provides properties of cured products combining high transparency with high flexural strength by being thermally cured while maintaining advantageous handling properties in a liquid state thereof. An epoxy compound of Formula (1):
(where n1 and n2 are independently an integer of 2 to 6; n3 and n4 are individually an integer of 2; n5 and n6 are individually an integer of 1; R4-R7 are independently a hydrogen atom or a C1-10 alkyl group; and X1 is a group of Formula (2)-(4):
(where R1-R3 are independently a hydrogen atom, a C1-10 alkyl group, or the like)); and a curable composition comprising the epoxy compound and a curing agent.