144results about How to "Adhesiveness" patented technology

An object of the invention is to satisfy all of a high-density wiring package, soldering thermal resistance, an insulating property and high-frequency transmission characteristics. The invention is a multi-layer wiring substrate having a lamination of a plurality of dielectric layers which are each provided with a wiring conductor made of a metallic foil on at least one of upper and bottom surfaces of the dielectric layer, the wiring conductors between which the dielectric layer is disposed being electrically connected with each other via a through conductor formed in the dielectric layer; on this occasion, the dielectric layers each individually are composed of a liquid crystal polymer layer and cladding layers made of a polyphenyleneether-type organic substance and formed on upper and bottom surfaces of the liquid crystal polymer layer.

A powder magnetic core having a high electrical resistivity and a high magnetic flux density, including at least a composite magnetic particle the composite magnetic particle including: a core particle containing iron as the main component; and an insulating passivation layer formed on the core particle, wherein: the insulating passivation layer at least has an inner layer formed on the core particle and the outermost layer formed on the inner layer; and the outermost layer contains iron oxide as the main component.

Provided is an optical layered body that includes a polyester base, a primer layer formed thereon, and a hard coat layer formed on the primer. The polyester has a retardation of not less than 8000 nm, and a difference (nx−ny) of 0.07 to 0.20 between a refractive index (nx) in a slow axis direction that is a high refractive index direction and a refractive index (ny) of a fast axis direction that is orthogonal to the slow axis direction, a refractive index (np) of the primer, the refractive index (nx) in the slow axis direction of the polyester, and the refractive index (ny) in the fast axis direction of the polyester satisfy ny<np<nx, and a refractive index (nh) of the hard coat, the refractive index (nx) in the slow axis direction of the polyester, and the refractive index (ny) in the fast axis direction of the polyester satisfy ny<nh<nx.

A coating material of an electron beam curable type is printed or coated onto a substrate of a heat shrinkable plastic film. Then, the coating material is cured by electron beam irradiation to form a coating layer. As a consequence, a shrinkable film including the substrate and the coating layer disposed thereon is obtained.

The invention discloses a temperature-resistant, corrosion-resistant and high-adhesion adhesive and a preparation method thereof, and belongs to the technical field of adhesives. The temperature-resistant, corrosion-resistant and high-adhesion adhesive consists of two components, i. e., an adhesive A and an adhesive B, in the weight ratio of 100:1-10, wherein the adhesive A consists of chemical plasticizing vinyl ester resin, a polymerization inhibitor, a low shrinkage agent, a free radical curing solvent, gas-phase silicon dioxide, inorganic filler, a coupling agent, a defoaming agent, color paste or paint, a promoter and a promotion additive; and the adhesive B consists of phthalic ester, peroxide and inertial powder filler. The adhesive provided by the invention has the performance of heat resistance, corrosion resistance, penetration resistance, adhesion, positioning, impact resistance and the like, can be formed into different types at normal temperature, and medium and high temperature, is easy and convenient to operate, can bring the unique advantage of the adhesive into full play on some occasions requiring to paying attention to corrosion resistance, adhesion, heat resistance and the like, and is suitable for mutual adhesion among a continuous cellulose material, a concrete material, a metal material, stone, FRP (Fiber Reinforce Plastic), thermoplastic plastic and the like.

Center cores are formed by extrusion-molding ABS resin. Seven pieces of the center cores, which are juxtaposed to each other in the horizontal direction, are supplied by a pultruder, and reinforcing long-fibers impregnated with an unsaturated polyester resin are allowed to pass through dispersion guides and squeezing nozzles, to thus squeezing-mold a fiber-reinforced composite hollow structure having FRP made legs. A final squeezing nozzle is disposed in a cross head die through a cooling jacket, and the hollow structure thus molded is allowed to pass therethrough to be covered with the ABS resin in a state in which the outer periphery of the hollow structure is heated. The hollow structure thus covered is subjected to cooled-sizing through a plurality of horizontal and vertical pairs of rollers, and then cured in a hot curing tank. The surface covered with the ABS resin is subjected to a surface-treatment of imparting irregularities for giving an antislipping function to the surface. A thermoplastic resin-made protective cap is fitted to an end of the center core. The apparatus for manufacturing a composite hollow structure has a plurality of pairs of rotatable and heat-resisting sizing rollers. The plurality of pairs of the sizing rollers are disposed in the pultruding direction while being gradually cooled in the order from those positioned on the upstream side to those positioned on the downstream side for sizing the softened outer layer covering the outer periphery of the intermediate layer.

The semiconductor device 100 includes a multilayer wiring structure formed on the semiconductor substrate. The multilayer wiring structure includes at least a first inter layer dielectric film 120 in which interconnects 124 are formed, and at least a second inter layer dielectric film 122 in which vias 126 are formed. The multilayer wiring structure includes a circuit region 110 in which the interconnects 124 and the vias 126 are formed, a seal ring region 112 formed around the circuit region 110 and in which seal rings surrounding the circuit region 110 in order to seal the circuit region 110 are formed, and a peripheral region 114 formed around the seal ring region 112. The semiconductor device 100 further includes dummy vias 136 formed of a metal material, formed in the second interlayer dielectric film 122 at the peripheral region 114.

An aspect of the invention provides a solid electrolytic capacitor that comprises: an anode formed of a valve metal or an alloy mainly made of a valve metal; a dielectric layer formed on a surface of the anode; a first conducting polymer layer formed on the dielectric layer, the first conducting polymer layer containing a non-ionic surfactant; a second conducting polymer layer formed on the first conducting polymer layer; and a cathode layer formed on the second conducting polymer layer.

A vacuum suction head of the present invention can be applied to a large-sized liquid crystal display panel and can reliably suck an object to be sucked even if the object has undulation or flexure. The suction head has a shaft, which holds a suction pad, and gas is charged into and discharged from the suction pad through a suction hole. A casing holds the shaft through first and second springs so as to be movable in the axial direction. Since the suction pad is elastically supported by the springs, the suction pad can reliably suck the object to be sucked having undulation or flexure. The vacuum suction head can be used for a vacuum suction device and a working table.

The invention relates to a melt-processable modified polyvinyl fluoride (PVF) resin which is polymerized by vinyl fluoride, ethylene, one or more of CF2=CXY and one or more of CF2=CFRf. Reaction monomers are subjected to a copolymerization reaction under the action of an initiating agent in an aqueous phase or an emulsion, reaction temperature ranges from 40 DEG C to 100 DEG C, and reaction pressure ranges from 1 MPa to 10 MPa. According to the melt-processable modified polyvinyl fluoride resin, high-temperature performance of the PVF resin is kept, treatment temperature of the resin is reduced simultaneously, conventional melt processing can be used for processing the resin, and obtained thin-film materials have good combination properties.

A thermoplastic resin composition including a polyphenylene ether-based polymer having hydroxyl groups in its chemical structure and having 2,6-dimethylphenylene ether as a repeating unit, an isocyanate compound having a plurality of isocyanate groups in its structure; or a reaction product of the polyphenylene ether-based polymer having 2,6-dimethylphenylene ether as a repeating unit and the isocyanate compound having a plurality of isocyanate groups in its structure; and a hydrogenated styrene-based elastomer, and an adhesive film and a wiring film using the same are disclosed.

A main object of the invention is to provide a polar-group-containing cyclized rubber making it possible to improve remarkably the adhesiveness between paint and a molded product made of a nonpolar polymer such as polypropylene or polyethylene, and a process for producing the same. In order to attain the object, the invention provides a polar-group-containing cyclized rubber which has a polar group at a terminal of a polymer chain thereof, has a weight-average molecular weight of 1,000 to 1,000,000, and is obtained by cyclizing a conjugated diene polymer having the polar group at a terminal of a polymer chain thereof.

Solid electrolytic capacitors are provided with decreased equivalent series resistance (ESR). The solid electrolytic capacitors include: an anode containing a valve metal or an alloy that is mainly made of a valve metal; a dielectric layer formed on a surface of the anode; an electrolyte layer formed on the dielectric layer; a carbon layer formed on the electrolyte layer; and a silver paste layer formed on the carbon layer, wherein the silver paste layer contains a nonionic surfactant.

This invention relates to a pneumatic tire provided at its bead portion with a rubber chafer (4) and covered at its inner surface with an innerliner (5), wherein a toe rubber (6) is further arranged on a toe end part of the bead portion so as to overlap with the rubber chafer (4) and the innerliner (5) and locate at least outside the innerliner (5) at the overlapped portion with the innerliner (5), and a rubber composition A containing at least one of butyl rubber and halogenated butyl rubber as 20-40 mass % of a rubber component is used in the toe rubber (6).

The present invention provides a method of producing an elliptically polarizing plate including the steps of: forming a first birefringent layer on a surface of a transparent protective film; laminating a polarizer on a surface of the transparent protective film; forming a second birefringent layer on a surface of the first birefringent layer; and forming a third birefringent layer on a surface of the second birefringent layer. The first birefringent layer is arranged on the opposite side against the polarizer with respect to the transparent protective film. The step of forming the first birefringent layer includes the steps of: applying a liquid crystal material onto a substrate subjected to an alignment treatment; treating the applied liquid crystal material, so as to form the first birefringent layer on the substrate; and transferring the first birefringent layer onto a surface of the transparent protective film.

To provide a dielectric-layer-provided copper foil or the like for extremely improving the product yield while making the most use of the increase effect of an electric capacity of a thin dielectric layer using the sputtering vapor deposition method.

In the case of dielectric-layer-provided copper foils respectively having a dielectric layer on one side of a copper foil, the dielectric layer 6 is an inorganic-oxide sputter film having a thickness of 1.0 μm or less and formed on the one side of the copper foil in accordance with the sputtering vapor deposition method and the dielectric-layer-provided copper foils for respectively forming a capacitor layer, characterized in that a pit-like defective portion generated on the inorganic-oxide sputter film is sealed by polyimide resin are used.