Method for mfg. multilayer printed wiring board and multilayer printed wiring board thereby

A multi-layer printing and circuit board technology, which is applied in the fields of printed circuit manufacturing, multi-layer circuit manufacturing, printed circuit, etc., can solve problems such as difficulty in providing chips

Inactive Publication Date: 2002-05-01
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, even the synthesis method is still difficult to provide low profile, light weight and high density wiring chips

Method used

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  • Method for mfg. multilayer printed wiring board and multilayer printed wiring board thereby
  • Method for mfg. multilayer printed wiring board and multilayer printed wiring board thereby
  • Method for mfg. multilayer printed wiring board and multilayer printed wiring board thereby

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0084] (manufacturing of double-sided substrates)

[0085] First, a rolled nickel foil (Ni-H available from Toyo Seihaku Co., Ltd.) with a thickness of 25 μm was cut to the desired size, and degreased (50ml / L-Metaclea CL-5513 available from Dai- ichiKogyo Seiyaku Co., Ltd.) at a temperature of 60°C for 2 minutes. Then rinse with water and dry. Through these steps, the nickel foil is ready, as figure 2 (a) shown. Subsequently, a photosensitive clear ink (BL-9700 available from Hitachi Chemical Co., Ltd.) was applied to one side of the nickel foil 11 by screen printing with a polyester mesh of 200 grids / inch. . Subsequently, it was placed in a desiccator at 80° C. for 40 minutes to dry. Through these steps, the insulating resin layer 12 with a thickness of about 30 microns is made, as figure 2 (b).

[0086] Next, after putting the mask in close contact with the insulating resin layer 12, use 2.7J / cm2 released from the ultra-high pressure mercury vapor lamp 2 of ultravi...

example 2

[0101] (Double-sided substrate manufacturing)

[0102] First, a rolled copper alloy foil (C-7025 available from Yamaha-Olin Metal Corporation) with a thickness of 35 micrometers was cut to the required size and degreased with a 60°C degreaser (200ml / L-OPC Acidclean 115 available from Okuno Chemical Industries Co., Ltd.) was treated for 2 minutes. Afterwards, wash with water and dry. Through these steps, the copper alloy foil 31 is prepared as Image 6 (a) shown.

[0103] Subsequently, the copper alloy foil 31 was immersed in 100 ml / L hydrochloric acid at 30° C. for 20 seconds, and then immersed in a palladium substitution plating solution (200 ml / L-ICP Accela available from Okuno Chemical Industries Co., Ltd.) at 30° C. for 3 minutes . Afterwards, wash with water. Again, it was immersed in a 60° C. electroless nickel plating solution (B-1 available from Meltex, Inc.) for 2 minutes, and then washed with water and dried. Through these steps, a nickel plating layer 32 with ...

example 3

[0118] In addition to the rolled nickel foil with a thickness of 25 microns (Ni-H is available from Toyo Seihaku Co., Ltd.), the rolled SUS304 foil with a thickness of 25 microns (SUS304H-TA is available from Toyo Seihaku Co., Ltd. .obtained) can also be used as a metal foil, the same method in Example 1 can be used to manufacture a double-sided substrate, and then the same method in Example 1 is used to manufacture a 4-layer printed wiring board by using the double-sided substrate.

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Abstract

To provide a method of producing a multilayer printed wiring board that can be intended to have low-profile, light-weight and high-density wiring of a printed wiring board, and a multilayer printed wiring board produced by the method of producing a multilayer printed wiring board, the double-sided substrate is produced by the steps of forming an insulating resin layer on a metal foil; of forming a via hole in the insulating resin layer; of forming a first circuit pattern on the insulating resin layer and forming a conductive layer in the via hole, by plating; and of etching the metal foil to form it into a second circuit pattern. The produced double-sided substrate is used as a core substrate for producing multilayer printed wiring board by a laminate-en-bloc or a build-up method.

Description

technical field [0001] The invention relates to a method for manufacturing a multilayer printed circuit board and a multilayer printed circuit board manufactured by using the method for manufacturing a multilayer printed circuit board. Background technique [0002] In general, methods of manufacturing multilayer printed wiring boards can be roughly classified into two typical methods. One is lamination integration. In this method, multiple double-sided substrates are used as core substrates, which can have prescribed circuit patterns on both sides, and are laminated and bonded on the entire prepreg through prepreg. The other is a synthesis method in which prescribed circuit patterns and insulating resin layers are sequentially formed. [0003] In the lamination method, a substrate, such as a copper-clad laminate, is formed by laminating copper foil on a fabric or glass nonwoven or aramid impregnated with epoxy or phenolic resin, which is used as a chip use. Holes formed i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/09H05K3/10H05K3/38H05K3/42H05K3/46
CPCH05K2201/09563H05K3/108H05K3/4602H05K2201/0344H05K3/4644H05K3/4623H05K3/423H05K3/388H05K2201/0355H05K2201/0394H05K1/09Y10T29/49156Y10T29/49117Y10T29/49165Y10T29/49126Y10T29/49155Y10T29/49128
Inventor 諏訪時人田中厚谷川聡藤井弘文宗和範
Owner NITTO DENKO CORP
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