32results about How to "Improve metal resistance" patented technology

A bipolar current collector separator for a fuel cell composed of a metal plate having flow channels and contact faces that come into contact with electrodes or collectors, wherein a corrosion-resistant layer such as an anodized aluminum layer and a heat-resistant polymer layer is disposed on each of the flow channels.

Coating compositions are disclosed that include corrosion resisting particles such that the coating composition can exhibit corrosion resistance properties. Also disclosed are substrates at least partially coated with a coating deposited from such a composition and multi-component composite coatings, wherein at least one coating layer is deposited from such a coating composition. Methods and apparatus for making ultrafine solid particles are also disclosed.

A process to facilitate mercury extraction from high temperature flue/fuel gas via the use of metal sorbents which capture mercury at ambient and high temperatures. The spent sorbents can be regenerated after exposure to mercury. The metal sorbents can be used as pure metals (or combinations of metals) or dispersed on an inert support to increase surface area per gram of metal sorbent. Iridium and ruthenium are effective for mercury removal from flue and smelter gases. Palladium and platinum are effective for mercury removal from fuel gas (syngas). An iridium-platinum alloy is suitable for metal capture in many industrial effluent gas streams including highly corrosive gas streams.

A semiconductor device includes a gate region, a conductive cap, and an interconnect. The gate region (e.g., a metal-gate transistor) includes a metal gate region and a high dielectric constant (high-K) gate dielectric region. The conductive cap is disposed on a surface of the metal gate region and on a surface of the high-K gate dielectric region, and the interconnect is disposed on the conductive cap. The conductive cap includes a conductive material that electrically connects the gate region to the interconnect.

Coating compositions are disclosed that include corrosion resisting particles such that the coating composition can exhibit corrosion resistance properties. Also disclosed are substrates at least partially coated with a coating deposited from such a composition and multi-component composite coatings, wherein at least one coating later is deposited from such a coating composition. Methods and apparatus for making ultrafine solid particles are also disclosed.

An apparatus is provided for making mirrors having enhanced reflective layer resistance to corrosion. The reflective layer of the mirror, typically silver, is contacted, preferably simultaneously, with a first solution containing a specific cation and a second solution containing a specific anion, or alkaline material which forms hydroxyl ions, the specific cation and specific anion or hydroxyl ion reacting to form a water insoluble precipitate on the silver surface. The mirror may then be painted to provide additional corrosion resistance to the mirror. The apparatus device for forming the precipitate eliminates the need for a device to form a copper layer on the silver surface and the device may be incorporated into existing mirror production lines as a replacement for the copper layering device. Also provided are mirrors made using the apparatus of the invention. A preferred cation containing solution contains tin (e.g., SnCl2) and a preferred anion containing solution contains hydroxyl ions (e.g, NaOH).

The present application relates to a method for enhancing metal corrosion resistance of a metal deposited on a substrate, the method comprises contacting the metal coated substrate with a treating composition comprising a film forming organic component which treating composition forms a hydrophobic film on the metal coated substrate with a thickness of less than 1 μm. Furthermore, the present application relates to a method for making a mirror comprising a substrate having a metal coated thereon, the method comprises contacting the metal coated substrate with a treating composition comprising a film forming organic component which treating composition forms a hydrophobic film on the metal coated substrate with a thickness of less than 1 μm. Preferably, the film forming organic component is selected from the group consisting of an aromatic triazole compound and a silicone resin. In addition the present application relates to the products obtainable by these methods.

In one embodiment, the invention provides a composition useful for passivating a metal surface, in particular a zinciferous surface, comprising, preferably consisting essentially of, most preferably consisting of water and:

• • (A) dissolved phosphate ions;
  • (B) dissolved trivalent chromium ions;
  • (C) dissolved anions of at least one complex fluoride of an element selected from the group consisting of Ti, Zr, Hf, Si, Sn, Al, Ge and B; preferably Ti, Si and/or Zr;
  • (D) an optional component of dissolved free fluoride ions;
  • (E) organic acid inhibitor, preferably comprising quaternary ammonium compounds; and, optionally
  • (F) a pH adjusting component; and
  • optionally organic hydroxyl acids.

Catalyst support particles and a catalyzer are produced by using γ-alumina particles or alumina precursor particles treated in advance by hydrothermal treatment in an autoclave. Performing the hydrothermal treatment improves the thermal resistance of the alumina particles because of suppressing deformation of the alumina particles when used at a high temperature such as 1000° C.

A method for fabricating a stacked package device is provided. A second substrate is adhered onto a first substrate. The first substrate includes a plurality of first bonding pads, and the second substrate includes a plurality of second bonding pads. A three-dimensional (3D) printing is performed to form an encapsulating layer covering the first substrate and the second substrate and to form a plurality of bonding wires in the encapsulating layer. Each bonding wire includes a first portion connected to one of the plurality of first bonding pads. The disclosure also provides a stacked package device formed by such a method.

To improve the performance of semiconductor devices. Over an n⁺-type semiconductor region for source/drain of an n-channel type MISFET and a first gate electrode, and over a p⁺-type semiconductor region for source/drain of a p-channel type MISFET and a second gate electrode, which are formed over a semiconductor substrate, a metal silicide layer including nickel platinum silicide is formed by a salicide process. After that, a tensile stress film is formed over the whole face of the semiconductor substrate, and then the tensile stress film over the p-channel type MISFET is removed by dry-etching, and, after a compression stress film is formed over the whole face of the semiconductor substrate, the compression stress film over the n-channel type MISFET is removed by dry-etching. The Pt concentration in the metal silicide layer is highest at the surface, and becomes lower as the depth from the surface increases.

A method of depositing a non-conductive barrier layer onto a metal surface wherein the resistance of the metal remains substantially unchanged before and after the non-conductive barrier layer deposition. The deposition process provides a low temperature processing environment so as to inhibit the formation of impurities such as silicide in the metal, wherein the silicide can adversely increase the resistance of the underlying metal.

Disclosed is a combined treatment method for improving corrosion resistance of metal component in chlorine-containing solution. First, the metal component is placed in the chlorine-containing solution. Large-area overlapping laser shock peening without an absorbing layer is used, when laser pulses are irradiated on the target metal component, the metal matrix surface absorbs the laser energy, vaporizes and expands to form a high-temperature and high-pressure plasma, a chlorine-containing passivation film is formed, to improve the surface corrosion resistance of the metal component. After that, the surface layer of the metal component is subjected to surface polishing, followed by large-area overlapping laser shock peening with an absorbing layer at room temperature, to further improve the corrosion resistance of the metal component. The combined treatment method of the present invention can be applied to improve the corrosion resistance of metal components in highly corrosive chlorine-containing environments of seawater and the like.

Autodeposition of a coating containing an epoxy resin is accomplished over a metal substrate that has been coated with a zinc phosphate conversion coating without significant removal of the zinc phosphate conversion coating.

A chromium-free aqueous treatment solution for coating metal surfaces which meets corrosion resistance, electrical contact resistance, and paint adhesion requirements set forth in MIL-DTL-81706B, Class 3. The treatment solution contains a compound of a Group IV-B element, and a vanadium ion. The solution may be inorganic and molybdate-free.

The invention provides an electronic tag. The electronic tag comprises a release paper layer, a first adhesive layer, a metal-resistant material layer, a chip layer, a second adhesive layer and a fragile paper layer which are arranged in sequence, wherein a plurality of grooves are formed in one side, opposite to the chip layer, of the metal-resistant material layer, a silicone oil layer is arranged between the groove surfaces and the chip layer, the chip layer adopts a flexible circuit board, and a processor, a patch sensor, a radio frequency circuit and a communication unit are arranged on the flexible circuit board, and the patch sensor, the radio frequency circuit and the communication unit are respectively connected with the processor. The electronic tag has a certain extended function, and is high in metal resistance and not prone to damage.