Solder paste for soft brazing of aluminum and aluminum alloy and preparation method thereof

An aluminum alloy and soldering technology, applied in the field of solder paste for aluminum and aluminum alloy soldering and its preparation, can solve the problems of high soldering temperature, difficulty in soldering, and no discovery, etc. Good corrosion resistance, improved corrosion resistance, and the effect of improving overall activity

Inactive Publication Date: 2013-09-25
天津市恒固科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The brazing temperature of this solder paste is higher than 450°C, making it difficult to use for soldering in the electronics field
In the patent report applicable to aluminum alloy soldering, only the patents of solder wire and flux are limited, and there is no patent applicable to aluminum alloy soldering paste

Method used

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  • Solder paste for soft brazing of aluminum and aluminum alloy and preparation method thereof
  • Solder paste for soft brazing of aluminum and aluminum alloy and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] A solder paste for aluminum and aluminum alloy soldering, which consists of solder alloy powder and flux, wherein:

[0037] The raw material composition and weight of the solder alloy powder are: tin 15Kg, silver 1Kg, lead 84Kg;

[0038] The raw material components and weights of the flux are: 1.8Kg of zinc fluoride, 13.2Kg of tin fluoride, 70Kg of hydrofluoric acid salt of polyhydroxylamine, and 15Kg of ethylene glycol.

[0039] The above-mentioned preparation steps for the solder paste for aluminum and aluminum alloy soldering are:

[0040] (1) Preparation of solder alloy powder: Weigh tin, lead, and silver in proportion, melt them at 320-380°C to form a uniform solder alloy, and spray powder with conventional methods to obtain a solder alloy powder of less than 300 mesh.

[0041] (2) Take 80% by weight of solder alloy powder (80kg) and 20% of flux (20kg) and mix them with a mixer to make a solder paste.

[0042] The preparation method of flux in the present embodim...

Embodiment 2

[0050] A solder paste for aluminum and aluminum alloy soldering is composed of solder alloy powder and flux.

[0051] The raw material composition and weight of solder alloy powder are: tin 30Kg, silver 3Kg, lead 67Kg;

[0052] The raw material components and weights of the flux are: 0.6Kg of zinc fluoride, 3.9Kg of tin fluoride, 0.5Kg of copper fluoride, 85Kg of hydrofluoric acid salt of polyhydroxylamine, and 10Kg of ethylene glycol.

[0053]The above-mentioned preparation steps for the solder paste for aluminum and aluminum alloy soldering are:

[0054] (1) Preparation of solder alloy powder: Weigh tin, lead, and silver in proportion, melt them into a uniform solder alloy at 320-380°C, spray powder with conventional methods, and prepare solder alloy powder of less than 300 meshes;

[0055] ⑵Mix 85% solder alloy powder (85kg) with 15% flux (15kg) by weight, and stir evenly with a mixer to make a solder paste.

[0056] The preparation method of the flux of the present embod...

Embodiment 3

[0064] A kind of solder paste for aluminum and aluminum alloy soldering, same as embodiment 1 and 2, same solder alloy powder and flux two parts are made up of, wherein:

[0065] The raw material composition and weight of the solder alloy powder are: tin 16Kg, silver 2Kg, lead 82Kg;

[0066] The raw material components and weights of the flux are: 1.2Kg of zinc fluoride, 7.2Kg of tin fluoride, 1.6Kg of bismuth fluoride, 70Kg of hydrofluoric acid salt of polyhydroxylamine, and 20Kg of ethylene glycol.

[0067] (1) The preparation steps of the above-mentioned solder paste for aluminum and aluminum alloy soldering are:

[0068] Preparation of solder alloy powder: weighing tin, lead, and silver in proportion, smelting at 320-380°C to form a uniform solder alloy, spraying powder with conventional methods, and preparing solder alloy powder of less than 300 meshes;

[0069] ⑵Mix 90% solder alloy powder (90kg) and 10% flux (10kg) by weight, and stir them evenly with a mixer to make a...

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Abstract

The invention relates to a solder paste for soft brazing of aluminum and aluminum alloy and a preparation method thereof. The solder paste consists of two parts, i.e., braze alloy powder and a flux, wherein the composition of the braze alloy powder comprises the following components in percentage by weight: 15-30 percent of tin, 1-3 percent of silver and the balance of lead; the composition of the flux comprises the following components in percentage by weight: 5-15 percent of heavy metal fluoride, 65-75 percent of hydrofluoride of aminopolyether polyol and 10-25 percent of ethylene glycol. According to the solder paste and the preparation method thereof, the tin-lead-silver alloy is used as a braze for brazing the aluminum; during brazing, the silver and the aluminum in the braze react, a layer of silver-aluminum solid solution is formed on a boundary surface of the braze and the aluminum, the electrode potential difference between the aluminum and the braze is relieved, and the corrosion resistance of a brazed joint is greatly improved.

Description

technical field [0001] The invention relates to a solder paste for aluminum and aluminum alloy soldering and a preparation method thereof. The soldering of electronics, electrical appliances, heat exchanger products, etc. in the technical field can also be used for the soldering of aluminum-copper joints. Background technique [0002] Brazing is a common method in electronic technology. It is usually divided into two types: hard brazing and soft soldering: with the brazing temperature of 450°C as the boundary, the process above this temperature is called brazing, and the process below this temperature is called brazing. It is called soft soldering. Among them, due to the high process temperature, brazing has great limitations in the connection process of electronics, electrical appliances and other products; the brazing temperature of soft soldering is low, and the brazing process has a great The heat effect is small, especially suitable for brazing connections of certain p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363B23K35/40
Inventor 庄鸿寿张启运丁清峰
Owner 天津市恒固科技有限公司
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