Halogen-free high heat-conducting resin composition and resin coated copper foil

A resin composition and high thermal conductivity technology, applied in the field of resin-coated copper foil, can solve the problems of not mentioning the application of glue-coated copper foil, not having high thermal conductivity, complicated operation, etc., achieving good reliability, high thermal conductivity, The effect of high heat resistance and peel strength

Inactive Publication Date: 2010-08-04
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The patent application No. 200710028539.8 discloses a halogen-free resin composition and its application to resin-coated copper foil. Although it is good in heat resistance and flame retardancy, it does not have high thermal conductivity.
The patent application with application number 200310121169.4 discloses a high thermal conductivity, halogen-free and phosphorus-free flame-retardant resin composition for printed circuit boards. Although it can achieve high thermal conductivity, it uses nitrogen-containing resins to ensure flame retardancy, because nitrogen-containing resins are prone to produce toxic cyanide or NO2, etc., so there is still room for improvement. At the same time, heating is required in the synthesis process, and the operation is complicated, and its patent does not mention the application of glued copper foil.

Method used

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  • Halogen-free high heat-conducting resin composition and resin coated copper foil
  • Halogen-free high heat-conducting resin composition and resin coated copper foil
  • Halogen-free high heat-conducting resin composition and resin coated copper foil

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] 1. Dissolve 3 parts of amine curing agent and 2 parts of accelerator (2-MI) with an appropriate amount of dimethylformamide (DMF) and butanone (MEK) mixed solvent (1:1), and stir for more than 60 minutes .

[0054] 2. Then add phosphorus-containing epoxy resin, phenolic resin, UV-blocking multifunctional epoxy resin, and pre-treated alumina preform in a solid weight ratio of 30:15:5:50, and stir for more than 4 hours. Mix well and evenly to form a halogen-free high thermal conductivity resin composition with a solid content of 70%.

[0055] Coat the above resin composition on the roughened surface of the electrolytic copper foil with a nominal thickness of 35 microns, dry it, and bake it in an oven at 150°C for 3-5 minutes to obtain a resin-coated copper foil with a resin layer in a semi-cured state .

Embodiment 2

[0057] A resin-coated copper foil was produced in the same manner as in Example 1 except that the ratios of the resin mixture and the curing accelerator used in Example 1 were changed.

[0058] 1. Dissolve 3 parts of amine curing agent and 2 parts of accelerator (2-MI) with an appropriate amount of dimethylformamide (DMF) and butanone (MEK) mixed solvent (1:1), and stir for more than 60 minutes .

[0059] 2. Then add phosphorus-containing epoxy resin, phenolic resin, UV blocking multi-functional epoxy resin, and pre-treated alumina preform in a solid weight ratio of 10:35:5:50, and stir for more than 4 hours. Mix well and evenly to form a halogen-free high thermal conductivity resin composition with a solid content of 70%.

[0060] Coat the above resin composition on the roughened surface of the electrolytic copper foil with a nominal thickness of 35 microns, dry it, and bake it in an oven at 150°C for 3-5 minutes to obtain a resin-coated copper foil with a resin layer in a s...

Embodiment 3

[0062] A resin-coated copper foil was produced in the same manner as in Example 1 except that the ratios of the resin mixture and the curing accelerator used in Example 1 were changed.

[0063] 1. Dissolve 3 parts of amine curing agent and 2 parts of accelerator (2-MI) with an appropriate amount of dimethylformamide (DMF) and butanone (MEK) mixed solvent (1:1), and stir for more than 60 minutes .

[0064] 2. Then add phosphorus-containing epoxy resin, phenolic resin, UV-blocking multifunctional epoxy resin, and pre-treated alumina preform in a solid weight ratio of 20:8:2:70, and stir for more than 4 hours. Mix well and evenly to form a halogen-free high thermal conductivity resin composition with a solid content of 70%.

[0065] Coat the above resin composition on the roughened surface of the electrolytic copper foil with a nominal thickness of 35 microns, dry it, and bake it in an oven at 150°C for 3-5 minutes to obtain a resin-coated copper foil with a resin layer in a sem...

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Abstract

The invention discloses a halogen-free high heat-conducting resin composition and a resin coated copper foil. The halogen-free high heat-conducting resin composition comprises the following components in part by mass: 10 to 40 parts of phosphoric epoxy resin, 0 to 10 parts of UV blocking multifunctional epoxy resin, 5 to 35 parts of phenoxy resin, 50 to 80 parts of high heat-conducting filler, 1 to 10 parts of amine curing agent and 0.2 to 2 parts of accelerator. The halogen-free high heat-conducting resin composition provided by the invention does not contain halogen, is environment-friendly, and has high heat resistance and peeling strength and good reliability. Moreover, the invention provides a resin coated copper foil manufactured by using the composition, which replaces a common prepreg and a common copper foil, is used for manufacturing printed circuit board materials of metal base plates, flexible plates and multilayer laminated plates, realizes higher heat conductivity, fills the domestic bank in the aspect of high heat conductance of the resin coated copper foil, provides possibility for the light, thin, short, small and multifunctional development of electronic products, and can realize a high-performance material with high-density wire arrangement, thin shape, superfine aperture and high heat dissipation property.

Description

technical field [0001] The invention relates to a flame-retardant resin composition, in particular to a halogen-free high thermal conductivity resin composition and a resin-coated copper foil prepared by using the resin composition. Background technique [0002] With the mass production of electronic information products and the design trend towards light, thin, small and multi-functional, the printed circuit substrate, which is the main support of electronic components, is also continuously improving its technical level to provide high-density wiring, thin shape, micro-aperture, High heat dissipation. [0003] Halogen-free high thermal conductivity resin-coated copper foil is an important raw material used in copper clad laminates and printed circuit boards in the electronics industry. It is different from ordinary prepregs. The resin coating of halogen-free high thermal conductivity resin-coated copper foil does not use glass fiber, does not contain halogen, and is easy t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L63/02C08L71/08C08K3/28C08K3/38C08K3/22C08K3/08C08K3/04B32B15/092B32B15/20H05K1/02
Inventor 佘乃东辜信实
Owner GUANGDONG SHENGYI SCI TECH
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