155 results about "Core Particle" patented technology

The invention provides a 3D structure core particle test layout design method supporting cross-layer cascade test and single core particle self-test, and the method comprises the following steps: a, designing the test point layout of 3D stacked core particles, each layer of core particles adopting a hexagonal arrangement mode, and enabling a test PIN in one layer to be connected with six signal PINs in the same layer; and meanwhile, a vertical test channel is arranged, so that the in-layer test PIN of each layer is connected with the corresponding test PIN of the adjacent layer through a vertical interconnection structure. According to the invention, full test coverage of 3D stacking is adapted, the problem that interlayer signals are difficult to test in a 3D structure is solved through the in-layer hexagonal layout and the vertical test channel, and full-scene coverage of in-layer, interlayer and cross-core particle signals is realized.

The invention discloses a preparation method of a composite slow-release carbon source, which comprises the following steps: preparing an inner core: uniformly dry-mixing lignin powder and a quick-acting carbon source, and adding a first binder to prepare inner core particles; middle layer wrapping: alternately spraying a second binder and middle layer coating powder until the middle layer is completely wrapped to obtain double-layer particles; outer layer wrapping: alternately spraying a third binder and outer layer coating powder until the outer layer is completely wrapped to obtain three layers of particles; and spraying a biodegradable polymer solution on the surfaces of the three layers of particles to form a coating film. Through the three-layer structural design of the quick start layer, the stable maintenance layer and the long-acting guarantee layer, accurate matching of carbon source release and microbial metabolism requirements is realized. The outer-layer quick-acting carbon source quickly starts microbial activity, the middle layer provides stable and continuous carbon source supply, and the inner core ensures the tail-section treatment effect. The sequential release mechanism effectively avoids burst release waste of the carbon source, so that the utilization rate of the carbon source is greatly improved.

The embodiment of the invention provides a chip verification method, system and device and a storage medium, a chip comprises a core particle group, the core particle group is formed by coupling a plurality of core particles, and the method comprises the following steps: based on a core particle verification environment, performing a verification test on a to-be-tested designed core particle; after the core particles pass the verification test, a core particle group verification environment is generated, the core particle group verification environment comprises a plurality of core particle verification sub-environments, and the core particle verification sub-environments are obtained based on instantiation of the core particle verification environment; and based on the core particle group verification environment, carrying out verification test on a to-be-tested designed core particle group. According to the chip verification method in the embodiment of the invention, complete verification of the core particle group can be realized.

The embodiment of the invention provides a reconfigurable chip system and a reconfiguration method thereof, and electronic equipment. The reconfigurable chip system comprises a substrate; the one or more chips are arranged on the substrate and are interconnected through the substrate; wherein a first type of core particles and a second type of core particles are integrated in at least part of the chips, and the first type of core particles are different from the second type of core particles; the plurality of mode controllers are respectively arranged in the first type of core particles and the second type of core particles, and are configured to dynamically start or disable the first type of core particles and / or the second type of core particles in response to a mode configuration instruction written into the mode controllers through a bus, the bus connects the first type of core particles and the second type of core particles. By adopting the technical scheme, the first type of core particles and / or the second type of core particles can be dynamically enabled or disabled, so that the chip shows different characteristics.

The invention discloses a preparation method of a core-shell structure hard alloy with high strength and high toughness, and belongs to the technical field of hard alloys and powder metallurgy. According to the preparation method, a micro heterostructure is formed after sintering through a pre-constructed'fine grain hard core-coarse grain tough shell 'powder system, and deflection and energy dissipation are promoted during crack propagation by utilizing the performance difference and interfacial effect between the core and a matrix, so that the strength and toughness of the material are synergistically improved. The method is simple in process and low in cost, the material performance can be flexibly designed by adjusting the core particle size, the core-shell components and the core-shell proportion, and the method is suitable for tools, drilling tools, wear-resistant parts and the like with strict requirements for obdurability.

The invention relates to an electrical property testing device and an electrical property testing method of a silicon substrate chip. The device comprises a wafer-level chip to be tested and a test platform, the wafer-level chip to be tested comprises a plurality of core particles and a plurality of test areas; the core particles are connected based on interconnection lines; a metal interconnection structure is pre-buried on the core particle; each test area covers the crossed area of the four core particles; the crossed region comprises a part of metal interconnection structure; and the test platform is used for controlling the probe card to be in contact with the metal interconnection structures in the test areas to carry out an electrical test on the wafer-level chip to be tested. According to the electrical property testing device, a wafer level interconnection electrical property testing method based on a window translation mode can be realized, and a whole set of testing solution which can cover the whole wafer, can be reused and can be traced is designed aiming at the reliability problem of a cross-region interconnection structure in a large-scale photomask splicing process.

Disclosed is a modified polymer obtained by enclosing and / or grafting a non-thermosensitive polymer particle with a thermosensitive polymer, the modified polymer has a viscosity exhibiting a significant change at 40 to 90℃. Also disclosed is a polymer having a core-shell structure, wherein the core particle consists essentially of a non-thermosensitive polymer, and the shell is located on the outer surface of the core particle and consists essentially of a segment derived from a thermosensitive polymer, the polymer has a viscosity exhibiting a significant change at 40 to 90℃. Further disclosed is a method for preparing an aqueous dispersion of polymer. Still further disclosed is a coating composition comprising the above modified polymer, the above polymer, or the above aqueous dispersion of polymer, a substrate coated with the coating composition, as well as use of the modified polymer, the polymer, or the aqueous dispersion of polymer.

A method for manufacturing a perovskite quantum dot composite material that easily forms core-shell particles through a one-stage synthesis step is provided, along with the perovskite quantum dot composite material and an ink containing the perovskite quantum dot composite material. This perovskite quantum dot composite material suppresses surface defects of the perovskite quantum dots by forming an ionic crystal layer comprising halides in the shell layer and exhibits a very high PLQY (Power Level Quality). The perovskite quantum dot composite material comprises core particles and a shell layer surrounding the core particles. The core particles are composed of metal halide perovskites, and the shell layer comprises an organic halide compound with an ionic crystal structure having the same halogen composition as the core particles. The PLQY is greater than 75%, and the change in emission wavelength is less than 5 nm over a period of 10,000 minutes at room temperature.

The invention discloses a manufacturing method of a three-dimensional system chip, and the method comprises the steps: providing a first wafer which comprises first core particles; providing a second core particle; manufacturing an interconnection patch cord, wherein the interconnection patch cord is used for interconnecting the electrodes in the same first core particle and / or the electrodes among different first core particles; a bonding layer is formed on the first wafer and the second core particle, and the bonding layer exposes a partial region of the electrode or the patch cord to serve as an I / O interconnection electrode; bonding the first wafer and the second chip particle by using a bonding layer, wherein the I / O interconnection electrodes of the first wafer and the second chip particle are opposite to each other; and depositing metal on the I / O interconnection electrodes of the first wafer and the second wafer until interconnection is formed. And three-dimensional system physical integration of a plurality of heterogeneous and heterogeneous core particles is realized so as to complete electrical interconnection among all the core particles required by a system chip.

A modified metal oxide particle sol, when applied as a coating onto a substrate, is capable of having transparency, a high particle refractive index and good coat resistivity. The modified metal oxide particle sol is composed of modified metal oxide particles (iii) in which stannic oxide particles (i) having an average primary particle size of 4 to 50 nm serve as cores and are coated with metal oxide particles (ii) of at least one metal oxide selected from the group consisting of antimony oxide, stannic oxide and silicon oxide and having an average primary particle size of 1 to 10 nm, which modified metal oxide particles (iii) are dispersed in an organic solvent. The average primary particle size of the core particles (i) and the average primary particle size of the coating particles (ii) satisfy the relationshipsize of core particles(i)≥size of coating particles(ii),the ratio (total weight of metal oxides other than stannic oxide) / (weight of stannic oxide) is from 0.005 to 1.0, and the sol includes an amine (a) having a water solubility of 0.1 g / L or more and an amine (b) having a water solubility of less than 0.1 g / L.

A carrier for forming an electrophotographic image is provided. The carrier comprises a core particle and a coating layer coating the core particle. The coating layer contains chargeable particles and a dispersant. The carrier has an apparent density of from 2.0 g / cm3 or greater but less than 2.5 g / cm3.

This invention discloses a method for preparing diamond rare-earth europium (EEUR) color core particles, belonging to the field of non-metallic element materials. The method involves coating a europium oxide suspension onto a single polished silicon wafer, followed by microwave plasma chemical vapor deposition (CPCVD) to form EEUR color core particles. This method allows for the growth of EEUR color core particles on the surface of a diamond film. The absence of obvious traces of Eu₂O₃ nanoparticles on the surface of the EEUR color core particles indicates that the diamond implantation solution within the europium oxide particles rapidly forms the EEUR color core particles during CPCVD, resulting in the diamond core ultimately covering the europium oxide particles, thus forming a core-shell structure, i.e., the diamond rare-earth europium color core particles. The obtained EEUR color core particles are mostly irregularly shaped with a diameter of approximately 8 μm.

Toner for development of electrostatic latent images has a toner particle including a toner core particle and a shell layer that coats it. The toner core particle includes, at least, a binder resin and a colorant. The toner core particle contains as the binder resin a particular polyester resin having a repeating unit derived from 1,2-propanediol. The shell layer contains a alcoholic hydroxy group containing resin having one or more types of repeating unit having an alcoholic hydroxy group. The proportion of an alcoholic hydroxy group containing monomer in the alcoholic hydroxy group containing resin is 1 mass % or more. The coverage ratio of the surface of the toner core particle with the shell layer is 75% or more.

To provide a two component developer having stable transfer characteristics and positive chargeability and having excellent drum cleaning property.SOLUTION: The two component developer includes: a positively chargeable toner including: a toner mother particle including a toner core and a shell layer formed from a resin containing an acrylic resin; and an external additive adhering to a surface of the toner mother particle; and a carrier having a surface coated with a resin coating layer containing a silicone resin. The external additive includes silicone-modified acryl resin particles having a volume-average particle size of at least 40nm and no greater than 140nm. When the toner is subjected to an ultrasonic treatment in which ultrasonic vibration at a power of 100W and a frequency of 28kHz is applied for 1 minute in an aqueous dispersion liquid containing the toner and a nonionic surface active agent, the amount of the silicone-modified acryl resin particles detached and liberated from the toner base particles is 0.35 mass% or less with respect to the adhesion amount of the silicone-modified acryl resin particles before the ultrasonic treatment.SELECTED DRAWING: Figure 1

The invention discloses an electromagnetic interference virtual simulation method for a core particle integrated chip and computer equipment, and the method comprises the steps: extracting the surface current density and electrical characteristic parameters of a certain position in a first core particle model under the working frequency of a first core particle; extracting the surface current density of the same position in the first core particle model under the working frequency of the second core particle; creating a virtual interference source device model of which the working frequency is the same as that of the first core particle outside the two-time distance of the distance between the first core particle and the second core particle, enabling the virtual interference source device model to be close to the surface current density extracted under the condition of the second core particle, and obtaining a corresponding size parameter; and creating a virtual interference source device model corresponding to the size parameter, extracting the surface current density and the electrical characteristic parameter under the working frequency of the first core particle, comparing the surface current density and the electrical characteristic parameter with the condition of a single core particle, and evaluating the performance influence of the first core particle caused by electromagnetic interference. According to the invention, more accurate simulation of performance influence caused by mutual electromagnetic interference of devices with different working frequencies can be realized.

The invention relates to cerium based core-shell particles having a core of cerium oxide optionally doped with at least one metal (M) and a shell consisting of a plurality of nanoparticles of cerium oxide optionally doped with at least one metal (M′), which can be the same or different from metal (M), formed on the surface of the core particle. The invention also relates to dispersions thereof in a liquid medium, to a process for producing the same and to the use of these particles and dispersions in polishing applications such as chemical mechanical polishing.

A ferromagnetic powder composition comprising (i) soft magnetic iron-based core particles and (ii) a first coating layer that at least partially covers and is in direct contact with the surface of the core particles, the first coating layer comprising a) a general formula (K₂O). α (SiO2) β a) silicates, wherein α is the molar number of K2O, β is the molar number of SiO2, and the β / α molar ratio is in the range of 0.5 to 4.1, wherein the silicates are present in an amount of 0.02 wt% to 1.0 wt% based on the total weight of the ferromagnetic powder composition; b) optionally, particles comprising a compound of bismuth and oxygen having a Di in the range of 0.1 μm to 10 μm as measured according to ISO 13320-1. 50 c) as a dopant dissolved in silicate (a) by oxoanions or hydroxyanions. A second coating layer may be provided. Methods for producing the composition and manufacturing an object, and an object comprising the composition.

Disclosed herein is a composition comprising a core particle; and a shell; where the shell has a different composition from the core particle and is disposed on the core to form a core-shell particle; where the shell is homogeneous having a thickness of 500 micrometers or less and covers a part or the entire outer surface of the core particle; and where the shell is deposited via physical vapor deposition. Disclosed herein too is a method of producing core-shell particles, the method comprising disposing core particles on a substrate holder that lies in a vacuum chamber; applying a vibration to the substrate holder to produce a resonance in the core particles; fluidizing the core particles by virtue of the applied vibration or fluidizing the core particles in the substrate holder with a stream of.fluid; irradiating the core particles with an ion beam to etch, dope or increase surface area of the core particles; and coaling the core particles with a shell using physical vapor deposition.

The invention provides an optical engine module and a manufacturing method thereof, and relates to the technical field of semiconductors. The method comprises the following steps: firstly, providing at least one PIC sending core particle and at least one PIC receiving core particle; a first RDL layer and a metal column located on the first RDL layer are manufactured based on the first substrate; transferring the PIC sending core particle and the PIC receiving core particle to a first RDL layer; a plastic packaging layer is manufactured based on the surface of the first RDL layer; stripping the first substrate, and manufacturing a bump on the basis of one side, far away from the PIC sending core particle and the PIC receiving core particle, of the first RDL layer; manufacturing a second RDL layer based on the surface of the plastic packaging layer, wherein the second RDL layer exposes the position of the metal sacrificial layer; removing the metal sacrificial layer and exposing the groove; mounting a lens array based on the position of the groove; and finally, welding an EIC chip based on the surface of the second RDL layer. The invention has the advantage of realizing miniaturization.

The invention discloses a data processing method and device. The method comprises the following steps: monitoring whether each core particle contained in a chip meets a storage failure condition or not; determining at least one second core particle in the chip in response to the condition that the first core particle meets the storage failure condition; wherein the weight data and the activation data stored in the first core particle are at least stored in the second core particle; the second core particle and the first core particle are arranged adjacently, and / or the second core particle and the first core particle execute the same data parallel task; according to the second core particle, updating a data access path used for accessing the data stored in the first core particle; wherein the data access path is used for accessing the weight data and the activation data in the second core particle.

This application relates to the field of artificial core technology, and discloses a high-temperature and high-pressure resistant artificial core for steam-driven thermal recovery and its manufacturing method. The manufacturing method includes the following steps: thoroughly mixing core particles with a binder to obtain a mixture; molding the mixture into a square columnar core; forming a sealing layer on the outer surface of the columnar core, and installing high-temperature resistant end caps at the inlet and outlet ends of the columnar core to obtain a cemented core; allowing the cemented core to solidify; heating a liquid crystal polymer to complete melting; placing the cemented core into a mold, pouring the liquid crystal polymer into the mold, ensuring the liquid crystal polymer completely submerges the cemented core; applying a set pressure to the mold, maintaining the set pressure, cooling to a set temperature, and then unloading the pressure to completely solidify the liquid crystal polymer to form the artificial core; demolding the artificial core from the mold, and installing valves on the high-temperature resistant end caps. The artificial core produced by this method meets the temperature and pressure requirements of indoor physical simulation experiments for heavy oil thermal recovery.

The invention relates to a chip state management method and device, equipment, a storage medium and a program product. According to the method, a first type of state change conditions and a second type of state change conditions are set for each core particle in the chip, and under the condition that the state change of the core particle meets the first type of state change conditions, the state change of the core particle is determined according to the type and the use state of the core particle and the use state of the associated core particle of the core particle. Adjusting the power consumption state and the performance state of the core particle; and under the condition that the state change of the core particle meets the second type of state change conditions, adjusting the power consumption state and the performance state of the core particle according to the attribute information of the chip after the core particle is changed. According to the management method, the performance state management and the power consumption state management of the chip are carried out by combining the use state of each core particle in the chip and the use state of the associated core particle, that is, state adjustment is carried out by considering the factors that the states of the core particles influence each other, and the management effect of chip management can be improved.

To provide a technique for recovering a capacity in a deteriorated positive electrode active material and reducing a reaction resistance increased by deterioration without using a means of calcination SOLUTION: According to the technology disclosed herein, a method for producing a regenerated positive electrode active material is provided. The production method includes preparing a positive electrode active material and polishing the positive electrode active material. The positive electrode active material includes a core particle having a layered crystal structure and a coating portion having a rock salt crystal structure on a surface of the core particle. In this production method, at least a part of the coating portion is separated from the core particle by polishing. The ratio (IB / IA) between the peak intensity IA at the 8341eV of the nickel (Ni) - K absorption edge measured by XAFS analysis for the positive electrode active material before polishing and the peak intensity IB at the 8341eV of the nickel (Ni) - K absorption edge measured by XAFS analysis for the positive electrode active material after polishing is 0.7 or less.SELECTED DRAWING: None

This invention discloses a method and system for constructing a microscopic model of recycled concrete based on a three-dimensional five-phase spherical model, belonging to the field of numerical simulation technology for building materials. The method includes: constructing a co-simulation environment and creating a new mortar matrix; setting the core particle size of natural aggregate, the thickness of the old interface transition zone, the thickness of the old mortar, and the thickness of the new interface transition zone; generating single-particle aggregates and recursively calculating the outer diameter of each layer; generating random spatial coordinates that satisfy boundary constraints; placing aggregates based on a random sequential adsorption algorithm and Euclidean distance interference judgment criterion; parameterizing the effective aggregates to generate four concentric spherical geometries and marking them according to preset naming rules; repeating the placement until the target volume is reached; and automatically aggregating spherical geometries of the same medium type into an explicit selection set using naming rules. This invention solves the problems of single-dimensionality, missing microphases, and low modeling efficiency in existing technologies, achieving high-precision and automated construction of the five-phase structure of recycled concrete, providing an accurate numerical model for subsequent mechanical property and durability analysis.

The invention provides a core particle self-checking method and system based on a core particle integration technology, and the method comprises the steps: obtaining the current operation information of a chip, a core particle self-checking task and the core particle information of each core particle, and recognizing the core particle function information of each core particle based on the core particle information of each core particle; on the basis of the core particle self-inspection task, core particle self-inspection demand information of each core particle is identified, and a core particle self-inspection sequence and a core particle self-inspection time point of each core particle are generated on the basis of the current operation information and the core particle function information of each core particle; and generating a core particle auxiliary self-checking process and an auxiliary core particle corresponding to each core particle based on the core particle self-checking demand information and the core particle function information of each core particle, and generating a current multi-core particle self-checking scheme of the chip based on the core particle self-checking sequence, the core particle self-checking time point, the core particle auxiliary self-checking process and the auxiliary core particle of each core particle. By adopting the scheme, the self-checking effect on each core particle can be improved.

The invention discloses wafer thinning equipment and a wafer thinning method.The grinding structure of a grinding wheel in the wafer thinning equipment comprises a flexible combination body and a plurality of first rigid microstructures, and the multiple first rigid microstructures are arranged in the flexible combination body in a three-dimensional mode at intervals and stacked in the feeding direction of the grinding structure; and the interval spaces among the plurality of first rigid microstructures are filled with the flexible combination bodies. The thinning method adopts wafer thinning equipment and comprises the step of simultaneously increasing the feeding speed and the rotating speed of the grinding wheel. When the wafer is ground and thinned, the grinding efficiency can be improved, the surface damage of the wafer can be reduced, the surface roughness of the wafer is reduced, the surface of the wafer is smoother, and the high-precision integration requirement of core particles can be met.

Toner comprehensive Toner particles, and silica particles on a surface of the toner particles, wherein an area formed by a polyester resin and an area formed by a styrene-acrylic resin are present on the surface of the toner particles; the silica particles have a number-averaged particle diameter of 15 to 60 nm; the silica particles have a mean pore diameter of 5.0 to 20.0 nm; and The silica particles have a total pore volume of 0.20 to 1.50 cm³ 3 exhibit / g, and wherein the toner particles have a core-shell structure that includes Nuclear particles, and a shell that is formed on a surface of the nucleus particles; the core particles comprise a polyester resin; the shell contains a styrene-acrylic resin; and the area formed by the polyester resin is present on the surface of the toner particles due to the exposure of a portion of the polyester resin contained in the core particles at the surface of the toner particles.

The invention discloses an electrothermal coupling rapid simulation method for multi-core-particle packaging, and the method comprises the steps: calculating corresponding thermal resistance and thermal capacity through solving equivalent thermal parameters of each layer of structure of Chiplet packaging, and building a steady-state and transient equivalent circuit for thermal simulation based on a thermoelectric equivalent relation; compared with a traditional numerical calculation method, the calculation amount is greatly reduced, the simulation speed is increased, and the defect that a traditional thermal resistance matrix or a thermal resistance network cannot conduct transient thermal simulation is overcome. According to the method, the coupling thermal resistance between the chips is considered at the same time, and the accuracy of the model is improved under the condition that the thermal coupling effect of the chips is remarkable. Besides, the method further achieves transient coupling rapid simulation of the equivalent circuit model and the chip power consumption model by building the chip power consumption model and finally through an iteration method, and obtains transient electric heating performance of the whole time period by calculating power consumption and temperature distribution at all moments, so that the performance of the electric heating coupling system is evaluated more accurately. And the scheduling and the path of the whole system are optimized.

This disclosure relates to resin compositions for forming molded components included in semiconductor packages and semiconductor packages manufactured using the resin compositions. Example resin compositions include about 2 wt% to about 10 wt% of epoxy resin, about 2 wt% to about 10 wt% of a curing agent, about 50 wt% to about 90 wt% of filler, about 5 wt% to about 20 wt% of phase change material composite particles, and about 0 wt% to about 5 wt% of additives, wherein the phase change material composite particles include core particles having a phase change material and a shell surrounding the surface of the core particles and comprising organic or inorganic material.

The invention relates to the technical field of architectural ceramics, in particular to a bright ceramic tile with anti-skid and anti-fouling performance and a preparation method thereof.The preparation method comprises the following steps that A, ground coat is applied to the surface of a green body layer to form a ground coat layer; b, spraying the sculpture dry particles on the surface of the ground coat layer to obtain a sculpture dry particle layer; c, applying protective glaze to the surface of the carved dry particle layer to obtain a protective glaze layer; and D, drying, calcining in a kiln, and polishing to obtain the light ceramic tile with anti-skid and anti-fouling properties. Wherein the light ceramic tile with the anti-skid and anti-fouling performance is provided with holes, and the holes are formed by falling off of the inner core particles and the bridging layer of the carved dry particles. According to the bright ceramic tile with the anti-skid and anti-fouling performance and the preparation method of the bright ceramic tile, on the premise that the bright effect is guaranteed, the good anti-skid performance and anti-fouling performance are achieved, and the defects in the prior art are overcome.