34results about How to "High Density Wiring" patented technology

An object of the invention is to satisfy all of a high-density wiring package, soldering thermal resistance, an insulating property and high-frequency transmission characteristics. The invention is a multi-layer wiring substrate having a lamination of a plurality of dielectric layers which are each provided with a wiring conductor made of a metallic foil on at least one of upper and bottom surfaces of the dielectric layer, the wiring conductors between which the dielectric layer is disposed being electrically connected with each other via a through conductor formed in the dielectric layer; on this occasion, the dielectric layers each individually are composed of a liquid crystal polymer layer and cladding layers made of a polyphenyleneether-type organic substance and formed on upper and bottom surfaces of the liquid crystal polymer layer.

It is an object of the present invention to provide a wiring board having high-density wiring with a controlled shape without masking by a resist film and a production method thereof. In the present invention, the production method of a wiring board having copper wiring on an insulating substrate includes the steps of forming a metal seed layer on the insulating substrate, the metal seed layer having a roughened shape in a portion on which the copper wiring or a bump is to be formed, and forming an electroplated film of copper or an alloy of copper through electroplating on the portion of the metal seed layer having the roughened shape. A substance for suppressing the plating reaction is added to a plating bath to provide an angle of 90 degrees or smaller between a surface of the insulating substrate and a side of the electroplated film.

The wiring substrate comprises: a recess section and a projecting section formed on at least one surface of the wiring substrate; and wires formed on both the recess section and the projecting section.

A hinge board having a hinge bending part and a rigid part includes: not less than two flexible wiring boards including a polyimide sheet layer, a conductor layer having a circuit formed on both sides or one side of the polyimide sheet layer, and a coverlay film layer covering the conductor layer; and a bonding material for bonding the flexible wiring boards. At least one of the flexible wiring boards is a flexible double-sided wiring board including the conductor layers on both sides of the polyimide sheet layer. Moreover, the flexible wiring boards are bonded to each other in the rigid part by use of the bonding material in such a manner that a space part is formed between the flexible wiring boards in the hinge bending part.

There are provided a substrate mounted with a photoelectric hybrid circuit having an optical path conversion mirror structure and optical waveguide wiring by reducing the number of parts and the number of fabrication steps, as well as most effectively implement high-density wiring for an optical connection between the optical waveguide and the photoelectric conversion element or optical waveguide array connector that are formed on the substrate, and a device. An optical waveguide layer 12 stacked on a substrate 10 and formed of a wiring core surrounded by a clad layer 11, and cores 15, 16 having tapered surfaces intersecting the respective wiring cores 13, 14 of the optical waveguide layer 12 perpendicularly are arranged, the tapered surfaces 15a, 16a of the cores 15, 16 having tapered surfaces are buried respectively in the wiring portion cores intersecting perpendicularly, and a first core 13 for turning the optical path of light propagating through the wiring portion core at the first core 15 with a tapered surface, and a second core 14 for turning the optical path of light passed through the first core 15 with a tapered surface at the second core 16 with a tapered surface are arranged alternately.

A multilayer flexible wired circuit board that can provide high density wiring and also can provide reduction in thickness and size, and a producing method thereof. A four-layered flexible wired circuit board is produced by preparing a double-sided substrate in which a first conductor layer and a second conductor layer are laminated on both sides of a first insulating layer; preparing a first single-sided substrate in which a third conductor layer is laminated on one surface of a second insulating layer and a second single-sided substrate in which a fourth conductor layer is laminated on one surface of a third insulating layer; bonding the first conductor layer and the third conductor layer to each other through a first thermosetting adhesive layer; and bonding the second conductor layer and the fourth conductor layer to each other through a second thermosetting adhesive layer.

To provide a method of producing a multilayer printed wiring board that can be intended to have low-profile, light-weight and high-density wiring of a printed wiring board, and a multilayer printed wiring board produced by the method of producing a multilayer printed wiring board, the double-sided substrate is produced by the steps of forming an insulating resin layer on a metal foil; of forming a via hole in the insulating resin layer; of forming a first circuit pattern on the insulating resin layer and forming a conductive layer in the via hole, by plating; and of etching the metal foil to form it into a second circuit pattern. The produced double-sided substrate is used as a core substrate for producing multilayer printed wiring board by a laminate-en-bloc or a build-up method.

A technical object of the present invention is to devise a glass substrate that is suitable for supporting a substrate to be processed to be subjected to high-density wiring and enables correct recognition of production information and the like, and a laminate using the glass substrate. In order to achieve the technical object, the glass substrate of the present invention has a total thickness variation of less than 2.0 μm and includes an information identification part formed of a plurality of dots.

Electric conductor patterns having inner leads arranged at a pitch of not larger than 60 μm are formed on a front surface of an insulating layer of a tape carrier for TAB. A reinforcing layer of stainless steel foil is formed on a rear surface of the insulating layer so as to be extend along a lengthwise direction at opposite side edge portions in a widthwise direction of the insulating layer. Accordingly, both dimensional accuracy and positional accuracy can be improved at the time of carrying the tape carrier for TAB or at the time of mounting and bonding electronic parts though the insulating layer can be formed so as to be thin.

A technical object of the present invention is to devise a glass sheet that facilitates position alignment with a substrate to be processed and is less liable to be broken during conveyance, or processing treatment of the substrate to be processed, to thereby contribute to an increase in density of a semiconductor package. In order to achieve the technical object, the glass sheet of the present invention includes, in a contour thereof: a contour portion; and a position alignment portion, in which all or part of an end edge region of the position alignment portion where a surface thereof and an end surface thereof intersect is chamfered.

In a package for a semiconductor device, a core substrate has two metal plates, each of which includes a first through hole, a second through hole, a projection, and an insulating layer formed on its surface. The metal plates are stacked in a manner that the projections of the mutual metal plates enter the second through hole of the metal plate on a partner side, and the first through holes of the metal plates form a through hole penetrating the core substrate. A tip end of each of the projections of the metal plates is exposed to a surface of the metal plate on the partner side to form a first terminal portion, and a second terminal portion is exposed from the insulating layer and formed on a surface of the metal plate on a side where the first terminal portion of the metal plate on the partner side is exposed.

A bonding structure comprising bonding wires having a diameter A, bonding pads to which the bonding wires are connected, and bonding portions which, as sites of connection, are arranged on a straight line, and wherein the pitch P of the bonding portions is set at XA+σ or more where 1.80≦X≦2.1, A is as defined above, and σ denotes a variation for the bonding procedure.

Disclosed herein is a printed circuit board, including: a dielectric substrate having a ground surface; a plurality of pads formed on the dielectric substrate; a transmission line transmitting a signal between the plurality of pads; and slots formed in partial regions of the ground surface correspondingly to the pads, thereby to improve signal transmitting characteristics and allow high-density wiring and thin thickness.