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86 results about "Dynamic mechanical analysis" patented technology

Dynamic mechanical analysis (abbreviated DMA, also known as dynamic mechanical spectroscopy) is a technique used to study and characterize materials. It is most useful for studying the viscoelastic behavior of polymers. A sinusoidal stress is applied and the strain in the material is measured, allowing one to determine the complex modulus. The temperature of the sample or the frequency of the stress are often varied, leading to variations in the complex modulus; this approach can be used to locate the glass transition temperature of the material, as well as to identify transitions corresponding to other molecular motions.

Thermotropic crosslinking type shape memory polyurethane material and preparation method thereof

The invention discloses a thermotropic crosslinking type shape memory polyurethane material obtained by thermal crosslinking of thermoplastic polyurethane with a side-chain double bond, a bifunctional crosslinking agent and an initiator; in a bending mode, the shape fixed rate is more than or equal to 95%, and the shape recovery rate is more than or equal to 90%; in a dynamic mechanical analysis tensile mode, the shape fixed rate is more than or equal to 95%, and the shape recovery rate is more than or equal to 90%. A preparation method disclosed by the invention is a second-step method and comprises the steps: firstly preparing the thermoplastic polyurethane with the side-chain double bond, then carrying out melting mixing or solution mixing with the bifunctional crosslinking agent under a condition with addition of the initiator, and carrying out thermal crosslinking to prepare the product. The polyurethane material disclosed by the invention has excellent shape memory properties and mechanical properties, the transition temperature is close to a body temperature, and the raw materials have good biological compatibility and no toxicity and can be degraded; the polyurethane material can be used as in-vivo implant materials and clinical surgical materials, also can be used for wire and cable casings and building pipe connecting sleeves, moreover, can be used for buffer sole protection devices, deformation toys and the like, and is suitable for large-scale industrialized production.
Owner:眉山尤博瑞新材料有限公司

Epoxide resin based piezoelectric damping composite material and method for preparing the same

The invention discloses an epoxide resin based piezoelectricity damping composite material and a preparation method thereof. The composite material consists of piezoelectric ceramics, graphitized carbon black and epoxide resins, wherein the components are integrated into one whole body by the secondary casting; the introduced piezoelectric ceramics is centralized on the upper part and the lower part of the composite material respectively, naturally settled in the process of forming and finally forms a sandwich structure with graded distribution. The invention utilizes the secondary casting forming process to prepare the epoxide resin based piezoelectricity damping composite material with the gradient sandwich structure, on the basis of realizing the piezoelectricity damping by the three-phase cooperation effect, the composite material also has the advantages of the sandwich structure, thereby greatly improving the damping performance of the composite material; through the dynamic mechanical analysis of a sample, the max. damping factor (tan delta max) is increased by more than 20 percent, the damping temperature zone delta T (the temperature zone where tan delta is more than 0.3)) is increased by more than 33 percent, and the area TA included under the tan delta-T curve is increased by more than 19 percent.
Owner:WUHAN UNIV OF TECH

Prediction method for temperature distribution and warping deformation in selective laser melting process

The invention discloses a prediction method for temperature distribution and warping deformation in a selective laser melting process. The method is mainly composed of thermal analysis and mechanicalanalysis. Thermal analysis comprises the steps that Step1, processing parameters are determined, and technological planning is performed; Step2, metal material heat relevant properties are acquired, and a model is established according to the dimensions of an SLM component; Step3, temperature boundary conditions are loaded; and Step4, transient analysis is performed to obtain a temperature field of the SLM component. Mechanical analysis comprises the steps that Step5, the model is modified according to material mechanical properties; and Step6, the boundary conditions are added, and the temperature field obtained through analysis in Step4 is used as a load to obtain a stress field and deformation of the component through analysis. According to the method, through thermoset coupling, thermal analysis and mechanical analysis are combined to establish a temperature and deformation prediction system, and technical support is provided for optimizing technological parameters and reducing warping deformation of the SLM component.
Owner:WUHAN UNIV OF TECH
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